Electronic device with heat dissipating electromagnetic interference shielding structures

• US 9,215,833 B2
• Filed: 03/15/2013
• Issued: 12/15/2015
• Est. Priority Date: 03/15/2013
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Dolci, Dominic E., Satterfield, Phillip S., Sinha, Vikas K.
• Primary Examiner(s): Thompson, Gregory
• Application Number:
  US13/839,903
• Publication Number:
  US 20140268578A1
• Time in Patent Office: 1,005 Days
• US Class Current: 1/1
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 7/20409 Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
• CPC Class Codes: H05K 7/20418 the radiating structures being additional and fastened onto the housing
• CPC Class Codes: H05K 7/20436 Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
• CPC Class Codes: H05K 7/205 Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] details of PCBs relating to heat transfer H05K1/0201
• CPC Class Codes: H05K 7/20854 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20863 takes precedence
• CPC Class Codes: H05K 9/0022 of components mounted on printed circuit boards [PCB] shields integrated within component packages H01L23/552; shields integrated within PCB H05K1/0218
• CPC Class Codes: H05K 9/0049 being metallic containers

Abstract

An electronic device may have a metal electromagnetic interference shielding enclosure. The enclosure may have a bottom wall, vertical sidewalls that extend upwards from the bottom wall, and a lid that covers the enclosure to define an interior cavity. Power supply components and other electrical components may be mounted within the interior cavity. A printed circuit board on which integrated circuits and other components are mounted may have an upper surface that faces the bottom wall of the enclosure and an opposing lower surface that faces a metal plate. Fence structures may be used to help shield components mounted on the printed circuit. Heat may be dissipated from components on the printed circuit into the bottom wall and into the metal plate. A plastic housing may be used to house the shielding enclosure, printed circuit board, components mounted on the printed circuit board, and the metal plate.

Claims

1. Apparatus, comprising:

a first printed circuit;

at least a first electrical component mounted on the first printed circuit;

a metal electromagnetic interference shielding enclosure having a bottom wall and vertical sidewalls that form an interior cavity in which the first electrical component and the first printed circuit are mounted;

a second printed circuit; and

at least a second electrical component mounted on the second printed circuit, wherein the second electrical component is adjacent to the bottom wall so that heat from the second electrical component dissipates through the metal electromagnetic shielding enclosure.

2. The apparatus defined in claim 1 further comprising:

at least a third electrical component mounted on the second printed circuit board, wherein the second and third electrical components are mounted on opposing sides of the second printed circuit board.

3. The apparatus defined in claim 2 further comprising a metal plate, wherein the metal plate is configured to dissipate heat from the third electrical component.

4. The apparatus defined in claim 3 further comprising:

a first thermally conductive elastomeric pad between the second electrical component and the bottom wall; and

a second thermally conductive elastomeric pad between the third electrical component and the metal plate.

5. The apparatus defined in claim 4 further comprising a plastic housing in which the metal electromagnetic interference shielding enclosure is mounted.

6. The apparatus defined in claim 5 wherein the plastic housing has first and second structures that are attached using engagement features and wherein the vertical sidewalls have grooves that are configured to accommodate at least some of the engagement features during assembly.

7. The apparatus defined in claim 1 further comprising a plastic insert in an opening in the bottom wall.

8. The apparatus defined in claim 7 further comprising metal rods that pass through the plastic insert.

9. The apparatus defined in claim 8 wherein the first printed circuit board has contacts coupled to the metal rods and wherein the second printed circuit board has contacts coupled to the metal rods.

10. The apparatus defined in claim 9 wherein the first electrical component comprises a power supply component and wherein the metal rods convey power from the first printed circuit board to the second printed circuit board.

11. The apparatus defined in claim 3 further comprising an antenna on a corner of the second printed circuit board.

12. The apparatus defined in claim 11 further comprising a corner recess in the metal plate that overlaps the antenna.

13. The apparatus defined in claim 3 further comprising a connector mounted to an edge of the second printed circuit board.

14. The apparatus defined in claim 13 wherein the metal plate has protrusions that define a recess that receives the connector.

15. The apparatus defined in claim 1 further comprising a conductive fence that is mounted to the second printed circuit board and that surrounds the second electrical component.

16. The apparatus defined in claim 3 further comprising a thermally conductive elastomeric pad between the second printed circuit board and the metal plate that conveys heat from the second electrical component through the metal plate.

17. The apparatus defined in claim 16 wherein the metal plate has a plurality of different thicknesses to accommodate electrical components of different sizes that are mounted on the second printed circuit board.

18. An electronic device, comprising:

a plastic housing;

internal structures mounted in the plastic housing, wherein the internal structures include a power supply enclosed within a metal shielding enclosure having a bottom wall, vertical sidewalls, and a lid;

a printed circuit board on which an integrated circuit is mounted; and

thermally conductive structures between the integrated circuit and the bottom wall that convey heat from the integrated circuit to the metal shielding enclosure.

19. The electronic device defined in claim 18 wherein the printed circuit board has an upper surface on which the integrated circuit is mounted and an opposing lower surface and wherein the internal structures comprise a metal plate adjacent to the lower surface.

20. The electronic device defined in claim 19 further comprising a thermally conductive elastomeric structure between the printed circuit board and the metal plate through which heat from the integrated circuit is conveyed to the metal plate.

21. Apparatus, comprising:

a metal electromagnetic signal shielding enclosure having a bottom wall, vertical sidewalls that extend upwards from the bottom wall, and a lid that encloses an interior cavity;

power supply circuitry in the interior cavity;

an integrated circuit;

a metal plate that dissipates heat from the integrated circuit; and

a printed circuit board on which the integrated circuit is mounted, wherein the printed circuit board has an upper surface that faces the bottom wall and has an opposing lower surface that faces the metal plate.

22. The apparatus defined in claim 21 wherein the integrated circuit is mounted on the upper surface and wherein the bottom wall dissipates heat from the integrated circuit.

23. The apparatus defined in claim 21 wherein the integrated circuit is mounted on the lower surface and wherein the apparatus further comprises a thermally conductive elastomeric structure that conveys heat from the integrated circuit to the metal plate.