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Package-on-package structures

  • US 9,209,163 B2
  • Filed: 08/13/2012
  • Issued: 12/08/2015
  • Est. Priority Date: 08/19/2011
  • Status: Active Grant
First Claim
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1. A package on package arrangement comprising:

  • a first package includinga substrate layer including (i) a top side, and (ii) a bottom side that is opposite to the top side, wherein the top side of the substrate layer defines a substantially flat surface;

    a die coupled to the bottom side of the substrate layer;

    an encapsulant covering the die;

    a ball grid array (BGA) of first solder balls in recesses of the encapsulant; and

    second solder balls melted by a non-weld process to the first solder balls in the recesses of the encapsulant, wherein the second solder balls (i) are partially in the recesses of the encapsulant and (ii) partially protrude beyond the encapsulant, wherein the portion of the second solder balls that protrudes beyond the encapsulant is substantially spherical, smooth, and void of any sharp features; and

    a second package includinga plurality of rows of third solder balls that extend (i) across the substantially flat surface of the top side of the substrate layer of the first package and (ii) over the die coupled to the bottom side of the substrate layer of the first package, wherein the second package is attached, via the plurality of rows of third solder balls, to the substantially flat surface of the top side of the substrate layer of the first package.

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