Method of automatic fluid dispensing for imprint lithography processes

• US 9,223,202 B2
• Filed: 07/09/2007
• Issued: 12/29/2015
• Est. Priority Date: 07/17/2000
• Status: Active Grant

• Current Assignee: Board of Regents of the University of Texas System (University of Texas System)
• Original Assignee: Board of Regents of the University of Texas System (University of Texas System)
• Inventors: Choi, Byung-Jin, Sreenivasan, Sidlgata V., Willson, Carlton Grant, Bailey, Todd C., Ekerdt, John G., Colburn, Mattherw E.
• Primary Examiner(s): LIGHTFOOT, ELENA TSOY
• Application Number:
  US11/774,710
• Publication Number:
  US 20080199816A1
• Time in Patent Office: 3,095 Days
• Field of Search: 427/508, 427/355, 430/322
• US Class Current: 1/1
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: G03F 7/0002 Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
• CPC Class Codes: G03F 7/16 Coating processes; Apparatus therefor applying coatings to base materials in general B05; applying photosensitive compositions to base for photographic purposes G03C1/74
• CPC Class Codes: G03F 7/164 using electric, electrostatic or magnetic means; powder coating
• CPC Class Codes: H01L 2224/29012 in top view
• CPC Class Codes: H01L 2224/3003 Layer connectors having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/3016 Random layout, i.e. layout with no symmetry
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01067 Holmium [Ho]
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

Disclosed herein is an automatic fluid dispensing method and system for dispensing fluid on the surface of a plate-like material, or substrate, including a semiconductor wafer for imprint lithography processes. The dispensing method uses fluid dispenser and a substrate stage that may generate relative lateral motions between a fluid dispenser tip a substrate. Also described herein are methods and devices for creating a planar surface on a substrate using a substantially unpatterned planar template.

Claims

1. A method of forming a layer on a substrate, said method comprising:

disposing a curable liquid solely on said substrate as a predetermined pattern of a plurality of spaced-apart droplets, said curable liquid provided with a viscosity of less than about 20 centipoises, measured at 25°

C., and a surface area less than the surface area of an imprint lithography template;

contacting said curable liquid with a patterning area of said imprint lithography template to spread said curable liquid in said plurality of spaced-apart droplets such that adjacent droplets of said plurality of spaced-apart droplets merge together to form a contiguous layer of said curable liquid over a region of said substrate in superimposition with said patterning area and substantially fill a contiguous gap defined between said template and said substrate with said curable liquid, with said plurality of spaced-apart droplets being arranged in said predetermined pattern to minimize trapping of a gas in said contiguous layer as said droplets merge to form said contiguous layer; and

solidifying said curable liquid in said contiguous layer to form a solidified layer by curing said curable liquid with light passing through said imprint lithography template.

2. A method of forming a layer on a substrate, said method comprising:

disposing a curable liquid solely on said substrate as a predetermined pattern of a plurality of spaced-apart droplets, said curable liquid provided with a viscosity of less than about 5 centipoises, measured at 25°

C., and a surface area less than the surface area of an imprint lithography template;

contacting said curable liquid with a patterning area of said imprint lithography template to spread said curable liquid in said plurality of spaced-apart droplets such that adjacent droplets of said plurality of spaced-apart droplets merge together to form a contiguous layer of said curable liquid over a region of said substrate in superimposition with said patterning area and substantially fill a contiguous qap defined between said template and said substrate with said curable liquid, with said plurality of spaced-apart droplets being arranged in said predetermined pattern to minimize trapping of a gas in said contiguous layer as said droplets merge to form said contiguous layer; and

solidifying said curable liquid in said contiguous layer to form a solidified layer by curing said curable liquid with light passing through said imprint lithography template.