CVD reactor with gas flow virtual walls

• US 9,212,422 B2
• Filed: 08/31/2011
• Issued: 12/15/2015
• Est. Priority Date: 08/31/2011
• Status: Active Grant

• Current Assignee: Alta Devices Incorporated (He Jun Li,)
• Original Assignee: Alta Devices Incorporated (He Jun Li,)
• Inventors: Higashi, Gregg, Lerner, Alexander, Sorabji, Khurshed, Washington, Lori D.
• Primary Examiner(s): LUND, JEFFRIE ROBERT
• Application Number:
  US13/222,840
• Publication Number:
  US 20130052346A1
• Time in Patent Office: 1,567 Days
• US Class Current: 1/1
• CPC Class Codes: C23C 16/45519 Inert gas curtains
• CPC Class Codes: C23C 16/45565 Shower nozzles

Abstract

A chemical vapor deposition reactor has one or more deposition zones bounded by gas flow virtual walls, within a housing having closed walls. Each deposition zone supports chemical vapor deposition onto a substrate. Virtual walls formed of gas flows laterally surround the deposition zone, including a first gas flow of reactant gas from within the deposition zone and a second gas flow of non-reactant gas from a region laterally external to the deposition zone. The first and second gas flows are mutually pressure balanced to form the virtual walls. The virtual walls are formed by merging of gas flows at the boundary of each deposition zone. The housing has an exhaust valve to prevent pressure differences or pressure build up that would destabilize the virtual walls. Cross-contamination is reduced, between the deposition zones and the closed walls of the housing or an interior region of the housing outside the gas flow virtual walls.

Claims

1. A chemical vapor deposition reactor for film formation comprising:

a containment housing; and

a chemical vapor deposition zone inside of the containment housing;

wherein the chemical vapor deposition zone has a perimeter exhaust port with a liner at an opening thereof and is circumferentially bounded by virtual walls defined by a first radially outward gas flow of a reactant gas and a second radially inward gas flow of a non-reactant gas that merge proximate to the perimeter exhaust port to form merged gas flow exiting out through orifices in the liner of the perimeter exhaust port, the pull of the first gas flow and the second gas flow out through the exhaust port being controlled by the presence of the orifices, to avoid overshoot of the exhaust port by either gas flow and thereby to eliminate any pressure difference within the containment housing so as to maintain stability of the virtual walls.

2. The chemical vapor deposition reactor of claim 1 further comprising:

a plurality of chemical vapor deposition zones within the containment housing, each deposition zone having a reactant gas inlet showerhead circumferentially bounded by virtual walls defined by reactant gas through the showerhead flowing radially outwardly and merging with radially inward flowing non-reactant gas to form merged outflowing gas from a perimeter exhaust port surrounding each showerhead, the virtual walls supported by gas flowing into the containment housing through a housing inlet valve and balanced by gas flowing out of the containment housing through a housing exhaust valve, in a manner maintaining the stability of the virtual walls by eliminating any pressure difference within the housing.

3. The chemical vapor deposition reactor of claim 1 wherein the first gas flow is pressure balanced against the second gas flow such that the virtual walls provide mutual isolation of the chemical vapor deposition zone and an interior of the containment housing exterior to the virtual walls, with regard to contaminants.

4. The chemical vapor deposition reactor of claim 1 further comprising a tiled showerhead within the containment housing, having a plurality of showerhead tiles and defining the chemical vapor deposition zone such that each of a plurality of substrates in the chemical vapor deposition zone receives a respective portion of the reactant gas from a respective one of the showerhead tiles.

5. The chemical vapor deposition reactor of claim 1 further comprising a tiled showerhead within the containment housing, having a plurality of groups of showerhead tiles and defining the chemical vapor deposition zone or a plurality of chemical vapor deposition zones such that each of a plurality of substrates receives a respective portion of the reactant gas from a respective one of the showerhead tiles and each of a plurality of groups of substrates in the chemical vapor deposition zone receives the respective portions of the reactant gas from a respective one of the groups of showerhead tiles.

6. The chemical vapor deposition reactor of claim 1 further comprising a plurality of chemical vapor deposition zones inside of the containment housing, each chemical vapor deposition zone being circumferentially bounded by respective virtual walls formed by a merging beneath an exhaust port laterally surrounding that chemical vapor deposition zone of a flow of reactant gas outward from that chemical vapor deposition zone and a flow of non-reactant gas flowing inward toward the exhaust port, the orifices having a number, size and spacing chosen to account for pressure delta between the exhaust port and respective inward and outward gas flows, as well as viscosity, molecular weight and velocity of the respective gas flows so as to avoid overshoot and thereby maintain stability of the virtual walls.

7. The chemical vapor deposition reactor of claim 1 further comprising:

a showerhead within the containment housing, supporting the chemical vapor deposition zone and having needle tubes and a first coolant for cooling a reactant gas to a first temperature;

a heat source for heating to a second temperature at least one from a group consisting of a substrate, a susceptor and a carrier; and

a second coolant within a coolant channel of the perimeter exhaust port for maintaining the perimeter exhaust port at a third temperature, the perimeter exhaust port being heated by the heat source.

8. The chemical vapor deposition reactor of claim 1 further comprising:

a temperature controller; and

a plurality of lamps controlled individually or in groups by the temperature controller and providing optical radiation for heating a susceptor holding a substrate and heating the perimeter exhaust port.