Connector devices, systems, and related methods for light emitter components

• US 9,215,792 B2
• Filed: 03/15/2013
• Issued: 12/15/2015
• Est. Priority Date: 03/15/2013
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Hussell, Christopher P.
• Primary Examiner(s): Green, Tracie Y
• Application Number:
  US13/839,130
• Publication Number:
  US 20140265809A1
• Time in Patent Office: 1,005 Days
• Field of Search: 313/3, 362/219, 362/217.7
• US Class Current: 1/1
• CPC Class Codes: F21K 9/27 Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
• CPC Class Codes: F21S 4/20 with light sources held by or within elongate supports
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H05K 1/00 Printed circuits
• CPC Class Codes: H05K 1/142 Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10666 Plated through-hole for surface mounting on PCB
• CPC Class Codes: H05K 3/36 Assembling printed circuits with other printed circuits H05K7/142 takes precedence
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

Connector devices and systems for light emitter components and related methods are provided. In some aspects, a connector device includes a body, at least a first trace, and a second trace. In some aspects, connector device can include multiple traces. The first and second traces can be disposed over portions of the body. In some aspects, portions of each of the first and second traces can be electrically and/or physically connectable to each of a first and a second light emitter component via an attachment material.

Claims

1. A connector device for light emitter components, the device comprising:

a body comprising a first end and a second end, wherein the first end of the body is configured to physically couple to a first light emitter board, and wherein the second end of the body is configured to physically couple to a second light emitter board for facilitating end-to-end coupling of the first light emitter board to the second light emitter board; and

at least a first trace and a second trace disposed within portions of the body;

wherein portions of each of the first and second traces are electrically and physically connectable to each of the first and second light emitter boards via an attachment material;

wherein the connector is devoid of light emitters; and

wherein the body is thinner than each of the first and the second light emitter boards to which the body is coupled.

2. The device of claim 1, wherein the body is flexible.

3. The device of claim 1, wherein the body comprises a thickness that is between approximately 50 μ

m and 150 μ

m.

4. The device of claim 1, wherein the body is substantially H-shaped.

5. The device of claim 1, wherein the body reflects light.

6. The device of claim 1, wherein the body is white.

7. The device of claim 1, wherein the body is coated with a wavelength conversion material.

8. The device of claim 7, wherein the wavelength conversion material comprises a phosphor.

9. The device of claim 1, wherein the body comprises multiple layers of material.

10. The device of claim 1, wherein the body comprises a dielectric layer of material, a conductive layer of material, and a non-metallic reflective layer of material.

11. The device of claim 10, wherein the dielectric layer of material comprises FR-4or related materials.

12. The device of claim 1, further comprising multiple traces.

13. The device of claim 1, wherein the attachment material comprises solder.

14. A method of providing a connector device for light emitter components, the method comprising:

providing a connector device, the device comprising;

a body comprising a first end and a second end, wherein the first end of the body is configured to physically couple to a first light emitter board, and wherein the second end of the body is configured to physically couple to a second light emitter board for facilitating end-to-end coupling of the first light emitter board to the second light emitter board; and

first and second traces disposed within portions of the body;

wherein portions of each of the first and second traces are electrically and physically connectable to each of the first and second light emitter boards via an attachment material; and

wherein the connector is devoid of light emitters; and

electrically connecting the connector device to the first light emitter board, wherein the body is thinner than the first light emitter board to which the body is connected.

15. The method of claim 14, wherein providing the connector device comprises providing a body that is 100 μ

m or more in thickness.

16. The method of claim 14, wherein providing the connector device comprises providing a white, reflective body.

17. The method of claim 14, further comprising coating the body with wavelength conversion material.

18. The method of claim 14, wherein providing the connector device comprises providing a multilayered body including a dielectric layer of material, an electrically conductive layer of material, and a non-metallic layer of material.

19. The method of claim 14, further comprising soldering the connector device to the first light emitter component.