Solder alloy, solder paste, and electronic circuit board
First Claim
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1. A tin-silver-copper solder alloy consisting of:
- tin, silver, copper, nickel, antimony, bismuth, and indium, and comprising no germanium except for a trace amount thereof contained as an unavoidable impurity,wherein relative to the total amount of the solder alloy,the silver content is more than 0.05 mass % and less than 0.2 mass %,the copper content is 0.1 mass % or more and 1 mass % or less,the nickel content is 0.01 mass % or more and 0.2 mass % or less,the antimony content is 0.01 mass % or more and less than 2.5 mass %,the bismuth content is 0.01 mass % or more and 4 mass % or less,the indium content is 0.005 mass % or more and 2 mass % or less,the tin content is the remaining content, anda mass ratio of the copper content to the nickel content (Cu/Ni) is less than 12.5.
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Abstract
A solder alloy is a tin-silver-copper solder alloy containing tin, silver, copper, nickel, antimony, bismuth, and indium, and substantially does not contain germanium, wherein relative to the total amount of the solder alloy, the silver content is more than 0.05 mass % and less than 0.2 mass %, and the antimony content is 0.01 mass % or more and less than 2.5 mass %.
52 Citations
11 Claims
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1. A tin-silver-copper solder alloy consisting of:
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tin, silver, copper, nickel, antimony, bismuth, and indium, and comprising no germanium except for a trace amount thereof contained as an unavoidable impurity, wherein relative to the total amount of the solder alloy, the silver content is more than 0.05 mass % and less than 0.2 mass %, the copper content is 0.1 mass % or more and 1 mass % or less, the nickel content is 0.01 mass % or more and 0.2 mass % or less, the antimony content is 0.01 mass % or more and less than 2.5 mass %, the bismuth content is 0.01 mass % or more and 4 mass % or less, the indium content is 0.005 mass % or more and 2 mass % or less, the tin content is the remaining content, and a mass ratio of the copper content to the nickel content (Cu/Ni) is less than 12.5. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A solder paste comprising a flux, and a solder powder composed of a solder alloy,
wherein the solder alloy is a tin-silver-copper solder alloy consisting of tin, silver, copper, nickel, antimony, bismuth, and indium, and comprising no germanium except for a trace amount thereof contained as an unavoidable impurity, wherein relative to the total amount of the solder alloy, the silver content is more than 0.05 mass % and less than 0.2 mass %, the copper content is 0.1 mass % or more and 1 mass % or less, the nickel content is 0.01 mass % or more and 0.2 mass % or less, the antimony content is 0.01 mass % or more and less than 2.5 mass %, the bismuth content is 0.01 mass % or more and 4 mass % or less, the indium content is 0.005 mass % or more and 2 mass % or less, the tin content is the remaining content, and a mass ratio of the copper content to the nickel content (Cu/Ni) is less than 12.5.
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9. An electronic circuit board comprising a soldered portion soldered by a solder paste,
wherein the solder paste comprises a flux, and a solder powder composed of a solder alloy, the solder alloy is a tin-silver-copper solder alloy consisting of tin, silver, copper, nickel, antimony, bismuth, and indium, and comprising no germanium except for a trace amount thereof contained as an unavoidable impurity, wherein relative to the total amount of the solder alloy, the silver content is more than 0.05 mass % and less than 0.2 mass %, the copper content is 0.1 mass % or more and 1 mass % or less, the nickel content is 0.01 mass % or more and 0.2 mass % or less, the antimony content is 0.01 mass % or more and less than 2.5 mass %, the bismuth content is 0.01 mass % or more and 4 mass % or less, the indium content is 0.005 mass % or more and 2 mass % or less, the tin content is the remaining content, and a mass ratio of the copper content to the nickel content (Cu/Ni) is less than 12.5.
Specification
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Current AssigneeHarima Chemicals Incorporated
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Original AssigneeHarima Chemicals Incorporated
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InventorsIkeda, Kazuki, Imamura, Yoji, Piao, JinYu, Takemoto, Tadashi
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Primary Examiner(s)Ng, Sherman
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Application NumberUS14/410,900Publication NumberTime in Patent Office1,138 DaysField of Search174/256, 174/257, 361/771US Class Current1/1CPC Class CodesB23K 1/00 Soldering, e.g. brazing, or...B23K 1/0016 Brazing of electronic compo...B23K 35/0244 Powders, particles or spher...B23K 35/025 Pastes, creams, slurriesB23K 35/22 characterised by the compos...B23K 35/26 with the principal constitu...B23K 35/262 Sn as the principal constit...C22C 13/00 Alloys based on tinC22C 13/02 with antimony or bismuth as...H05K 1/092 Dispersed materials, e.g. c...H05K 3/3463 Solder compositions in rela...
