Very thin dielectrics for high permittivity and very low leakage capacitors and energy storing devices

• US 9,214,281 B2
• Filed: 09/19/2014
• Issued: 12/15/2015
• Est. Priority Date: 10/03/2008
• Status: Active Grant

• Current Assignee: Carver Scientific Inc.
• Original Assignee: Carver Scientific Inc.
• Inventors: Carver, David R., Carver, Robert G.
• Primary Examiner(s): McNally, Daniel
• Application Number:
  US14/490,892
• Publication Number:
  US 20150000833A1
• Time in Patent Office: 452 Days
• US Class Current: 1/1
• CPC Class Codes: H01G 13/00 Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
• CPC Class Codes: H01G 4/018 Dielectrics
• CPC Class Codes: H01G 4/04 Liquid dielectrics
• CPC Class Codes: H01G 4/18 of synthetic material, e.g. derivatives of cellulose H01G4/16 takes precedence
• CPC Class Codes: H01G 4/20 using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 H01G4/12 takes precedence
• CPC Class Codes: H01G 4/206 inorganic and synthetic material
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

Methods are disclosed for creating extremely high permittivity dielectric materials for use in capacitors and energy storage devices. High permittivity materials suspended in an organic non-conductive media matrix with enhanced properties and methods for making the same are disclosed. Organic polymers, shellac, silicone oil, and/or zein formulations are utilized to produce thin film low conductivity dielectric coatings. Transition metal salts as salt or oxide matrices are formed at low temperatures utilizing mild reducing agents.

Claims

1. A method for producing a high permittivity dielectric material for use in a capacitor, said method comprising:

creating a first solution of an inorganic ion in deionized water, wherein the inorganic ion is selected from the group consisting of

a metal ion salt in the +2, +3, +4, +5, +6, +7 oxidation state, and

an inorganic ion salt in the +3, +4, +5, +6, +7 oxidation state;

creating a second solution of organic polymer;

creating a third solution by combining said first solution and said second solution with a reductant to facilitate a reduction of said third solution while said third solution is mixed;

adding ammonium hydroxide to said third solution and mixing until a slurry is formed; and

spreading said slurry in a coating onto a first substrate.

2. The method of claim 1, further comprising removing particulate matter not dissolved into said first solution.

3. The method of claim 2, further comprising:

applying a second substrate onto said slurry opposite said first substrate; and

applying a permittivity enhancing field across said first substrate, said slurry and said second substrate, said permittivity enhancing field comprising a field selected from the group consisting of

an electric field generated by connection of a voltage source across said first substrate and said second substrate, and

a magnetic field provided by placing said first substrate, said slurry and said second substrate between magnetic north and south poles of a magnetic source.

4. The method of claim 3, wherein the strength of said electric field is greater than 100 V/cm and the strength of said magnetic field is greater than 1 Gauss.

5. A method for creating a thin coating of high permittivity dielectric material on a substrate, said method comprising:

creating and mixing a first solution comprising silicone oil and a finely ground high permittivity dielectric;

while mixing said first solution, adding a borax salt to said first solution to form a second solution;

mixing the second solution until it forms a slurry;

applying the slurry to a first substrate thereby forming a coating of the slurry on the first substrate;

heating the first substrate with the applied slurry to facilitate an increase in viscosity of said silicone oil;

after said increase in viscosity, applying a second substrate on said coating of the slurry opposite to said first substrate, said coating of the slurry being disposed between the first substrate and the second substrate; and

heat treating the coating of the slurry disposed between the first substrate and the second substrate to stabilize said finely ground high permittivity dielectric.

6. The method of claim 5, further comprising applying a permittivity enhancing field across said first substrate, said slurry and said second substrate, said permittivity enhancing field selected from the group consisting of:

an electric field generated by connection of a voltage source across said first substrate and said second substrate, and

a magnetic field provided by placing said said-first substrate, said slurry and said second substrate between magnetic north and south poles of a magnetic source.

7. The method of claim 6, wherein the strength of said electric field is greater than 100 V/cm and the strength of said magnetic field is greater than 1 Gauss.

