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Technique for remanufacturing a BIS sensor

  • US 9,220,436 B2
  • Filed: 09/26/2011
  • Issued: 12/29/2015
  • Est. Priority Date: 09/26/2011
  • Status: Active Grant
First Claim
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1. A remanufactured bispectral index (BIS) sensor, comprising:

  • a backing layer;

    first, second, and third electrodes disposed on the backing layer and comprising a conductive ink, wherein the first, second, and third electrodes are adapted to be in electrical contact with a patient to perform BIS measurements;

    a first foam layer disposed on at least a portion of the backing layer;

    a second foam layer disposed on at least a portion of the first foam layer;

    a first adhesive layer configured to secure the first foam layer to the second foam layer; and

    a second adhesive layer attached to the second foam layer and configured to secure the remanufactured BIS sensor to the patient; and

    wherein at least a portion of one of the first, second, and third electrodes and at least a portion of the backing layer are from a used medical sensor, and the second adhesive layer is new.

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