SOI wafer, manufacturing method therefor, and MEMS device
First Claim
1. A method of manufacturing a SOI wafer including a support wafer grown as a single piece and an active layer wafer which are bonded together with an oxide film therebetween, each of the support wafer and the active layer wafer being a silicon wafer, the method comprising:
- forming a cavity in a first surface of the support wafer, the first surface being a bonding surface of the SOI wafer;
forming a gettering material on a surface of the support wafer on a side opposite to the first surface;
carrying out thermal oxidation of one of the support wafer and the active layer wafer;
bonding together the first surface of the support wafer and the active layer wafer; and
carrying out bonding reinforcing heat treatment with respect to the support wafer and the active layer wafer which are bonded together;
wherein the oxide film is continuous across the first surface.
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Accused Products
Abstract
In order to obtain a SOI wafer having an excellent ability of gettering metal impurities, an efficient method of manufacturing a SOI wafer, and a highly reliable MEMS device using such a SOI wafer, provided is a SOI wafer including: a support wafer (1) and an active layer wafer (6) which are bonded together with an oxide film (3) therebetween, each of the support wafer (1) and the active layer wafer (6) being a silicon wafer; a cavity (1b) formed in a bonding surface of at least one of the silicon wafers; and a gettering material (2) formed on a surface on a side opposite to the bonding surface.
8 Citations
12 Claims
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1. A method of manufacturing a SOI wafer including a support wafer grown as a single piece and an active layer wafer which are bonded together with an oxide film therebetween, each of the support wafer and the active layer wafer being a silicon wafer, the method comprising:
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forming a cavity in a first surface of the support wafer, the first surface being a bonding surface of the SOI wafer; forming a gettering material on a surface of the support wafer on a side opposite to the first surface; carrying out thermal oxidation of one of the support wafer and the active layer wafer; bonding together the first surface of the support wafer and the active layer wafer; and carrying out bonding reinforcing heat treatment with respect to the support wafer and the active layer wafer which are bonded together; wherein the oxide film is continuous across the first surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification