Method of making interposer package for CMOS image sensor

• US 9,214,592 B2
• Filed: 07/07/2014
• Issued: 12/15/2015
• Est. Priority Date: 11/21/2011
• Status: Active Grant

• Current Assignee: Optiz, Inc.
• Original Assignee: Optiz, Inc.
• Inventors: Oganesian, Vage
• Primary Examiner(s): SANDVIK, BENJAMIN P
• Application Number:
  US14/325,133
• Publication Number:
  US 20140322856A1
• Time in Patent Office: 526 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/18 Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

Abstract

An image sensor package and method of manufacture that includes a crystalline handler with conductive elements extending therethrough, an image sensor chip disposed in a cavity of the handler, and a transparent substrate disposed over the cavity and bonded to both the handler and image sensor chip. The transparent substrate includes conductive traces that electrically connect the sensor chip'"'"'s contact pads to the handler'"'"'s conductive elements, so that off-chip signaling is provided by the substrate'"'"'s conductive traces and the handler'"'"'s conductive elements.

Claims

1. A method of packaging a sensor chip that includes a substrate with front and back opposing surfaces, a plurality of photo detectors formed at the front surface, and a plurality of contact pads formed at the front surface which are electrically coupled to the photo detectors, the method comprising:

providing a conductive crystalline handler having opposing first and second surfaces;

forming a cavity into the first surface;

forming a plurality of conductive elements each extending from the first surface, through the crystalline handler, to the second surface, wherein for each of the conductive elements, a dielectric layer is disposed between the conductive element and the conductive crystalline handler;

providing a substrate having opposing top and bottom surfaces, wherein the substrate is optically transparent to at least one range of light wavelengths;

forming a plurality of electrically conductive traces on the bottom surface and insulated from the substrate by a compliant dielectric material that is disposed only between the plurality of electrically conductive traces and the bottom surface;

inserting the sensor chip in the cavity;

bonding the substrate to the crystalline handler and the sensor chip such that;

the substrate is disposed over the cavity,

each of the contact pads is electrically connected to at least one of the electrically conductive traces by a first conductive pad disposed between and electrically connecting the contact pad and the at least one electrically conductive traces, and

each of the electrically conductive traces is electrically connected to at least one of the conductive elements by a second conductive pad disposed between and electrically connecting the electrically conductive trace and the at least one conductive element.

2. The method of claim 1, wherein the bonding of the substrate to the sensor chip is performed before the inserting of the sensor chip in the cavity and before the bonding of the substrate to the crystalline handler.

3. The method of claim 1, wherein the inserting of the sensor chip in the cavity is performed before the bonding of the substrate to the crystalline handler and the sensor chip.

4. The method of claim 1, further comprising:

forming a plurality of surface mount interconnects each disposed over the second surface of the crystalline handler, and each electrically connected to one of the conductive elements.

5. The method of claim 1, wherein a portion of the substrate top surface disposed over the photo detectors is non-planar.

6. A method of forming a plurality of image sensor packages, comprising:

providing a conductive crystalline handler having opposing first and second surfaces;

forming a plurality of cavities into the first surface;

forming a plurality of conductive elements each extending from the first surface, through the crystalline handler, to the second surface, wherein for each of the conductive elements, a dielectric layer is disposed between the conductive element and the conductive crystalline handler;

providing a substrate having opposing top and bottom surfaces, wherein the substrate is optically transparent to at least one range of light wavelengths;

forming a plurality of electrically conductive traces on the bottom surface and insulated from the substrate by a compliant dielectric material that is disposed only between the plurality of electrically conductive traces and the bottom surface;

providing a plurality of sensor chips, wherein each of the sensor chips includes;

a substrate with front and back opposing surfaces, a plurality of photo detectors formed at the front surface, and

a plurality of contact pads formed at the front surface which are electrically coupled to the photo detectors;

inserting the sensor chips in the cavities;

bonding the substrate to the crystalline handler and the sensor chips such that;

the substrate is disposed over the cavities,

each of the contact pads is electrically connected to at least one of the electrically conductive traces by a first conductive pad disposed between and electrically connecting the contact pad and the at least one electrically conductive traces, and

each of the electrically conductive traces is electrically connected to at least one of the conductive elements by a second conductive pad disposed between and electrically connecting the electrically conductive trace and the at least one conductive element; and

cutting the crystalline handler and substrate to form separate packages each including one of the cavities and one of the sensor chips.

7. The method of claim 6, wherein the bonding of the substrate to the sensor chips is performed before the inserting of the sensor chips in the cavities and before the bonding of the substrate to the crystalline handler.

8. The method of claim 6, wherein the inserting of the sensor chips in the cavities is performed before the bonding of the substrate to the crystalline handler and the sensor chips.

9. The method of claim 6, further comprising:

forming a plurality of surface mount interconnects each disposed over the second surface of the crystalline handler, and each electrically connected to one of the conductive elements.

10. The method of claim 6, wherein portions of the substrate top surface disposed over the sensor chips is non-planar.