8. A method for creating a thin coating of high permittivity dielectric material on a substrate, said method comprising:

creating a first solution comprising an organic acid and an inorganic base;

evaporating the first solution to create an organic acid inorganic base salt;

forming the organic acid inorganic base salt into a coating layer on a first substrate.

9. The method of claim 8, further comprising:

applying a second substrate onto said coating layer opposite said first substrate; and

applying a permittivity enhancing field across said first substrate, said coating layer and said second substrate, said permittivity enhancing field comprising a field selected from the group consisting of

an electric field generated by connection of a voltage source across said first substrate and said second substrate, and

a magnetic field provided by placing said first substrate, said coating layer and said second substrate between magnetic north and south poles of a magnetic source.

10. The method of claim 9, wherein the strength of said electric field is greater than 100 V/cm and the strength of said magnetic field is greater than 1 Gauss.

11. The method of claim 8, said step of forming the organic acid inorganic base salt into a coating layer comprising forming the organic acid inorganic base salt into a polymer matrix.

12. The method of claim 8, said step of forming the organic acid inorganic base salt into a coating layer comprising forming the organic acid inorganic base salt into a polymer matrix by admixing.

13. The method of claim 8, said step of forming the organic acid inorganic base salt into a coating layer comprising forming the organic acid inorganic base salt into a thin film while in a form selected from the group consisting of a pliable form and a crystalline form.

14. The method of claim 8, said organic acid comprising an acid selected from the group consisting of cysteine, taurine, carballylic acid, citric acid, glutathione, citrulline, ethylenediaminetetraacetic acid, trithiocyanuric acid, cyanuric acid, tartaric acid, salicylic acid, arginine, cystine, and succinic acid.

15. A method for producing a high permittivity dielectric material for use in a capacitor, said method comprising:

creating a first solution comprising a first substance and a dielectric material, said first substance comprising a substance selected from the group consisting of a solvent and a polymer carrier, and said dielectric material being selected from the group consisting of

(i) a material selected from the group consisting of an acid comprised of sulfur, and a compound that is comprised of sulfur and has thio (mercaptan) functionality,

(ii) a nitrogen base selected from the group consisting of a conjugated nitrogen base, a pyridine, and an aniline,

(iii) a nitrogen base and an organic acid wherein the relative permittivity is greater than 50,

(iv) a sulfur-containing adjuvant selected from the group consisting of thioureas, thiobiurets, thiouracil, mercaptans, and thiophenol,

(v) a mixture of an organic salt and a sulfur containing compound,

(vi) an organic acid and a metal selected from the group consisting of rubidium, cesium, copper, indium, gallium and silver,

(vii) an organic acid salt dielectric suspended in a polymer, and

(viii) a dielectric suspended in a polymer base comprising a polymer selected from the group consisting of polyvinyl sulfonic acid salts and derivatives of polyvinyl sulfonic acid salts;

mixing said first solution until a slurry is formed;

applying said slurry as coating onto a first substrate;

placement of a second substrate onto said slurry opposite to said first substrate thereby forming a capacitor assembly; and

setting the slurry by performing a step selected from the group consisting of curing the slurry and drying the slurry.

16. The method of claim 15, further comprising applying a permittivity enhancing field across said first substrate, said slurry and said second substrate, said permittivity enhancing field comprising a field selected from the group consisting of:

an electric field generated by connection of a voltage source across said first substrate and said second substrate, and

a magnetic field provided by placing said said-first substrate, said slurry and said second substrate between magnetic north and south poles of a magnetic source.

17. The method for of claim 16, wherein the strength of said electric field is greater than 100 V/cm and the strength of said magnetic field is greater than 1 Gauss.

18. The method of claim 15, wherein said dielectric material comprises an organic acid salt dielectric suspended in a polymer, and wherein the polymer is selected from the group consisting of an acrylic polymer, a methacrylic polymer, a methacrylic amide polymer, an acrylic amide polymer, and a cyanoacrylate polymer.