Semiconductor device and fabricating method thereof
First Claim
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1. A semiconductor device, comprising:
- a semiconductor substrate comprising a trench formed therein;
a bottom electrode formed inside the trench;
a top electrode formed inside the trench and above the bottom electrode; and
an insulating layer separating the top electrode from the bottom electrode,wherein the insulating layer has an uneven upper surface, and an additional depression having a shape of a key hole with a substantially vertical sidewall is formed in the uneven upper surface;
the top electrode has an uneven lower surface; and
the uneven lower surface of the top electrode comprises a curved surface with a protrusion in a center portion of the trench that protrudes toward the bottom electrode to fill the additional depression having the shape of the key hole.
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Abstract
A semiconductor device and a fabricating method thereof are provided, in which the semiconductor device includes a semiconductor substrate with a trench formed therein, a bottom electrode placed at a lower inner portion of the trench, the bottom electrode having an uneven upper surface, an insulating layer formed on an upper portion of the bottom electrode and on a sidewall of the trench, and a top electrode placed at an upper portion of the bottom electrode inside the trench, the top electrode having a top electrode which is uneven, in which the top electrode is so configured that the top electrode is inclined toward a center portion.
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Citations
24 Claims
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1. A semiconductor device, comprising:
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a semiconductor substrate comprising a trench formed therein; a bottom electrode formed inside the trench; a top electrode formed inside the trench and above the bottom electrode; and an insulating layer separating the top electrode from the bottom electrode, wherein the insulating layer has an uneven upper surface, and an additional depression having a shape of a key hole with a substantially vertical sidewall is formed in the uneven upper surface; the top electrode has an uneven lower surface; and the uneven lower surface of the top electrode comprises a curved surface with a protrusion in a center portion of the trench that protrudes toward the bottom electrode to fill the additional depression having the shape of the key hole. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 14, 15, 16, 17, 18, 19)
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11. A semiconductor device, comprising:
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a semiconductor substrate comprising a trench formed therein; a bottom electrode formed inside the trench; a top electrode formed inside the trench and above the bottom electrode; an insulating layer separating the top electrode from the bottom electrode and extending laterally to cover the semiconductor substrate; a burial layer formed above the top electrode in the trench; and a metal barrier layer formed above the burial layer and extending laterally to contact the semiconductor substrate via a contact hole formed in the insulating layer, wherein the insulating layer has an uneven upper surface, and an additional depression having a shape of a key hole with a substantially vertical sidewall is formed in the uneven upper surface; and the top electrode has an uneven lower surface with a protrusion in a center portion of the trench that protrudes toward the bottom electrode to fill the additional depression having the shape of the key hole. - View Dependent Claims (12, 13)
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20. A method of fabricating a semiconductor device, comprising:
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forming a trench in a semiconductor substrate; and forming a bottom electrode inside the trench; forming an insulating layer on the bottom electrode, the insulating layer having an uneven surface, and an additional depression having a shape of a key hole with a substantially vertical sidewall formed in the uneven upper surface; and forming a top electrode such that the insulating layer is disposed between the top electrode and the bottom electrode inside the trench, wherein a lower surface of the top electrode comprises a curved surface with a protrusion in a center portion of the trench that protrudes toward the bottom electrode to fill the additional depression having the shape of the key hole. - View Dependent Claims (21, 22, 23, 24)
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Specification