CMOS integrated method for the fabrication of thermopile pixel with umbrella absorber on semiconductor substrate
First Claim
1. A method comprising:
- providing a substrate with a membrane on a first surface of the substrate,wherein the membrane has one or more openings that expose one or more portions of the first surface, and includes a thermopile;
depositing a sacrificial layer on the membrane and in the one or more openings;
patterning the sacrificial layer to expose a portion of the membrane associated with one or more hot junctions of the thermopile;
forming a rigid, thermally-conductive layer on the sacrificial layer and on the exposed portion of the membrane associated with the one or more hot junctions of the thermopile;
depositing an absorber on the rigid, thermally-conductive layer;
forming a cavity in the substrate from a second surface of the substrate to the membrane; and
removing the sacrificial layer.
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Abstract
A method of manufacturing a pixel structure having an umbrella absorber is disclosed. The method includes providing a substrate with a membrane on a first surface of the substrate. The membrane has one or more openings that expose one or more portions of the first surface, and includes a thermopile. A sacrificial layer is deposited on the membrane and in the one or more openings. The sacrificial layer is patterned to expose a portion of the membrane associated with one or more hot junctions of the thermopile. A rigid, thermally-conductive layer is formed on the sacrificial layer and on the exposed portion of the membrane associated with the one or more hot junctions of the thermopile. An absorber is deposited on the rigid, thermally-conductive layer. A cavity is formed in the substrate from a second surface of the substrate to the membrane and the sacrificial layer is removed.
28 Citations
21 Claims
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1. A method comprising:
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providing a substrate with a membrane on a first surface of the substrate, wherein the membrane has one or more openings that expose one or more portions of the first surface, and includes a thermopile; depositing a sacrificial layer on the membrane and in the one or more openings; patterning the sacrificial layer to expose a portion of the membrane associated with one or more hot junctions of the thermopile; forming a rigid, thermally-conductive layer on the sacrificial layer and on the exposed portion of the membrane associated with the one or more hot junctions of the thermopile; depositing an absorber on the rigid, thermally-conductive layer; forming a cavity in the substrate from a second surface of the substrate to the membrane; and removing the sacrificial layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification