Trench schottky rectifier device and method for manufacturing the same
First Claim
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1. A trench Schottky rectifier device comprising:
- a substrate having a first conductivity type;
a first plurality of trenches and a second plurality of trenches formed in the substrate;
an insulating layer formed on sidewalls of the first plurality of trenches and the second plurality of trenches and covered on a first portion of the substrate;
an adhesion layer formed on a second portion of the substrate, the insulating layer, and bottoms of the first plurality of trenches and the second plurality of trenches;
a first plurality of conductive structures formed in the first plurality of trenches and a second plurality of conductive structures formed in the second plurality of trenches;
an electrode overlying the adhesion layer, the first plurality of conductive structures and the second plurality of conductive structures;
a plurality of doped regions having a second conductivity type formed in the substrate and located under the first plurality of trenches and the second plurality of trenches, and in contact with the adhesion layer at the bottoms of the first plurality of trenches and the second plurality of trenches,wherein the insulating layer is coplanar on the first portion of the substrate including an edge area of the substrate uncovered by the electrode.
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Abstract
A trench Schottky rectifier device includes a substrate having a first conductivity type, a plurality of trenches formed in the substrate, and an insulating layer formed on sidewalls of the trenches. The trenches are filled with conductive structure. There is an electrode overlying the conductive structure and the substrate, and thus a Schottky contact forms between the electrode and the substrate. A plurality of embedded doped regions having a second conductivity type are formed in the substrate and located under the trenches. Each doped region and the substrate form a PN junction to pinch off current flowing toward the Schottky contact so as to suppress current leakage.
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Citations
6 Claims
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1. A trench Schottky rectifier device comprising:
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a substrate having a first conductivity type; a first plurality of trenches and a second plurality of trenches formed in the substrate; an insulating layer formed on sidewalls of the first plurality of trenches and the second plurality of trenches and covered on a first portion of the substrate; an adhesion layer formed on a second portion of the substrate, the insulating layer, and bottoms of the first plurality of trenches and the second plurality of trenches; a first plurality of conductive structures formed in the first plurality of trenches and a second plurality of conductive structures formed in the second plurality of trenches; an electrode overlying the adhesion layer, the first plurality of conductive structures and the second plurality of conductive structures; a plurality of doped regions having a second conductivity type formed in the substrate and located under the first plurality of trenches and the second plurality of trenches, and in contact with the adhesion layer at the bottoms of the first plurality of trenches and the second plurality of trenches, wherein the insulating layer is coplanar on the first portion of the substrate including an edge area of the substrate uncovered by the electrode. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification