Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment

• US 9,221,114 B2
• Filed: 12/13/2012
• Issued: 12/29/2015
• Est. Priority Date: 12/15/2011
• Status: Expired due to Fees

• Current Assignee: Entegris Incorporated
• Original Assignee: Advanced Technology Materials, Inc. (Entegris Incorporated)
• Inventors: Chen, Tianniu, Korzenski, Michael B., Jiang, Ping
• Primary Examiner(s): STONER, KILEY SHAWN
• Application Number:
  US14/240,220
• Publication Number:
  US 20140191019A1
• Time in Patent Office: 1,111 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: B09B 3/00 Destroying solid waste or transforming solid waste into something useful or harmless
• CPC Class Codes: B09B 5/00 Operations not covered by a single other subclass or by a single other group in this subclass
• CPC Class Codes: B23K 1/018 Unsoldering; Removal of melted solder or other residues
• CPC Class Codes: B23K 3/08 Auxiliary devices therefor cleaning pipes or tubes or systems of pipes or tubes, e.g. before soldering, B08B9/02
• CPC Class Codes: B23K 37/00 Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups eye-shields for welders worn on the operator's body or carried in the hand A61F9/00 , i.e. A61F9/02; applicable to metal-working machines other than soldering, welding, or flame-cutting machines B23Q; laser protective screens B23K26/706; protective shields for other welding methods F16P1/06
• CPC Class Codes: C22B 1/005 Preliminary treatment of scrap C22B1/02 - C22B1/26 take precedence
• CPC Class Codes: C22B 11/046 from manufactured products, e.g. from printed circuit boards, from photographic films, paper or baths
• CPC Class Codes: C22B 3/02 Apparatus therefor
• CPC Class Codes: C22B 3/04 by leaching C22B3/18 takes precedence
• CPC Class Codes: C22B 4/00 Electrothermal treatment of ores or metallurgical products for obtaining metals or alloys obtaining iron or steel C21B, C21C
• CPC Class Codes: C22B 7/006 Wet processes
• CPC Class Codes: C25C 1/00 Electrolytic production, recovery or refining of metals by electrolysis of solutions C25C5/00 takes precedence
• CPC Class Codes: H05K 2203/178 Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
• CPC Class Codes: H05K 3/22 Secondary treatment of printed circuits H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107
• CPC Class Codes: Y02P 10/20 Recycling
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y02W 30/82 Recycling of waste of electrical or electronic equipment [WEEE]

Abstract

Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.

Claims

1. An apparatus for processing waste printed wire boards (PWBs) comprising at least one component, said apparatus comprising:

(a) a mechanical solder removal module, wherein the mechanical solder removal module effectuates the mechanical removal of at least a portion of the solder from a surface of the PWB; and

(b) a chemical solder removal module, wherein the chemical solder removal module effectuates the chemical removal of at least a portion of the solder from the surface of the PWB;

(c) a heating module positioned upstream and/or downstream of the chemical solder removal module;

wherein the mechanical and chemical solder removal modules are attached to one another in series,

wherein the heating module comprises at least one agitator selected from the group consisting of brushes, pressurized gases, pressurized liquids, rakes, sonic energy and laser energy, and wherein at least one component is separated from the PWB using said apparatus.

2. The apparatus of claim 1, wherein the mechanical solder removal module comprises mechanical solder removal means selected from the group consisting of at least one blade, abrasive materials, grinder(s), and pressurized water for the mechanical removal of solder from the surface.

3. The apparatus of claim 1, wherein the chemical solder removal module comprises a container for a first composition and optionally at least one agitator, wherein the PWB is partially or fully immersed in the first composition.

5. The apparatus of claim 1, further comprising at least one rinsing module positioned downstream of the chemical solder removal module.

12. The apparatus of claim 2, wherein the mechanical solder removal module further comprises an agitator selected from the group consisting of at least one brush, rake, blown gases, and blown liquids to assist in the removal of the solder.

24. The apparatus of claim 3, wherein the first composition comprises at least one oxidizing agent.

25. The apparatus of claim 1, further comprising a precious metal leaching module, wherein the precious metal comprises at least one species selected from the group consisting of gold, silver, palladium, platinum, rhodium, iridium, osmium, rhenium, and ruthenium.

26. The apparatus of claim 24, wherein the at least one oxidizing agent comprises a species selected from the group consisting of ozone, nitric acid, bubbled air, cyclohexylaminosulfonic acid, hydrogen peroxide, oxone, ammonium peroxomonosulfate, ammonium chlorite, ammonium chlorate, ammonium iodate, ammonium perborate, ammonium perchlorate, ammonium periodate, ammonium persulfate, ammonium hypochlorite, sodium persulfate, sodium hypochlorite, potassium iodate, potassium permanganate, potassium persulfate, potassium persulfate, potassium hypochlorite, tetramethylammonium chlorite, tetramethylammonium chlorate, tetramethylammonium iodate, tetramethylammonium perborate, tetramethylammonium perchlorate, tetramethylammonium periodate, tetramethylammonium persulfate, tetrabutylammonium peroxomonosulfate, peroxomonosulfuric acid, urea hydrogen peroxide, peracetic acid, sodium nitrate, potassium nitrate, ammonium nitrate, sulfuric acid, methanesulfonic acid, ethanesulfonic acid, 2-hydroxyethanesulfonic acid, n-propanesulfonic acid, isopropanesulfonic acid, isobutenesulfonic acid, n-butanesulfonic acid, n-octanesulfonic acid, benzenesulfonic acid, 4-methoxybenzenesulfonic acid, 4-hydroxybenzenesulfonic acid, 4-aminobenzenesulfonic acid, 4-nitrobenzenesulfonic acid, toluenesulfonic acid, hexylbenzenesulfonic acid, heptylbenzenesulfonic acid, octylbenzenesulfonic acid, nonylbenzenesulfonic acid, decylbenzenesulfonic acid, undecylbenzenesulfonic acid, dodecylbenzenesulfonic acid, tridecylbenzenesulfonic acid, tetradecylbenzene sulfonic acid, hexadecylbenzene sulfonic acid, 3-nitrobenzenesulfonic acid, 2-nitrobenzenesulfonic acid, 2-nitronaphthalenesulfonic acid, 3-nitronaphthalenesulfonic acid, 2,3-dinitrobenzenesulfonic acid, 2,4-dinitrobenzenesulfonic acid, 2,5-dinitrobenzenesulfonic acid, 2,6-dinitrobenzenesulfonic acid, 3,5-dinitrobenzenesulfonic acid, 2,4,6-trinitrobenzenesulfonic acid, 3-aminobenzenesulfonic acid, 2-aminobenzenesulfonic acid, 2-aminonaphthalenesulfonic acid, 3-aminonaphthalenesulfonic acid, 2,3-diaminobenzenesulfonic acid, 2,4-diaminobenzenesulfonic acid, 2,5-diaminobenzenesulfonic acid, 2,6-diaminobenzenesulfonic acid, 3,5-diaminobenzenesulfonic acid, 2,4,6-triaminobenzenesulfonic acid, 3-hydroxybenzenesulfonic acid, 2-hydroxybenzenesulfonic acid, 2-hydroxynaphthalenesulfonic acid, 3-hydroxynaphthalenesulfonic acid, 2,3-dihydroxybenzenesulfonic acid, 2,4-dihydroxybenzenesulfonic acid, 2,5-dihydroxybenzenesulfonic acid, 2,6-dihydroxybenzenesulfonic acid, 3,5-dihydroxybenzenesulfonic acid, 2,3,4-trihydroxybenzenesulfonic acid, 2,3,5-trihydroxybenzenesulfonic acid, 2,3,6-trihydroxybenzenesulfonic acid, 2,4,5-trihydroxybenzenesulfonic acid, 2,4,6-trihydroxybenzenesulfonic acid, 3,4,5-trihydroxybenzenesulfonic acid, 2,3,4,5-tetrahydroxybenzenesulfonic acid, 2,3,4,6-tetrahydroxybenzenesulfonic acid, 2,3,5,6-tetrahydroxybenzenesulfonic acid, 2,4,5,6-tetrahydroxybenzenesulfonic acid, 3-methoxybenzenesulfonic acid, 2-methoxybenzenesulfonic acid, 2,3-dimethoxybenzenesulfonic acid, 2,4-dimethoxybenzenesulfonic acid, 2,5-dimethoxybenzenesulfonic acid, 2, 6-dimethoxybenzenesulfonic acid, 3,5-dimethoxybenzenesulfonic acid, 2,4,6-trimethoxybenzenesulfonic acid, and combinations thereof.

27. The apparatus of claim 25, further comprising at least one rinsing module positioned downstream of the precious metal leaching module.

83. The apparatus of claim 24, wherein the oxidizing agent comprises nitric acid.

4. An apparatus for processing waste printed wire boards (PWBs) comprising at least one component, said apparatus comprising:

(a) a mechanical solder removal module, wherein the mechanical solder removal module effectuates the mechanical removal of at least a portion of the solder from a surface of the PWB;

(b) a chemical solder removal module, wherein the chemical solder removal module effectuates the chemical removal of at least a portion of the solder from the surface of the PWB, wherein the chemical solder removal module comprises a container for a first composition and optionally at least one agitator, wherein the first composition comprises at least one oxidizing agent and the PWB is partially or fully immersed in the first composition,

wherein the mechanical and chemical solder removal modules are attached to one another in series, and wherein at least one component is separated from the PWB using said apparatus; and

(c) a heating module positioned upstream and/or downstream of the chemical solder removal module.

8. The apparatus of claim 4, wherein the at least one oxidizing agent comprises a species selected from the group consisting of ozone, nitric acid, bubbled air, cyclohexylaminosulfonic acid, hydrogen peroxide, oxone, ammonium peroxomonosulfate, ammonium chlorite, ammonium chlorate, ammonium iodate, ammonium perborate, ammonium perchlorate, ammonium periodate, ammonium persulfate, ammonium hypochlorite, sodium persulfate, sodium hypochlorite, potassium iodate, potassium permanganate, potassium persulfate, potassium persulfate, potassium hypochlorite, tetramethylammonium chlorite, tetramethylammonium chlorate, tetramethylammonium iodate, tetramethylammonium perborate, tetramethylammonium perchlorate, tetramethylammonium periodate, tetramethylammonium persulfate, tetrabutylammonium peroxomonosulfate, peroxomonosulfuric acid, urea hydrogen peroxide, peracetic acid, sodium nitrate, potassium nitrate, ammonium nitrate, sulfuric acid, methanesulfonic acid, ethanesulfonic acid, 2-hydroxyethanesulfonic acid, n-propanesulfonic acid, isopropanesulfonic acid, isobutenesulfonic acid, n-butanesulfonic acid, n-octanesulfonic acid, benzenesulfonic acid, 4-methoxybenzenesulfonic acid, 4-hydroxybenzenesulfonic acid, 4-aminobenzenesulfonic acid, 4-nitrobenzenesulfonic acid, toluenesulfonic acid, hexylbenzenesulfonic acid, heptylbenzenesulfonic acid, octylbenzenesulfonic acid, nonylbenzenesulfonic acid, decylbenzenesulfonic acid, undecylbenzenesulfonic acid, dodecylbenzenesulfonic acid, tridecylbenzenesulfonic acid, tetradecylbenzene sulfonic acid, hexadecylbenzene sulfonic acid, 3-nitrobenzenesulfonic acid, 2-nitrobenzenesulfonic acid, 2-nitronaphthalenesulfonic acid, 3-nitronaphthalenesulfonic acid, 2,3-dinitrobenzenesulfonic acid, 2,4-dinitrobenzenesulfonic acid, 2,5-dinitrobenzenesulfonic acid, 2,6-dinitrobenzenesulfonic acid, 3,5-dinitrobenzenesulfonic acid, 2,4,6-trinitrobenzenesulfonic acid, 3-aminobenzenesulfonic acid, 2-aminobenzenesulfonic acid, 2-aminonaphthalenesulfonic acid, 3-aminonaphthalenesulfonic acid, 2,3-diaminobenzenesulfonic acid, 2,4-diaminobenzenesulfonic acid, 2,5-diaminobenzenesulfonic acid, 2,6-diaminobenzenesulfonic acid, 3,5-diaminobenzenesulfonic acid, 2,4,6-triaminobenzenesulfonic acid, 3-hydroxybenzenesulfonic acid, 2-hydroxybenzenesulfonic acid, 2-hydroxynaphthalenesulfonic acid, 3-hydroxynaphthalenesulfonic acid, 2,3-dihydroxybenzenesulfonic acid, 2,4-dihydroxybenzenesulfonic acid, 2,5-dihydroxybenzenesulfonic acid, 2,6-dihydroxybenzenesulfonic acid, 3,5-dihydroxybenzenesulfonic acid, 2,3,4-trihydroxybenzenesulfonic acid, 2,3,5-trihydroxybenzenesulfonic acid, 2,3,6-trihydroxybenzenesulfonic acid, 2,4,5-trihydroxybenzenesulfonic acid, 2,4,6-trihydroxybenzenesulfonic acid, 3,4,5-trihydroxybenzenesulfonic acid, 2,3,4,5-tetrahydroxybenzenesulfonic acid, 2,3,4,6-tetrahydroxybenzenesulfonic acid, 2,3,5,6-tetrahydroxybenzenesulfonic acid, 2,4,5,6-tetrahydroxybenzenesulfonic acid, 3-methoxybenzenesulfonic acid, 2-methoxybenzenesulfonic acid, 2,3-dimethoxybenzenesulfonic acid, 2,4-dimethoxybenzenesulfonic acid, 2,5-dimethoxybenzenesulfonic acid, 2,6-dimethoxybenzenesulfonic acid, 3,5-dimethoxybenzenesulfonic acid, 2,4,6-trimethoxybenzenesulfonic acid, and combinations thereof.

28. The apparatus of claim 4, further comprising at least one rinsing module positioned downstream of the chemical solder removal module.

29. The apparatus of claim 4, further comprising a precious metal leaching module, wherein the precious metal comprises at least one species selected from the group consisting of gold, silver, palladium, platinum, rhodium, iridium, osmium, rhenium, and ruthenium.

30. The apparatus of claim 29, further comprising at least one rinsing module positioned downstream of the precious metal leaching module.

81. The apparatus of claim 4, wherein the oxidizing agent comprises nitric acid.

6. An apparatus for processing waste printed wire boards (PWBs) comprising at least one component, said apparatus comprising:

(a) a mechanical solder removal module, wherein the mechanical solder removal module effectuates the mechanical removal of at least a portion of the solder from a surface of the PWB; and

(b) a chemical solder removal module, wherein the chemical solder removal module effectuates the chemical removal of at least a portion of the solder from the surface of the PWB;

(c) a precious metal leaching module, wherein the precious metal comprises at least one species selected from the group consisting of gold, silver, palladium, platinum, rhodium, iridium, osmium, rhenium, and ruthenium, wherein the mechanical and chemical solder removal modules are attached to one another in series, and wherein at least one component is separated from the PWB using said apparatus.

7. The apparatus of claim 6, wherein the precious metal leaching module comprises a container for a leaching composition comprising tri-iodide.

9. The apparatus of claim 6, wherein the precious metal leaching module comprises a container for a leaching composition comprising at least one frothing agent and at least one collecting agent.

10. The apparatus of claim 9, wherein the precious metal leaching module further comprises frothing means.

11. The apparatus of claim 6, further comprising at least one rinsing module positioned downstream of the precious metal leaching module.

31. The apparatus of claim 6, wherein the chemical solder removal module comprises a container for a first composition and optionally at least one agitator, wherein the PWB is partially or fully immersed in the first composition.

32. The apparatus of claim 6, further comprising a heating module positioned upstream and/or downstream of the chemical solder removal module.

33. The apparatus of claim 31, wherein the first composition comprises at least one oxidizing agent.

34. The apparatus of claim 6, further comprising at least one rinsing module positioned downstream of the chemical solder removal module.

84. The apparatus of claim 33, wherein the oxidizing agent comprises nitric acid.

13. A method of recycling waste printed wire boards (PWBs) comprising at least one component comprising:

removing at least a portion of solder from a surface of the PWB using a mechanical solder removal module,

wherein the mechanical solder removal module comprises mechanical solder removal means selected from the group consisting of at least one blade, abrasive materials, grinder(s), and pressurized water and at least one agitator selected from the group consisting of at least one brush, rake, blown gases, and blown liquids for the mechanical removal of solder from the surface;

removing at least a portion of the solder from the surface of the PWB using a chemical solder removal module,

wherein the chemical solder removal module comprises a container for a first composition and at least one agitator, wherein the PWB is partially or fully immersed in the first composition,

wherein the mechanical solder removal module and the chemical solder removal module are attached to one another in series, and wherein at least one component is separated from the PWB using the method.

48. The method of claim 13, further comprising removing at least one casing or at least one component from a surface of the PWB using a heating module positioned upstream and/or downstream of the chemical solder removal module container.

49. The method of claim 48, wherein the heating module comprises at least one agitator selected from the group consisting of brushes, high pressure gases, rakes, high pressure liquids, sonic energy and laser energy.

50. The method of claim 13, wherein the first composition comprises at least one oxidizing agent.

51. The method of claim 13, further comprising rinsing the first composition from the PWB.

52. The method of claim 13, further comprising removing at least one precious metal from the PWB using a leaching composition, wherein the precious metal comprises at least one species selected from the group consisting of gold, silver, palladium, platinum, rhodium, iridium, osmium, rhenium, and ruthenium.

53. The method of claim 50, wherein the at least one oxidizing agent comprises a species selected from the group consisting of ozone, nitric acid, bubbled air, cyclohexylaminosulfonic acid, hydrogen peroxide, oxone, ammonium peroxomonosulfate, ammonium chlorite, ammonium chlorate, ammonium iodate, ammonium perborate, ammonium perchlorate, ammonium periodate, ammonium persulfate, ammonium hypochlorite, sodium persulfate, sodium hypochlorite, potassium iodate, potassium permanganate, potassium persulfate, potassium persulfate, potassium hypochlorite, tetramethylammonium chlorite, tetramethylammonium chlorate, tetramethylammonium iodate, tetramethylammonium perborate, tetramethylammonium perchlorate, tetramethylammonium periodate, tetramethylammonium persulfate, tetrabutylammonium peroxomonosulfate, peroxomonosulfuric acid, urea hydrogen peroxide, peracetic acid, sodium nitrate, potassium nitrate, ammonium nitrate, sulfuric acid, methanesulfonic acid, ethanesulfonic acid, 2-hydroxyethanesulfonic acid, n-propanesulfonic acid, isopropanesulfonic acid, isobutenesulfonic acid, n-butanesulfonic acid, n-octanesulfonic acid, benzenesulfonic acid, 4-methoxybenzenesulfonic acid, 4-hydroxybenzenesulfonic acid, 4-aminobenzenesulfonic acid, 4-nitrobenzenesulfonic acid, toluenesulfonic acid, hexylbenzenesulfonic acid, heptylbenzenesulfonic acid, octylbenzenesulfonic acid, nonylbenzenesulfonic acid, decylbenzenesulfonic acid, undecylbenzenesulfonic acid, dodecylbenzenesulfonic acid, tridecylbenzenesulfonic acid, tetradecylbenzene sulfonic acid, hexadecylbenzene sulfonic acid, 3-nitrobenzenesulfonic acid, 2-nitrobenzenesulfonic acid, 2-nitronaphthalenesulfonic acid, 3-nitronaphthalenesulfonic acid, 2,3-dinitrobenzenesulfonic acid, 2,4-dinitrobenzenesulfonic acid, 2,5-dinitrobenzenesulfonic acid, 2,6-dinitrobenzenesulfonic acid, 3,5-dinitrobenzenesulfonic acid, 2,4,6-trinitrobenzenesulfonic acid, 3-aminobenzenesulfonic acid, 2-aminobenzenesulfonic acid, 2-aminonaphthalenesulfonic acid, 3-aminonaphthalenesulfonic acid, 2,3-diaminobenzenesulfonic acid, 2,4-diaminobenzenesulfonic acid, 2,5-diaminobenzenesulfonic acid, 2,6-diaminobenzenesulfonic acid, 3,5-diaminobenzenesulfonic acid, 2,4,6-triaminobenzenesulfonic acid, 3-hydroxybenzenesulfonic acid, 2-hydroxybenzenesulfonic acid, 2-hydroxynaphthalenesulfonic acid, 3-hydroxynaphthalenesulfonic acid, 2,3-dihydroxybenzenesulfonic acid, 2,4-dihydroxybenzenesulfonic acid, 2,5-dihydroxybenzenesulfonic acid, 2,6-dihydroxybenzenesulfonic acid, 3,5-dihydroxybenzenesulfonic acid, 2,3,4-trihydroxyb enzenesulfonic acid, 2,3,5-trihydroxybenzenesulfonic acid, 2,3,6-trihydroxybenzenesulfonic acid, 2,4,5-trihydroxybenzenesulfonic acid, 2,4,6-trihydroxybenzenesulfonic acid, 3,4,5-trihydroxybenzenesulfonic acid, 2,3,4,5-tetrahydroxybenzenesulfonic acid, 2,3,4,6-tetrahydroxybenzenesulfonic acid, 2,3,5,6-tetrahydroxybenzenesulfonic acid, 2,4,5,6-tetrahydroxybenzenesulfonic acid, 3-methoxybenzenesulfonic acid, 2-methoxybenzenesulfonic acid, 2,3-dimethoxybenzenesulfonic acid, 2,4-dimethoxybenzenesulfonic acid, 2,5-dimethoxybenzenesulfonic acid, 2,6-dimethoxybenzenesulfonic acid, 3,5-dimethoxybenzenesulfonic acid, 2,4,6-trimethoxybenzenesulfonic acid, and combinations thereof.

54. The method of claim 52, further comprising rinsing the leaching composition from the PWB.

77. The method of claim 13, wherein the at least one component comprises a species selected from the group consisting of transistors, capacitors, heat sinks, integrated circuits, resistors, integrated switches, chips, and processors.

79. The method of claim 52, further comprising recovering the precious metal from the leaching composition.

87. The method of claim 50, wherein the oxidizing agent comprises nitric acid.

14. An apparatus for processing waste printed wire boards (PWBs) comprising at least one component, said apparatus comprising:

(a) a heating module for removing casing or at least one component from the PWB, wherein the heating module comprises a heating mechanism and means for moving the waste PWBs through the heating mechanism, wherein the means for moving the waste PWBs through the heating mechanism comprises a roller chain, tracks, belts, or link chains; and

(b) a chemical solder removal module, wherein the chemical solder removal module effectuates the chemical removal of the solder from the surface of the PWB,

wherein the heating and chemical solder removal modules are attached to one another in series, and

wherein at least one component is separated from the PWB using said apparatus.

18. The apparatus of claim 14, further comprising at least one rinsing module positioned downstream of the chemical solder removal module.

35. The apparatus of claim 14, wherein the heating mechanism comprises at least one agitation means selected from the group consisting of brushes, pressurized gases, pressurized liquids, rakes, sonic energy and laser energy.

36. The apparatus of claim 14, wherein the chemical solder removal module comprises a container for a first composition, wherein the first composition comprises at least one oxidizing agent.

37. The apparatus of claim 14, further comprising a precious metal leaching module, wherein the precious metal comprises at least one species selected from the group consisting of gold, silver, palladium, platinum, rhodium, iridium, osmium, rhenium, and ruthenium.

38. The apparatus of claim 36, wherein the at least one oxidizing agent comprises a species selected from the group consisting of ozone, nitric acid, bubbled air, cyclohexylaminosulfonic acid, hydrogen peroxide, oxone, ammonium peroxomonosulfate, ammonium chlorite, ammonium chlorate, ammonium iodate, ammonium perborate, ammonium perchlorate, ammonium periodate, ammonium persulfate, ammonium hypochlorite, sodium persulfate, sodium hypochlorite, potassium iodate, potassium permanganate, potassium persulfate, potassium persulfate, potassium hypochlorite, tetramethylammonium chlorite, tetramethylammonium chlorate, tetramethylammonium iodate, tetramethylammonium perborate, tetramethylammonium perchlorate, tetramethylammonium periodate, tetramethylammonium persulfate, tetrabutylammonium peroxomonosulfate, peroxomonosulfuric acid, urea hydrogen peroxide, peracetic acid, sodium nitrate, potassium nitrate, ammonium nitrate, sulfuric acid, methanesulfonic acid, ethanesulfonic acid, 2-hydroxyethanesulfonic acid, n-propanesulfonic acid, isopropanesulfonic acid, isobutenesulfonic acid, n-butanesulfonic acid, n-octanesulfonic acid, benzenesulfonic acid, 4- methoxybenzenesulfonic acid, 4-hydroxybenzenesulfonic acid, 4-aminobenzenesulfonic acid, 4-nitrobenzenesulfonic acid, toluenesulfonic acid, hexylbenzenesulfonic acid, heptylbenzenesulfonic acid, octylbenzenesulfonic acid, nonylbenzenesulfonic acid, decylbenzenesulfonic acid, undecylbenzenesulfonic acid, dodecylbenzenesulfonic acid, tridecylbenzenesulfonic acid, tetradecylbenzene sulfonic acid, hexadecylbenzene sulfonic acid, 3-nitrobenzenesulfonic acid, 2-nitrobenzenesulfonic acid, 2-nitronaphthalenesulfonic acid, 3-nitronaphthalenesulfonic acid, 2,3-dinitrobenzenesulfonic acid, 2,4-dinitrobenzenesulfonic acid, 2,5-dinitrobenzenesulfonic acid, 2,6-dinitrobenzenesulfonic acid, 3,5-dinitrobenzenesulfonic acid, 2,4,6-trinitrobenzenesulfonic acid, 3-aminobenzenesulfonic acid, 2-aminobenzenesulfonic acid, 2-aminonaphthalenesulfonic acid, 3-aminonaphthalenesulfonic acid, 2,3-diaminobenzenesulfonic acid, 2,4-diaminobenzenesulfonic acid, 2,5-diaminobenzenesulfonic acid, 2,6-diaminobenzenesulfonic acid, 3,5-diaminobenzenesulfonic acid, 2,4,6-triaminobenzenesulfonic acid, 3-hydroxybenzenesulfonic acid, 2-hydroxybenzenesulfonic acid, 2-hydroxynaphthalenesulfonic acid, 3-hydroxynaphthalenesulfonic acid, 2,3-dihydroxybenzenesulfonic acid, 2,4-dihydroxybenzenesulfonic acid, 2,5-dihydroxybenzenesulfonic acid, 2,6-dihydroxybenzenesulfonic acid, 3,5-dihydroxybenzenesulfonic acid, 2,3,4-trihydroxyb enzenesulfonic acid, 2,3,5-trihydroxybenzenesulfonic acid, 2,3,6-trihydroxybenzenesulfonic acid, 2,4,5-trihydroxybenzenesulfonic acid, 2,4,6-trihydroxybenzenesulfonic acid, 3,4,5-trihydroxybenzenesulfonic acid, 2,3,4,5-tetrahydroxybenzenesulfonic acid, 2,3,4,6-tetrahydroxybenzenesulfonic acid, 2,3,5,6-tetrahydroxybenzenesulfonic acid, 2,4,5,6-tetrahydroxybenzenesulfonic acid, 3-methoxybenzenesulfonic acid, 2-methoxybenzenesulfonic acid, 2,3-dimethoxybenzenesulfonic acid, 2,4-dimethoxybenzenesulfonic acid, 2,5-dimethoxybenzenesulfonic acid, 2,6-dimethoxybenzenesulfonic acid, 3,5-dimethoxybenzenesulfonic acid, 2,4,6-trimethoxybenzenesulfonic acid, and combinations thereof.

39. The apparatus of claim 37, further comprising at least one rinsing module positioned downstream of the precious metal leaching module.

61. The apparatus of claim 14, wherein the solder comprises lead, tin, alloys thereof, and combinations thereof.

65. The apparatus of claim 14, further comprising means to move the PWB manually or automatically to the chemical solder removal module.

69. The apparatus of claim 14, wherein the chemical solder removal module comprises a drum.

73. The apparatus of claim 14, further comprising a drying module.

85. The apparatus of claim 36, wherein the oxidizing agent comprises nitric acid.

15. An apparatus for processing waste printed wire boards (PWBs) comprising at least one component, said apparatus comprising:

(a) a heating module for removing casing or at least one component from the PWB; and

(b) a chemical solder removal module comprising a container for a first composition, wherein the chemical solder removal module effectuates the chemical removal of the solder from the surface of the PWB, wherein the first composition comprises at least one oxidizing agent,

wherein the heating and chemical solder removal modules are attached to one another in series, and

wherein at least one component is separated from the PWB using said apparatus.

16. The apparatus of claim 15, wherein the heating module comprises a heating mechanism and means for moving the waste PWBs through the heating mechanism, wherein the means for moving the waste PWBs through the heating mechanism comprises a roller chain, tracks, belts, or link chains.

17. The apparatus of claim 16, wherein the heating mechanism comprises at least one agitation means selected from the group consisting of brushes, pressurized gases, pressurized liquids, rakes, sonic energy and laser energy.

