TMR device with low magnetostriction free layer
First Claim
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1. A magnetoresistive element in a magnetic device, comprising:
- (a) a stack of layers comprised of a seed layer, anti-ferromagnetic (AFM) layer, and a pinned layer sequentially formed on a substrate;
(b) a tunnel barrier layer made of MgO on the pinned layer;
(c) a free layer having a trilayer configuration including a FeCo layer which contacts the tunnel barrier layer, a second layer that is one of FeB, CoFeB, or CoFe wherein a Fe content is unequal to a Fe content in the FeCo layer, and a third layer that is CoPNiRFeSBT wherein p is from about 5 to 90 atomic %, r is from about 5 to 20 atomic %, s is between about 5 and 90 atomic %, and t is from about 1 to 30 atomic to give a FeCo/FeB/CoPNiRFeSBT, FeCo/CoFe/CoPNiRFeSBT, FeCo/CoFeB/CoPNiRFeSBT, or FeCo/CoPNiRFeSBT/CoFeB free layer configuration, and(d) a capping layer on the free layer.
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Abstract
A high performance TMR sensor is fabricated by employing a free layer comprised of CoNiFeB or CoNiFeBM where M is V, Ti, Zr, Nb, Hf, Ta, or Mo and the M content in the alloy is <10 atomic %. The free layer may have a FeCo/FeB/CoNiFeB, FeCo/CoFe/CoNiFeB, FeCo/CoFeB/CoNiFeB, or FeCo/CoNiFeB/CoFeB configuration. A CoNiFeBM layer may be formed by co-sputtering CoB with CoNiFeM. A 15 to 30% in improvement in TMR ratio over a conventional CoFe/NiFe free layer is achieved while maintaining low Hc and RA<3 ohm-um2. The CoNiFeB or CoNiFeBM layer has a magnetostriction (λ) value between −5×10−6 and 5×10−6.
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8 Claims
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1. A magnetoresistive element in a magnetic device, comprising:
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(a) a stack of layers comprised of a seed layer, anti-ferromagnetic (AFM) layer, and a pinned layer sequentially formed on a substrate; (b) a tunnel barrier layer made of MgO on the pinned layer; (c) a free layer having a trilayer configuration including a FeCo layer which contacts the tunnel barrier layer, a second layer that is one of FeB, CoFeB, or CoFe wherein a Fe content is unequal to a Fe content in the FeCo layer, and a third layer that is CoPNiRFeSBT wherein p is from about 5 to 90 atomic %, r is from about 5 to 20 atomic %, s is between about 5 and 90 atomic %, and t is from about 1 to 30 atomic to give a FeCo/FeB/CoPNiRFeSBT, FeCo/CoFe/CoPNiRFeSBT, FeCo/CoFeB/CoPNiRFeSBT, or FeCo/CoPNiRFeSBT/CoFeB free layer configuration, and (d) a capping layer on the free layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification