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Implant encapsulation

  • US 9,220,907 B2
  • Filed: 09/03/2014
  • Issued: 12/29/2015
  • Est. Priority Date: 07/26/2012
  • Status: Active Grant
First Claim
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1. An implant unit, comprising:

  • a substrate;

    an implantable circuit arranged on the substrate; and

    an encapsulation structure disposed over at least a portion of the substrate and at least a portion of the implantable circuit, the encapsulation structure including;

    a first polymer layer having a first density;

    a second polymer layer disposed over the first polymer layer and having a density which is less than the first density; and

    at least one pair of modulation electrodes connected to the implantable circuit, wherein the first polymer layer includes a first window of exposure over one or more of the modulation electrodes, the first window of exposure having a first area; and

    wherein the second polymer layer includes a second window of exposure over one or more of the modulation electrodes and at least partially extending over the first window of exposure, the second window of exposure having a second area that is larger than the first area of the first window of exposure.

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