Bondable conductive ink

• US 9,210,806 B2
• Filed: 01/24/2012
• Issued: 12/08/2015
• Est. Priority Date: 06/02/2004
• Status: Expired due to Fees

• Current Assignee: Joel S. Douglas
• Original Assignee: Joel S. Douglas
• Inventors: Douglas, Joel S.
• Primary Examiner(s): Kopec, Mark
• Assistant Examiner(s): THOMAS, JAISON P
• Application Number:
  US13/356,976
• Publication Number:
  US 20120119159A1
• Time in Patent Office: 1,414 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: H01B 1/24 the conductive material comprising carbon-silicon compounds, carbon or silicon
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 2201/026 Nanotubes or nanowires
• CPC Class Codes: H05K 2201/0323 Carbon
• CPC Class Codes: H05K 2203/0285 Using ultrasound, e.g. for cleaning, soldering or wet treatment
• CPC Class Codes: H05K 3/245 Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
• CPC Class Codes: H05K 3/328 by welding
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: H05K 3/363 by soldering

Abstract

A bondable conductive ink comprising carbon nanotubes, larger diameter conductive particles having at least one dimension of at least 100 nanometers which are not carbon nanotubes, a polymer, and a solvent, and a method of producing this bondable conductive ink. The ink is highly suitable for producing circuit assemblies having non-conductive substrates upon which printed conductors, formed from the bondable conductive ink, may be easily and selectively interconnected to another circuit assembly device, and/or apparatus.

Claims

1. A cured bondable flexible printed circuit comprising:

a first conductor comprising carbon nanotubes, larger diameter conductive particles having at least one dimension of at least 100 nanometers which are not carbon nanotubes, and a cured polymer;

where said carbon nanotubes are oriented in a three-dimensional matrix with said larger diameter conductive particles in the cured polymer, and carbon nanotubes protrude from a surface of said cured polymer and;

a second conductor that is bonded to said carbon nanotubes protruding from the surface of the polymer of the first conductor.

2. The circuit of claim 1, wherein said second conductor is a printed trace or metal conductor.

3. The circuit of claim 1, wherein said bonding is by ultrasonic welding or soldering.

4. The circuit of claim 1, wherein said circuit forms an RFID antenna.

5. The circuit of claim 1, wherein said larger diameter conductive particles having at least one dimension of at least 100 nanometers which are not carbon nanotubes are selected from the group of consisting of conductive materials comprising antimony, tin oxide, platinum, carbon, silver, silver chloride, lead, amorphous carbon, platinum, Au—

Ni, Au—

Fe, Au—

Co, Au—

Ir, carbon silver-chloride, graphite, tin, silicon, indium, lead, non-metal oxides, metal oxides, conductive organic materials, conductive inorganic materials, and metals.

6. The circuit of claim 1 wherein said carbon nanotubes are selected from the group consisting of single wall carbon nanotubes, multi walled carbon nanotubes, and double walled carbon nanotubes.

7. The circuit of claim 1, wherein said cured polymer is selected from the group consisting of polyurethane, polyester, fluorinated polymer, or other polymer resin.

8. A cured bondable flexible printed circuit comprising:

a first conductor comprising carbon nanotubes, larger diameter conductive particles having at least one dimension of at least 100 nanometers which are not carbon nanotubes, and a cured polymer;

wherein said larger diameter conductive particles having at least one dimension of at least 100 nanometers which are not carbon nanotubes are selected from the group of conductive materials consisting of antimony, tin oxide, platinum, carbon, silver, silver chloride, lead, amorphous carbon, platinum, An-Ni, An-Fe, An-Co, An-Ir, carbon silver-chloride, graphite, tin, silicon, indium, lead, non-metal oxides, metal oxides, conductive organic materials, conductive inorganic materials, and metals;

wherein said carbon nanotubes are selected from the group consisting of single wall carbon nanotubes, multi walled carbon nanotubes, and double walled carbon nanotubes;

where said carbon nanotubes are oriented in a three-dimensional matrix with said larger diameter conductive particles in the cured polymer, and carbon nanotubes protrude from a surface of said cured polymer and;

a second conductor that is bonded to said carbon nanotubes protruding from the surface of the polymer of the first conductor.

9. The circuit of claim 8, wherein said second conductor is a printed trace or metal conductor.

10. The circuit of claim 8, wherein said bonding is by ultrasonic welding or soldering.

11. The circuit of claim 8, wherein said cured polymer is selected from the group consisting of polyurethane, polyester, fluorinated polymer, or other polymer resin.