Methods of fabricating wafer-level flip chip device packages
First Claim
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1. A composite wafer comprising:
- a semiconductor substrate comprising a plurality of partially unsingulated chips, each chip comprising (i) a plurality of exposed electrical contact pads and (ii) a non-contact region disposed between the electrical contact pads;
a plurality of trenches extending through only a portion of a thickness of the substrate and partially singulating the chips; and
an anisotropic conductive adhesive (ACA) (i) on the semiconductor substrate, (ii) extending as a single unitary layer over the chips and trenches, and (iii) contacting the electrical contact pads and at least a portion of the non-contact region of each chip, a portion of the ACA directly overlying each of the trenches that partially singulate the chips,wherein (i) none of the electrical contact pads comprises a solder bump or a non-solder bump, and (ii) no solder bumps or non-solder bumps are disposed between the electrical contact pads and the ACA.
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Abstract
In accordance with certain embodiments, semiconductor dies are at least partially coated with a conductive adhesive prior to singulation and subsequently bonded to a substrate having electrical traces thereon.
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Citations
21 Claims
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1. A composite wafer comprising:
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a semiconductor substrate comprising a plurality of partially unsingulated chips, each chip comprising (i) a plurality of exposed electrical contact pads and (ii) a non-contact region disposed between the electrical contact pads; a plurality of trenches extending through only a portion of a thickness of the substrate and partially singulating the chips; and an anisotropic conductive adhesive (ACA) (i) on the semiconductor substrate, (ii) extending as a single unitary layer over the chips and trenches, and (iii) contacting the electrical contact pads and at least a portion of the non-contact region of each chip, a portion of the ACA directly overlying each of the trenches that partially singulate the chips, wherein (i) none of the electrical contact pads comprises a solder bump or a non-solder bump, and (ii) no solder bumps or non-solder bumps are disposed between the electrical contact pads and the ACA. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification