Low profile sensor module and method of making same

• US 9,219,091 B2
• Filed: 03/07/2014
• Issued: 12/22/2015
• Est. Priority Date: 03/12/2013
• Status: Active Grant

• Current Assignee: Optiz, Inc.
• Original Assignee: Optiz, Inc.
• Inventors: Oganesian, Vage, Lu, Zhenhua
• Primary Examiner(s): Jahan, Bilkis
• Assistant Examiner(s): QUINTO, KEVIN V
• Application Number:
  US14/200,158
• Publication Number:
  US 20140264692A1
• Time in Patent Office: 655 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/10 Bump connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements

Abstract

A host substrate assembly includes a first substrate with opposing first and second surfaces, an aperture extending therethrough, circuit layers, and first contact pads electrically coupled to the circuit layers. A sensor chip includes a second substrate with opposing first and second surfaces, a plurality of photo detectors formed on or in the second substrate and configured to receive light incident on the second substrate first surface, and a plurality of second contact pads formed at the second substrate first or second surfaces and are electrically coupled to the photo detectors. A spacer is mounted to the second substrate first surface. A protective substrate is mounted to the spacer and disposed over the photo detectors. Electrically conductive conduits each extend through the spacer and are in electrical contact with one of the second contact pads. Electrical connectors electrically connect the first contact pads and the conduits.

Claims

1. An image sensor package, comprising:

a host substrate assembly including;

a first substrate with opposing first and second surfaces,

an aperture extending through the first substrate between the first and second surfaces,

one or more circuit layers,

a plurality of first contact pads electrically coupled to the one or more circuit layers;

a sensor chip that includes;

a second substrate with opposing first and second surfaces,

a plurality of photo detectors formed on or in the second substrate and configured to receive light incident on the first surface of the second substrate, and

a plurality of second contact pads formed at the first surface of the second substrate and which are electrically coupled to the photo detectors;

a spacer mounted to the first surface of the second substrate;

a protective substrate mounted to the spacer and disposed over the plurality of photo detectors;

a plurality of electrical conduits each formed of electrically conductive material that extends through the spacer and is in electrical contact with one of the second contact pads; and

electrical connectors each electrically connecting one of the first contact pads and one of the electrical conduits.

2. The image sensor package of claim 1, wherein each of the electrical conduits has a funnel shaped cross section.

3. The image sensor package of claim 1, wherein each of the electrical conduits also extends through the protective substrate.

4. The image sensor package of claim 1, wherein the protective substrate is at least partially disposed in the aperture.

5. The image sensor package of claim 1, further comprising:

a lens module mounted to the host substrate assembly, wherein the lens module includes one or more lenses disposed for focusing light through the aperture and onto the photo detectors.

6. The image sensor package of claim 5, wherein:

the lens module is mounted to the first surface of the first substrate; and

the first contact pads are disposed at the second surface of the first substrate.

7. An image sensor package comprising:

a host substrate assembly including;

a first substrate with opposing first and second surfaces,

an aperture extending through the first substrate between the first and second surfaces,

one or more circuit layers,

a plurality of first contact pads electrically coupled to the one or more circuit layers;

a sensor chip that includes;

a second substrate with opposing first and second surfaces,

a plurality of photo detectors formed on or in the second substrate and configured to receive light incident on the first surface of the second substrate, and

a plurality of second contact pads formed at the second surface of the second substrate and which are electrically coupled to the photo detectors;

a spacer mounted to the first surface of the second substrate;

a protective substrate mounted to the spacer and disposed over the plurality of photo detectors;

a plurality of electrical conduits each formed of electrically conductive material that extends through the spacer and is in electrical contact with one of the second contact pads; and

electrical connectors each electrically connecting one of the first contact pads and one of the electrical conduits;

wherein each of the electrical conduits also extends through and is insulated from at least a portion of the second substrate, and wherein each of the electrical conduits also extends through the protective substrate.

8. The image sensor package of claim 7, further comprising:

a support substrate mounted to the second surface of the second substrate.

9. The image sensor package of claim 7, wherein the protective substrate is at least partially disposed in the aperture.

10. An image sensor package, comprising:

a host substrate assembly including;

a first substrate with opposing first and second surfaces,

an aperture extending through the first substrate between the first and second surfaces,

one or more circuit layers,

a plurality of first contact pads electrically coupled to the one or more circuit layers;

a sensor chip that includes;

a second substrate with opposing first and second surfaces,

a plurality of photo detectors formed on or in the second substrate and configured to receive light incident on the first surface of the second substrate, and

a plurality of second contact pads formed at the first surface or the second surface of the second substrate and which are electrically coupled to the photo detectors;

a protective substrate mounted to the second substrate, wherein the protective substrate includes a cavity formed into a surface thereof which is disposed over the plurality of photo detectors;

a plurality of electrical conduits each formed of electrically conductive material that extends through the protective substrate and is in electrical contact with one of the second contact pads; and

electrical connectors each electrically connecting one of the first contact pads and one of the electrical conduits.

11. The image sensor package of claim 10, further comprising:

a lens module mounted to the host substrate assembly, wherein the lens module includes one or more lenses disposed for focusing light through the aperture and onto the photo detectors.

12. The image sensor package of claim 10, wherein:

the lens module is mounted to the first surface of the first substrate; and

the first contact pads are disposed at the second surface of the first substrate.

13. The image sensor package of claim 10, wherein each of the electrical conduits has a funnel shaped cross section.

14. The image sensor package of claim 10, wherein the second contact pads are formed at the first surface of the second substrate.

15. The image sensor package of claim 10, wherein the second contact pads are formed at the second surface of the second substrate, and wherein each of the electrical conduits also extends through and is insulated from at least a portion of the second substrate.

16. The image sensor package of claim 15, further comprising:

a support substrate mounted to the second surface of the second substrate.

17. A method of forming an image sensor package, comprising:

providing a first substrate that includes opposing first and second surfaces, an aperture extending through the first substrate between the first and second surfaces, one or more circuit layers, and a plurality of first contact pads electrically coupled to the one or more circuit layers;

providing a sensor chip that includes a second substrate with opposing first and second surfaces, a plurality of photo detectors formed on or in the second substrate and configured to receive light incident on the first surface of the second substrate, and a plurality of second contact pads formed at the first surface of the second substrate and which are electrically coupled to the photo detectors;

mounting a spacer to the first surface of the second substrate;

mounting a protective substrate to the spacer wherein the protective substrate is disposed over the plurality of photo detectors;

forming a plurality of electrical conduits of electrically conductive material each of which extending through the spacer and in electrical contact with one of the second contact pads;

forming electrical connectors each electrically connecting one of the first contact pads and one of the electrical conduits.

18. The method of claim 17, further comprising:

mounting a lens module to the first substrate, wherein the lens module includes one or more lenses disposed for focusing light through the aperture and onto the photo detectors.

19. The method of claim 17, wherein the forming of the plurality of electrical conduits further comprises forming each of the electrical conduits to extend through the protective substrate.

20. A method of forming an image sensor package, comprising:

providing a first substrate that includes opposing first and second surfaces, an aperture extending through the first substrate between the first and second surfaces, one or more circuit layers, and a plurality of first contact pads electrically coupled to the one or more circuit layers;

providing a sensor chip that includes a second substrate with opposing first and second surfaces, a plurality of photo detectors formed on or in the second substrate and configured to receive light incident on the first surface of the second substrate, and a plurality of second contact pads formed at the first surface or the second surface of the second substrate and which are electrically coupled to the photo detectors;

mounting a protective substrate to the second substrate, wherein the protective substrate includes a cavity formed into a surface thereof which is disposed over the plurality of photo detectors;

forming a plurality of electrical conduits of electrically conductive material each of which extending through the protective substrate and in electrical contact with one of the second contact pads;

forming electrical connectors each electrically connecting one of the first contact pads and one of the electrical conduits.

21. The method of claim 20, further comprising:

mounting a lens module to the first substrate, wherein the lens module includes one or more lenses disposed for focusing light through the aperture and onto the photo detectors.

22. The method of claim 20, wherein the second contact pads are formed at the first surface of the second substrate.

23. The method of claim 20, wherein the second contact pads are formed at the second surface of the second substrate, and wherein the forming of the plurality of electrical conduits further comprises forming each of the electrical conduits to extend through and be insulated from at least a portion of the second substrate.