Backlight unit with conductive film and method for manufacturing
First Claim
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1. A backlight unit, comprising:
- a light guide layer formed of a transparent substrate having shaped as a thin plate and made of chemically toughened glass with a thickness ranging from 0.1 mm to 5 mm;
a conductive transparent film made of conductive material forming a predetermined circuit pattern on the transparent substrate of the light guide layer, and having a surface resistance in the range of 4.5 ohms per square to 650 ohms per square;
a diffusion layer for scattering light from emitting surface uniformly into a planar light source and adjusting the color temperature of the planar light source, the diffusion layer having transparent resin, diffusing particles and a dye in different proportions, and having a light transmittance in the range of 30% to 98%;
an optical microstructure layer made of high refractive index, including a plurality of microstructures forming a predetermined optical microstructure pattern on the transparent substrate of the light guide layer, the optical microstructure layer being for refracting incident light;
a transparent resin layer disposed on a surface of transparent substrate and optical microstructure layer, to allow the passage of light ray not refracted by the optical microstructure layer to a reflective layer;
a reflective layer for reflecting the light ray having passed through the transparent layer to the light guide layer; and
a light source module consisting of conductive material, a plurality of light emitting diodes and flexible circuit boards, adhered and connected to the predetermined circuit pattern on the conductive film, the light source module providing an incident light source in the backlight unit.
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Abstract
A backlight unit uses conductive, chemically toughened glass as substrate and includes a diffusion layer, a light guide layer, an optical microstructure layer, a transparent layer, a reflective layer and a light source module. The integrally formed backlight unit is fabricated using photochemical lithography, printing-coating, and ultrasonic hot melt adhesion processes.
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Citations
8 Claims
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1. A backlight unit, comprising:
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a light guide layer formed of a transparent substrate having shaped as a thin plate and made of chemically toughened glass with a thickness ranging from 0.1 mm to 5 mm; a conductive transparent film made of conductive material forming a predetermined circuit pattern on the transparent substrate of the light guide layer, and having a surface resistance in the range of 4.5 ohms per square to 650 ohms per square; a diffusion layer for scattering light from emitting surface uniformly into a planar light source and adjusting the color temperature of the planar light source, the diffusion layer having transparent resin, diffusing particles and a dye in different proportions, and having a light transmittance in the range of 30% to 98%; an optical microstructure layer made of high refractive index, including a plurality of microstructures forming a predetermined optical microstructure pattern on the transparent substrate of the light guide layer, the optical microstructure layer being for refracting incident light; a transparent resin layer disposed on a surface of transparent substrate and optical microstructure layer, to allow the passage of light ray not refracted by the optical microstructure layer to a reflective layer; a reflective layer for reflecting the light ray having passed through the transparent layer to the light guide layer; and a light source module consisting of conductive material, a plurality of light emitting diodes and flexible circuit boards, adhered and connected to the predetermined circuit pattern on the conductive film, the light source module providing an incident light source in the backlight unit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification