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Die-to-die inductive communication devices and methods

  • US 9,219,028 B1
  • Filed: 12/17/2014
  • Issued: 12/22/2015
  • Est. Priority Date: 12/17/2014
  • Status: Active Grant
First Claim
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1. A packaged device comprising:

  • a first package lead;

    a second package lead;

    a first integrated circuit (IC) die having a first coil proximate to a first die surface of the first IC die, wherein the first IC die is electrically coupled to the first package lead; and

    a sub-assembly that includesa first substrate having a first substrate surface, a second substrate surface, and a first substrate bond pad that is electrically coupled to the second package lead, anda second IC die having a second coil proximate to a first die surface of the second IC die, wherein a second die surface of the second IC die is coupled to the first substrate surface, andwherein the first IC die and the second IC die are arranged within the device so that the first die surface of the first IC die faces the first die surface of the second IC die, and the first coil and the second coil are aligned with each other across a gap between the first IC die and the second IC die, and wherein the first IC die and the second IC die are galvanically isolated from each other.

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