Grinding wheel truing tool and manufacturing method thereof, and truing apparatus, method for manufacturing grinding wheel and wafer edge grinding apparatus using the same

• US 9,211,631 B2
• Filed: 04/09/2012
• Issued: 12/15/2015
• Est. Priority Date: 12/14/2007
• Status: Active Grant

• Current Assignee: Siltron Inc. (SK Inc.)
• Original Assignee: Siltron Inc. (SK Inc.)
• Inventors: Kim, Yong-Dug, Yong, Mun-Suk, Jung, Hwan-Yun, Lee, Kyung-Moo, Hyun, Dong-Hwan, Kim, Jae-Young, Cho, Gye-Je
• Primary Examiner(s): Ali, Mohammad
• Assistant Examiner(s): Laughlin, Nathan L
• Application Number:
  US13/442,584
• Publication Number:
  US 20120233930A1
• Time in Patent Office: 1,345 Days
• Field of Search: 700/96, 700/164, 700/182
• US Class Current: 1/1
• CPC Class Codes: B24B 53/07 by means of forming tools having a shape complementary to that to be produced, e.g. blocks, profile rolls
• CPC Class Codes: B24B 9/065 of thin, brittle parts, e.g. semiconductors, wafers
• CPC Class Codes: B24D 18/00 Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Abstract

The present invention relates to a grinding wheel truing tool, its manufacturing method, and a truing apparatus, a method for manufacturing a grinding wheel and a wafer edge grinding apparatus using the same. The grinding wheel truing tool of the present invention compensates a groove of a fine-grinding wheel for fine-grinding a wafer edge, and includes a truer having an edge of the same angle as a slanted surface of the groove of the fine-grinding wheel and a cross-sectional shape corresponding to a cross-sectional shape of the groove. The present invention uses the truing tool to easily process the groove of the grinding wheel for fine-grinding the wafer edge.

Claims

1. A method for manufacturing a truer for compensating a groove of a round fine-grinding wheel for fine-grinding a round of a wafer edge, comprising:

(a) on a three-dimensional construction program, forming a groove in the shape of an edge of a completed wafer at a portion of an outer periphery of a cylindrical subject with a shape dimension of the round fine-grinding wheel having no groove, the cylindrical subject having a central axis slanted at a predetermined angle;

(b) through computer simulation, rotating the cylindrical subject based on the central axis to expand the wafer edge-shaped groove along the outer periphery of the cylindrical subject;

(c) obtaining a shape dimension of the expanded groove as a shape dimension of an edge of the truer; and

(d) manufacturing the truer using the obtained shape dimension.

2. The method for manufacturing a truer according to claim 1,

wherein, in the step (c), the shape dimension of the edge of the truer is obtained by extending a slanted surface of the expanded groove along the slanted surface such that a thickness of the truer is larger than a width of the groove.

3. The method for manufacturing a truer according to claim 1,

wherein the step (d) manufactures the truer as a diamond wheel by electroplating or metal bonding.