21. The apparatus of claim 15, wherein the at least one oxidizing agent comprises a species selected from the group consisting of ozone, nitric acid, bubbled air, cyclohexylaminosulfonic acid, hydrogen peroxide, oxone, ammonium peroxomonosulfate, ammonium chlorite, ammonium chlorate, ammonium iodate, ammonium perborate, ammonium perchlorate, ammonium periodate, ammonium persulfate, ammonium hypochlorite, sodium persulfate, sodium hypochlorite, potassium iodate, potassium permanganate, potassium persulfate, potassium persulfate, potassium hypochlorite, tetramethylammonium chlorite, tetramethylammonium chlorate, tetramethylammonium iodate, tetramethylammonium perborate, tetramethylammonium perchlorate, tetramethylammonium periodate, tetramethylammonium persulfate, tetrabutylammonium peroxomonosulfate, peroxomonosulfuric acid, urea hydrogen peroxide, peracetic acid, sodium nitrate, potassium nitrate, ammonium nitrate, sulfuric acid, methanesulfonic acid, ethanesulfonic acid, 2-hydroxyethanesulfonic acid, n-propanesulfonic acid, isopropanesulfonic acid, isobutenesulfonic acid, n-butanesulfonic acid, n-octanesulfonic acid, benzenesulfonic acid, 4-methoxybenzenesulfonic acid, 4-hydroxybenzenesulfonic acid, 4-aminobenzenesulfonic acid, 4-nitrobenzenesulfonic acid, toluenesulfonic acid, hexylbenzenesulfonic acid, heptylbenzenesulfonic acid, octylbenzenesulfonic acid, nonylbenzenesulfonic acid, decylbenzenesulfonic acid, undecylbenzenesulfonic acid, dodecylbenzenesulfonic acid, tridecylbenzenesulfonic acid, tetradecylbenzene sulfonic acid, hexadecylbenzene sulfonic acid, 3-nitrobenzenesulfonic acid, 2-nitrobenzenesulfonic acid, 2-nitronaphthalenesulfonic acid, 3-nitronaphthalenesulfonic acid, 2,3-dinitrobenzenesulfonic acid, 2,4-dinitrobenzenesulfonic acid, 2,5-dinitrobenzenesulfonic acid, 2,6-dinitrobenzenesulfonic acid, 3,5-dinitrobenzenesulfonic acid, 2,4,6-trinitrobenzenesulfonic acid, 3-aminobenzenesulfonic acid, 2-aminobenzenesulfonic acid, 2-aminonaphthalenesulfonic acid, 3-aminonaphthalenesulfonic acid, 2,3-diaminobenzenesulfonic acid, 2,4-diaminobenzenesulfonic acid, 2,5-diaminobenzenesulfonic acid, 2,6-diaminobenzenesulfonic acid, 3,5-diaminobenzenesulfonic acid, 2,4,6-triaminobenzenesulfonic acid, 3-hydroxybenzenesulfonic acid, 2-hydroxybenzenesulfonic acid, 2-hydroxynaphthalenesulfonic acid, 3-hydroxynaphthalenesulfonic acid, 2,3-dihydroxybenzenesulfonic acid, 2,4-dihydroxybenzenesulfonic acid, 2,5-dihydroxybenzenesulfonic acid, 2,6-dihydroxybenzenesulfonic acid, 3,5-dihydroxybenzenesulfonic acid, 2,3,4-trihydroxybenzenesulfonic acid, 2,3,5-trihydroxybenzenesulfonic acid, 2,3,6-trihydroxybenzenesulfonic acid, 2,4,5-trihydroxybenzenesulfonic acid, 2,4,6-trihydroxybenzenesulfonic acid, 3,4,5-trihydroxybenzenesulfonic acid, 2,3,4,5-tetrahydroxybenzenesulfonic acid, 2,3,4,6-tetrahydroxybenzenesulfonic acid, 2,3,5,6-tetrahydroxybenzenesulfonic acid, 2,4,5,6-tetrahydroxybenzenesulfonic acid, 3-methoxybenzenesulfonic acid, 2-methoxybenzenesulfonic acid, 2,3-dimethoxybenzenesulfonic acid, 2,4-dimethoxybenzenesulfonic acid, 2,5-dimethoxybenzenesulfonic acid, 2,6-dimethoxybenzenesulfonic acid, 3,5-dimethoxybenzenesulfonic acid, 2,4,6-trimethoxybenzenesulfonic acid, and combinations thereof.

40. The apparatus of claim 15, further comprising at least one rinsing module positioned downstream of the chemical solder removal module.

41. The apparatus of claim 15, further comprising a precious metal leaching module, wherein the precious metal comprises at least one species selected from the group consisting of gold, silver, palladium, platinum, rhodium, iridium, osmium, rhenium, and ruthenium.

42. The apparatus of claim 15, further comprising at least one rinsing module positioned downstream of the precious metal leaching module.

62. The apparatus of claim 15, wherein the solder comprises lead, tin, alloys thereof, and combinations thereof.

66. The apparatus of claim 15, further comprising means to move the PWB manually or automatically to the chemical solder removal module.

70. The apparatus of claim 15, wherein the chemical solder removal module comprises a drum.

74. The apparatus of claim 15, further comprising a drying module.

82. The apparatus of claim 15, wherein the oxidizing agent comprises nitric acid.

19. An apparatus for processing waste printed wire boards (PWBs) comprising at least one component, said apparatus comprising:

(a) a heating module for removing casing or at least one component from the PWB; and

(b) a chemical solder removal module, wherein the chemical solder removal module effectuates the chemical removal of the solder from the surface of the PWB,

(c) a precious metal leaching module, wherein the precious metal comprises at least one species selected from the group consisting of gold, silver, palladium, platinum, rhodium, iridium, osmium, rhenium, and ruthenium,

wherein the heating and chemical solder removal modules are attached to one another in series, and

wherein at least one component is separated from the PWB using said apparatus.

20. The apparatus of claim 19, wherein the precious metal leaching module comprises a container for a leaching composition comprising tri-iodide.

22. The apparatus of claim 19, further comprising at least one rinsing module positioned downstream of the precious metal leaching module.

43. The apparatus of claim 19, wherein the heating module comprises a heating mechanism and means for moving the waste PWBs through the heating mechanism.

44. The apparatus of claim 43, wherein the heating mechanism comprises at least one agitation means selected from the group consisting of brushes, pressurized gases, pressurized liquids, rakes, sonic energy and laser energy.

45. The apparatus of claim 19, further comprising at least one rinsing module positioned downstream of the chemical solder removal module.

46. The apparatus of claim 19, wherein the chemical solder removal module comprises a container for a first composition, wherein the first composition comprises at least one oxidizing agent.

47. The apparatus of claim 46, wherein the at least one oxidizing agent comprises a species selected from the group consisting of ozone, nitric acid, bubbled air, cyclohexylaminosulfonic acid, hydrogen peroxide, oxone, ammonium peroxomonosulfate, ammonium chlorite, ammonium chlorate, ammonium iodate, ammonium perborate, ammonium perchlorate, ammonium periodate, ammonium persulfate, ammonium hypochlorite, sodium persulfate, sodium hypochlorite, potassium iodate, potassium permanganate, potassium persulfate, potassium persulfate, potassium hypochlorite, tetramethylammonium chlorite, tetramethylammonium chlorate, tetramethylammonium iodate, tetramethylammonium perborate, tetramethylammonium perchlorate, tetramethylammonium periodate, tetramethylammonium persulfate, tetrabutylammonium peroxomonosulfate, peroxomonosulfuric acid, urea hydrogen peroxide, peracetic acid, sodium nitrate, potassium nitrate, ammonium nitrate, sulfuric acid, methanesulfonic acid, ethanesulfonic acid, 2-hydroxyethanesulfonic acid, n-propanesulfonic acid, isopropanesulfonic acid, isobutenesulfonic acid, n-butanesulfonic acid, n-octanesulfonic acid, benzenesulfonic acid, 4-methoxybenzenesulfonic acid, 4-hydroxybenzenesulfonic acid, 4-aminobenzenesulfonic acid, 4-nitrobenzenesulfonic acid, toluenesulfonic acid, hexylbenzenesulfonic acid, heptylbenzenesulfonic acid, octylbenzenesulfonic acid, nonylbenzenesulfonic acid, decylbenzenesulfonic acid, undecylbenzenesulfonic acid, dodecylbenzenesulfonic acid, tridecylbenzenesulfonic acid, tetradecylbenzene sulfonic acid, hexadecylbenzene sulfonic acid, 3-nitrobenzenesulfonic acid, 2-nitrobenzenesulfonic acid, 2-nitronaphthalenesulfonic acid, 3-nitronaphthalenesulfonic acid, 2,3-dinitrobenzenesulfonic acid, 2,4-dinitrobenzenesulfonic acid, 2,5-dinitrobenzenesulfonic acid, 2,6-dinitrobenzenesulfonic acid, 3,5-dinitrobenzenesulfonic acid, 2,4,6-trinitrobenzenesulfonic acid, 3-aminobenzenesulfonic acid, 2-aminobenzenesulfonic acid, 2-aminonaphthalenesulfonic acid, 3-aminonaphthalenesulfonic acid, 2,3-diaminobenzenesulfonic acid, 2,4-diaminobenzenesulfonic acid, 2,5-diaminobenzenesulfonic acid, 2,6-diaminobenzenesulfonic acid, 3,5-diaminobenzenesulfonic acid, 2,4,6-triaminobenzenesulfonic acid, 3-hydroxybenzenesulfonic acid, 2-hydroxybenzenesulfonic acid, 2-hydroxynaphthalenesulfonic acid, 3-hydroxynaphthalenesulfonic acid, 2,3-dihydroxybenzenesulfonic acid, 2,4-dihydroxybenzenesulfonic acid, 2,5-dihydroxybenzenesulfonic acid, 2,6-dihydroxybenzenesulfonic acid, 3,5-dihydroxybenzenesulfonic acid, 2,3,4-trihydroxybenzenesulfonic acid, 2,3,5-trihydroxybenzenesulfonic acid, 2,3,6-trihydroxybenzenesulfonic acid, 2,4,5-trihydroxybenzenesulfonic acid, 2,4,6-trihydroxybenzenesulfonic acid, 3,4,5-trihydroxybenzenesulfonic acid, 2,3,4,5-tetrahydroxybenzenesulfonic acid, 2,3,4,6-tetrahydroxybenzenesulfonic acid, 2,3,5,6-tetrahydroxybenzenesulfonic acid, 2,4,5,6-tetrahydroxybenzenesulfonic acid, 3-methoxybenzenesulfonic acid, 2-methoxybenzenesulfonic acid, 2,3-dimethoxybenzenesulfonic acid, 2,4-dimethoxybenzenesulfonic acid, 2,5-dimethoxybenzenesulfonic acid, 2, 6-dimethoxybenzenesulfonic acid, 3,5-dimethoxybenzenesulfonic acid, 2,4,6-trimethoxybenzenesulfonic acid, and combinations thereof.

63. The apparatus of claim 19, wherein the solder comprises lead, tin, alloys thereof, and combinations thereof.

67. The apparatus of claim 19, further comprising means to move the PWB manually or automatically to the chemical solder removal module.

71. The apparatus of claim 19, wherein the chemical solder removal module comprises a drum.

75. The apparatus of claim 19, further comprising a drying module.

86. The apparatus of claim 46, wherein the oxidizing agent comprises nitric acid.

23. A method of recycling waste printed wire boards (PWBs) comprising at least one component comprising:

removing at least one casing or at least one component from a surface of the PWB using a heating module, wherein the heating module comprises a heating mechanism and a means for moving the PWB through the heating mechanism, wherein the means for moving the waste PWBs through the heating mechanism comprises a conveying belt, a conveying roller, a conveying wheel, a roller chain, tracks, belts, or link chains;

removing at least a portion of the solder from the surface of the PWB using a chemical solder removal module,

wherein the chemical solder removal module comprises a container for a first composition and at least one agitator, wherein the PWB is partially or fully immersed in the first composition,

wherein the heating module and the chemical solder removal module are attached to one another in series, and wherein at least one component is separated from the PWB using said method.

