IC rectangular inductor with perpendicular center and side shield traces

• US 9,214,269 B2
• Filed: 12/09/2013
• Issued: 12/15/2015
• Est. Priority Date: 12/10/2012
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Samala, Sreekiran, Barry, Daryl
• Primary Examiner(s): Lian, Mangtin
• Application Number:
  US14/101,297
• Publication Number:
  US 20140159854A1
• Time in Patent Office: 736 Days
• Field of Search: 336/84.C, 336/232, 336/200
• US Class Current: 1/1
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 2017/0046 with a conductive path having a bridge
• CPC Class Codes: H01F 2017/008 Electric or magnetic shielding of printed inductances

Abstract

An inductive device is provided, which includes a substrate, a layer having a plurality of conductive metal traces and a metal shield layer. The conductive trace has an input port, a first portion, a second portion, a third portion and an output port. The metal shield layer is disposed between the substrate and the conductive trace. Each of the plurality of conductive metal traces has a respective length and a respective width. Each of the plurality of conductive metal traces are separated from one another. Each of the plurality of conductive metal traces are disposed perpendicularly with the first portion and the third portion. The metal shield layer provides spaced shield traces substantially perpendicular with the conductive metal traces.

Claims

1. An integrated circuit comprising:

A. a semiconductor substrate having a top surface;

B. a substantially rectangular, planar, conductive metal trace above the top surface of the substrate, the conductive metal trace including first and second conductive portions substantially parallel with and spaced from one another, a third conductive portion substantially perpendicular and connecting together the first and second portions, a fourth conductive input portion connected to the first conductive portion opposite the third portion, and a fifth conductive output portion connected to the second conductive portion opposite the third portion and spaced from the fourth portion; and

C. shield traces formed spaced between the top surface of the substrate and the conductive metal trace, the shield traces being spaced from one another and the shield traces including;

a center shield portion of continuously parallel shield traces extending under, beyond, and perpendicular to the first and second conductive traces within the rectangular conductive metal trace, and

a first side shield portion of continuously parallel shield traces, the first side shield portion of traces including first and second side portions extending under, beyond, and substantially perpendicular to the first and second conductive portions and substantially parallel with the shield traces of the center shield portion, the first side shield portion of traces including third side portions extending under, beyond and substantially perpendicular to the third conductive portion, and the first side shield portion including fourth side portions connecting together the third side portions substantially parallel with the third conductive portion and outside of the rectangular conductive metal trace.

2. The integrated circuit of claim 1 in which the conductive trace has a width of substantially 36 μ

m.

3. The integrated circuit of claim 1 in which the shield traces have a width of substantially 0.88 μ

m and a spacing between shield traces of substantially 0.88 μ

m.

4. The integrated circuit of claim 1 in which the conductive metal trace is an inductor.