Contact bumps methods of making contact bumps
First Claim
Patent Images
1. A bump connection, comprising:
- a contact pad,wherein the contact pad comprises a lateral surface;
a contact bump,wherein the contact bump is coupled to the lateral surface,wherein the contact bump comprises a hollow space between a first surface and a second surface of the contact bump,wherein the first surface faces the second surface across the hollow space,wherein at least one of the first surface or second surface comprises a side surface,wherein the side surface has a recess or a protrusion, andwherein the second surface forms an angle with a direction perpendicular to the lateral surface.
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Abstract
Contact bumps between a contact pad and a substrate can include recesses and protrusions that can mate with the material of the substrate. The irregular mating surfaces between the contact bumps and the contact pads can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards.
13 Citations
22 Claims
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1. A bump connection, comprising:
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a contact pad, wherein the contact pad comprises a lateral surface; a contact bump, wherein the contact bump is coupled to the lateral surface, wherein the contact bump comprises a hollow space between a first surface and a second surface of the contact bump, wherein the first surface faces the second surface across the hollow space, wherein at least one of the first surface or second surface comprises a side surface, wherein the side surface has a recess or a protrusion, and wherein the second surface forms an angle with a direction perpendicular to the lateral surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A bump connection, comprising:
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a contact pad, wherein the contact pad comprises a lateral surface; a contact bump, wherein the contact bump is coupled to the lateral surface, wherein the contact bump comprises a first surface and a second surface, wherein the first surface faces the second surface, wherein at least one of the first surface or second surface comprises a side surface, wherein the side surface has a recess or a protrusion, and wherein the second surface forms an angle with a direction perpendicular to the lateral surface, wherein the bump connector is configured to form a hollow chamber and a middle portion disposed in the hollow chamber, and wherein the hollow chamber and the middle portion comprises the first and second surfaces. - View Dependent Claims (10, 11)
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12. A bump connection, comprising:
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a contact pad, wherein the contact pad comprises a lateral surface; a substrate; a bump connector electrically connecting the contact pad and the substrate, wherein the bump connector is coupled to the lateral surface of the contact pad, wherein the bump connector comprises a first extended portion and a second extended portion, wherein at least one of the first and second extended portions comprises a tip and a side surface, wherein the first and second extended portions are at least partially embedded in the substrate, wherein the second extended portion at least partially surrounds the first extended portion, wherein the side surface has a recess or a protrusion, wherein the first and second extended portions are at least partially embedded in the substrate passing the recess or the protrusion, and wherein the other one of the at least one of the first or the second extended portions facing the recess or the protrusion forms an angle with a direction perpendicular to the lateral surface, which is operable to push the material of the substrate to mate with the recess or protrusion. - View Dependent Claims (13)
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14. A bump connection, comprising:
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a contact pad, wherein the contact pad comprises a lateral surface; a substrate; a bump connector electrically connecting the contact pad and the substrate, wherein the bump connector is coupled to the lateral surface of the contact pad, wherein the bump connector comprises a first extended portion and a second extended portion, wherein at least one of the first and second extended portions comprises a side surface, wherein the first and second extended portions are at least partially embedded in the substrate, wherein the second extended portion at least partially surrounds the first extended portion, wherein the side surface has a recess or a protrusion, wherein the first and second extended portions are at least partially embedded in the substrate passing the recess or the protrusion, and wherein the other one of the at least one of the first or the second extended portions facing the recess or the protrusion forms an angle with a direction perpendicular to the lateral surface, which is operable to push the material of the substrate to mate with the recess or protrusion, wherein the second extended portion forms a hollow chamber which surrounds the first extended portion. - View Dependent Claims (15, 16)
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17. A method for forming a bump interconnect between a first contact pad and a substrate, the method comprising:
pressing a bump connector on the substrate, wherein the bump connector is coupled to a lateral surface of the first contact pad, wherein the bump connector comprises a first extended portion having a first tip and a first side surface, and a second extended portion having a second tip and a second side surface, wherein the first side surface faces the second side surface, wherein the first side surface has a recess or a protrusion, wherein the second side surface forms an angle with a direction perpendicular to the lateral surface, and wherein the pressing is operable to displace the material in the substrate to interlock with the recess or protrusion of the bump connector. - View Dependent Claims (18, 19, 20, 21, 22)
Specification