55. The method of claim 23, wherein the heating module comprises at least one agitator selected from the group consisting of brushes, high pressure gases, high pressure liquids, rakes, sonic energy and laser energy.

56. The method of claim 23, wherein the first composition comprises at least one oxidizing agent.

57. The method of claim 23, further comprising rinsing the first composition from the PWB.

58. The method of claim 23, further comprising removing at least one precious metal from the PWB using a leaching composition, wherein the precious metal comprises at least one species selected from the group consisting of gold, silver, palladium, platinum, rhodium, iridium, osmium, rhenium, and ruthenium.

59. The method of claim 56, wherein the at least one oxidizing agent comprises a species selected from the group consisting of ozone, nitric acid, bubbled air, cyclohexylaminosulfonic acid, hydrogen peroxide, oxone, ammonium peroxomonosulfate, ammonium chlorite, ammonium chlorate, ammonium iodate, ammonium perborate, ammonium perchlorate, ammonium periodate, ammonium persulfate, ammonium hypochlorite, sodium persulfate, sodium hypochlorite, potassium iodate, potassium permanganate, potassium persulfate, potassium persulfate, potassium hypochlorite, tetramethylammonium chlorite, tetramethylammonium chlorate, tetramethylammonium iodate, tetramethylammonium perborate, tetramethylammonium perchlorate, tetramethylammonium periodate, tetramethylammonium persulfate, tetrabutylammonium peroxomonosulfate, peroxomonosulfuric acid, urea hydrogen peroxide, peracetic acid, sodium nitrate, potassium nitrate, ammonium nitrate, sulfuric acid, methanesulfonic acid, ethanesulfonic acid, 2-hydroxyethanesulfonic acid, n-propanesulfonic acid, isopropanesulfonic acid, isobutenesulfonic acid, n-butanesulfonic acid, n-octanesulfonic acid, benzenesulfonic acid, 4-methoxybenzenesulfonic acid, 4-hydroxybenzenesulfonic acid, 4-aminobenzenesulfonic acid, 4-nitrobenzenesulfonic acid, toluenesulfonic acid, hexylbenzenesulfonic acid, heptylbenzenesulfonic acid, octylbenzenesulfonic acid, nonylbenzenesulfonic acid, decylbenzenesulfonic acid, undecylbenzenesulfonic acid, dodecylbenzenesulfonic acid, tridecylbenzenesulfonic acid, tetradecylbenzene sulfonic acid, hexadecylbenzene sulfonic acid, 3-nitrobenzenesulfonic acid, 2-nitrobenzenesulfonic acid, 2-nitronaphthalenesulfonic acid, 3-nitronaphthalenesulfonic acid, 2,3-dinitrobenzenesulfonic acid, 2,4-dinitrobenzenesulfonic acid, 2,5-dinitrobenzenesulfonic acid, 2,6-dinitrobenzenesulfonic acid, 3,5-dinitrobenzenesulfonic acid, 2,4,6-trinitrobenzenesulfonic acid, 3-aminobenzenesulfonic acid, 2-aminobenzenesulfonic acid, 2-aminonaphthalenesulfonic acid, 3-aminonaphthalenesulfonic acid, 2,3-diaminobenzenesulfonic acid, 2,4-diaminobenzenesulfonic acid, 2,5-diaminobenzenesulfonic acid, 2,6-diaminobenzenesulfonic acid, 3,5-diaminobenzenesulfonic acid, 2,4,6-triaminobenzenesulfonic acid, 3-hydroxybenzenesulfonic acid, 2-hydroxybenzenesulfonic acid, 2-hydroxynaphthalenesulfonic acid, 3-hydroxynaphthalenesulfonic acid, 2,3-dihydroxybenzenesulfonic acid, 2,4-dihydroxybenzenesulfonic acid, 2, 5-dihydroxybenzenesulfonic acid, 2,6-dihydroxybenzenesulfonic acid, 3, 5-dihydroxybenzenesulfonic acid, 2,3,4-trihydroxyb enzenesulfonic acid, 2,3,5-trihydroxybenzenesulfonic acid, 2,3,6-trihydroxybenzenesulfonic acid, 2,4,5-trihydroxybenzenesulfonic acid, 2,4,6-trihydroxybenzenesulfonic acid, 3,4,5-trihydroxybenzenesulfonic acid, 2,3,4,5-tetrahydroxybenzenesulfonic acid, 2,3,4,6-tetrahydroxybenzenesulfonic acid, 2,3,5,6-tetrahydroxybenzenesulfonic acid, 2,4,5,6-tetrahydroxybenzenesulfonic acid, 3-methoxybenzenesulfonic acid, 2-methoxybenzenesulfonic acid, 2,3-dimethoxybenzenesulfonic acid, 2,4-dimethoxybenzenesulfonic acid, 2,5-dimethoxybenzenesulfonic acid, 2,6-dimethoxybenzenesulfonic acid, 3,5-dimethoxybenzenesulfonic acid, 2,4,6-trimethoxybenzenesulfonic acid, and combinations thereof.

60. The method of claim 58, further comprising rinsing the leaching composition from the PWB.

64. The method of claim 23, wherein the solder comprises lead, tin, alloys thereof, and combinations thereof.

68. The method of claim 23, wherein the PWB is moved manually or automatically to the chemical solder removal module.

72. The method of claim 23, wherein the chemical solder removal module comprises a drum.

76. The method of claim 23, further comprising drying the PWB.

78. The method of claim 23, wherein the at least one component comprises a species selected from the group consisting of transistors, capacitors, heat sinks, integrated circuits, resistors, integrated switches, chips, and processors.

80. The method of claim 58, further comprising recovering the precious metal from the leaching composition.

88. The method of claim 56, wherein the oxidizing agent comprises nitric acid.