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Thermal management of electronic components

  • US 9,224,672 B1
  • Filed: 12/17/2014
  • Issued: 12/29/2015
  • Est. Priority Date: 12/17/2014
  • Status: Active Grant
First Claim
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1. An electronic device comprising:

  • a multi-layer printed circuit board;

    at least one first electronic component installed on the printed circuit board;

    a first metal frame installed on the printed circuit board, the first metal frame enclosing the at least one electronic component; and

    a first layer of bonded anisotropic conductive film on the first metal frame and the at least one first electronic component connecting thermally a sheet of metal foil on the first frame and on the at least first one electronic component, the sheet covering the at least one first electronic component and the first metal frame.

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