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Low profile sensor module and method of making same

  • US 9,219,091 B2
  • Filed: 03/07/2014
  • Issued: 12/22/2015
  • Est. Priority Date: 03/12/2013
  • Status: Active Grant
First Claim
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1. An image sensor package, comprising:

  • a host substrate assembly including;

    a first substrate with opposing first and second surfaces,an aperture extending through the first substrate between the first and second surfaces,one or more circuit layers,a plurality of first contact pads electrically coupled to the one or more circuit layers;

    a sensor chip that includes;

    a second substrate with opposing first and second surfaces,a plurality of photo detectors formed on or in the second substrate and configured to receive light incident on the first surface of the second substrate, anda plurality of second contact pads formed at the first surface of the second substrate and which are electrically coupled to the photo detectors;

    a spacer mounted to the first surface of the second substrate;

    a protective substrate mounted to the spacer and disposed over the plurality of photo detectors;

    a plurality of electrical conduits each formed of electrically conductive material that extends through the spacer and is in electrical contact with one of the second contact pads; and

    electrical connectors each electrically connecting one of the first contact pads and one of the electrical conduits.

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