Systems and methods for forming MEMS assemblies incorporating getters

• US 9,212,051 B1
• Filed: 08/04/2011
• Issued: 12/15/2015
• Est. Priority Date: 08/04/2011
• Status: Active Grant

• Current Assignee: JP Morgan Chase Bank, N.A. (JP Morgan Chase & Co)
• Original Assignee: Western Digital Corporation
• Inventors: Monadgemi, Pezhman, Wang, Lei
• Primary Examiner(s): Page, Dale E
• Assistant Examiner(s): Budd, Paul
• Application Number:
  US13/198,448
• Time in Patent Office: 1,594 Days
• Field of Search: 257/419, 257/E29.324
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 2207/095 through the lid
• CPC Class Codes: B81B 7/0006 Interconnects
• CPC Class Codes: B81B 7/0038 using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 1/00277 for maintaining a controlled atmosphere inside of the cavity containing the MEMS
• CPC Class Codes: B81C 1/00285 using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: B81C 2203/0136 Growing or depositing of a covering layer
• CPC Class Codes: B81C 2203/0163 Reinforcing a cap, e.g. with ribs

Abstract

Systems and methods for forming MEMS assemblies incorporating getters are described. One such method for forming and bonding to a microelectromechanical systems (MEMS) assembly includes providing a first MEMS wafer including a metal layer on an inner surface and one or more cavities for forming a MEMS component, attaching a MEMS capping wafer, having at least one through hole via, to the inner surface of the first MEMS wafer thereby forming at least one encapsulated MEMs component within the first MEMS wafer, and bonding a wire to the metal layer through an open end of the at least one through hole via.

Claims

1. A microelectromechanical systems (MEMS) assembly comprising:

a first MEMS wafer comprising a metal layer on an inner surface and one or more cavities for forming a MEMS component;

a MEMS capping wafer attached to the metal layer of the first MEMS wafer, the MEMS capping wafer having at least one through hole via, thereby forming at least one encapsulated MEMs component within the first MEMS wafer; and

a wire bonded to the metal layer through an open end of the at least one through hole via,

wherein a first cavity of the one or more cavities comprises a first conductive pad,

wherein a second cavity of the one or more cavities comprises a second conductive pad, and

wherein each of the first and second conductive pads comprises a getter material.

2. The assembly of claim 1:

wherein the MEMS capping wafer comprises an inner surface and an outer surface, and one or more electrodes positioned along the inner surface of the MEMS capping wafer, and

wherein the one or more electrodes are attached to the metal layer of the first MEMS wafer.

3. The assembly of claim 2, wherein a first electrode of the one or more electrodes is positioned between a first through hole via of the at least one through hole via and a first cavity of the one or more cavities.

4. The assembly of claim 1, wherein the getter material comprises a metal selected from the group consisting of Ti and Cr.

5. The assembly of claim 1, wherein the MEMS assembly forms one or more accelerometers.

6. The assembly of claim 1, wherein the wire comprises a ball formed of a portion of the wire, wherein the ball is bonded to the metal layer through the open end of the at least one through hole via.

7. The assembly of claim 1:

wherein the MEMS capping wafer comprises an inner surface and an outer surface, and one or more electrodes positioned along the inner surface of the MEMS capping wafer, and

wherein the inner surface of the MEMS capping wafer comprises oxide.

8. A microelectromechanical systems (MEMS) assembly comprising:

a first MEMS wafer comprising a metal layer on an inner surface and one or more cavities for forming a MEMS component;

a MEMS capping wafer attached to the metal layer of the first MEMS wafer, the MEMS capping wafer having at least one through hole via, thereby forming at least one encapsulated MEMs component within the first MEMS wafer; and

a wire bonded to the metal layer through an open end of the at least one through hole via,

wherein the MEMS capping wafer comprises an inner surface and an outer surface, and one or more electrodes positioned along the inner surface of the MEMS capping wafer,

wherein the one or more electrodes are attached to the metal layer of the first MEMS wafer,

wherein a first electrode of the one or more electrodes is positioned between a first through hole via of the at least one through hole via and a first cavity of the one or more cavities, and

wherein a second electrode of the one or more electrodes is positioned between a second through hole via of the at least one through hole via and a second cavity of the one or more cavities.

9. The assembly of claim 8, wherein the first electrode and the second electrode are electrically isolated.