Integrated circuit package and method of making the same

• US 9,224,676 B1
• Filed: 01/08/2015
• Issued: 12/29/2015
• Est. Priority Date: 06/24/1998
• Status: Expired due to Fees

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Glenn, Thomas P.
• Primary Examiner(s): Bachner, Robert
• Application Number:
  US14/592,648
• Time in Patent Office: 355 Days
• Field of Search: 257/667, 257/666, 257/678, 257/684, 257/687, 257/690, 257/692, 257/672, 257/E23.046, 438/106, 438/127, 438/110, 438/112, 438/123, 438/124, 438/125, 438/126, 174/52.2
• US Class Current: 1/1
• CPC Class Codes: H01L 21/4842 Mechanical treatment, e.g. punching, cutting, deforming, cold welding
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49503 characterised by the die pad
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49548 Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01037 Rubidium [Rb]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: Y10T 29/49121 : Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49171 : with encapsulating
• CPC Class Codes: Y10T 428/24207 : with strand[s] or strand-portion[s] between layers [e.g., upholstery trim, etc.]

Abstract

Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad and the contacts have side surfaces which include reentrant portions and asperities to engage the encapsulant.

A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad. The die is electrically connected to the tabs. An encapsulant is applied to the upper and side surfaces of the leadframe. Finally, the leadframe is cut in situ so that the die pad and tabs are severed from the frame, the sides of the package are formed, and the package is severed from the leadframe.

Claims

1. An integrated circuit package comprising:

a metal die pad comprising;

an upper die pad surface;

a lower die pad surface opposite the upper die pad surface; and

a plurality of die pad sides between the upper die pad surface and the lower die pad surface;

a metal contact separate from the metal die pad and comprising;

an upper contact surface;

a lower contact surface opposite the upper contact surface and smaller than the upper contact surface;

a first contact end between the upper contact surface and the lower contact surface and facing the die pad, the first contact end comprising a plurality of distinct surfaces comprising;

an upper first contact end surface that extends to the upper contact surface, where the upper first contact end surface comprises a rounded profile, at least a portion of which has a slope that is orthogonal to the upper contact surface; and

a lower first contact end surface that extends to the lower contact surface;

a second contact end opposite the first contact end;

a first contact side between the upper and lower contact surfaces and between the first and second contact ends; and

a second contact side opposite the first contact side;

an integrated circuit die coupled to the upper die pad surface;

a wire electrically connecting the die to the contact; and

a package body comprising an encapsulant material, where the encapsulant material covers the die, covers the wire, covers the upper and lower first contact end surfaces, and exposes the lower contact surface.

2. The package of claim 1, wherein the upper first contact end surface and the lower first contact end surface directly contact each other.

3. The package of claim 2, wherein the upper first contact end surface and the lower first contact end surface contact each other at a right angle.

4. The package of claim 1, wherein the lower first contact end surface comprises a profile, least a portion of which has a slope that is orthogonal to the lower contact surface.

5. The package of claim 1, wherein the lower contact surface has a circular perimeter at the first contact end, and the lower contact surface has a rectilinear perimeter at the second contact end.

6. The package of claim 1, wherein at least a portion of each of the first and second contact sides comprises a plurality of distinct surfaces comprising:

an upper contact side surface that extends to the upper contact surface, where the upper contact side surface comprises a rounded profile, at least a portion of which has a slope that is orthogonal to the upper contact surface; and

a lower contact side surface that extends to the lower contact surface.

7. The package of claim 1, wherein the rounded profile is convex.

8. The package of claim 1, wherein the package is a quad flat no-lead package.

9. An integrated circuit package comprising:

a metal die pad comprising;

an upper die pad surface;

a lower die pad surface opposite the upper die pad surface; and

a plurality of die pad sides between the upper die pad surface and the lower die pad surface;

a metal contact separate from the metal die pad and comprising;

an upper contact surface;

a lower contact surface opposite the upper contact surface;

a first contact end between the upper contact surface and the lower contact surface and facing the die pad;

a second contact end opposite the first contact end;

a first contact side between the upper and lower contact surfaces and between the first and second contact ends; and

a second contact side opposite the first contact side and comprising a protruding central peak that protrudes from the second contact side in a first direction parallel to the lower contact surface, and protrudes in the first direction beyond the lower contact surface;

an integrated circuit die coupled to the upper die pad surface;

a wire electrically connecting the die to the contact; and

a package body comprising an encapsulant material, where the encapsulant material covers the die, covers the wire, covers the protruding central peak, and exposes the lower contact surface.

10. The package of claim 9, wherein the first contact side comprises a protruding central peak that protrudes from the first contact side in a second direction opposite the first direction, and protrudes in the second direction beyond the lower contact surface.

11. The package of claim 10, wherein:

the lower die pad surface and the lower contact surface are exposed at a lower exterior surface of the encapsulant material; and

the second contact end is exposed at a side exterior surface of the encapsulant material.

12. The package of claim 9, wherein the lower contact surface has a circular perimeter at the first contact end, and the lower contact surface has a rectilinear perimeter at the second contact end.

13. The package of claim 9, wherein the second contact side comprises:

an upper second contact side surface that extends to the upper contact surface and comprises a rounded profile;

a lower second contact side surface that extends to the lower contact surface and comprises a rounded profile;

and the upper second contact side surface and the lower second contact side surface meet at the protruding central peak.

14. An integrated circuit package comprising:

a metal die pad comprising;

an upper die pad surface;

a lower die pad surface opposite the upper die pad surface; and

a plurality of die pad sides between the upper die pad surface and the lower die pad surface;

a metal contact separate from the metal die pad and comprising;

an upper contact surface;

a lower contact surface opposite the upper contact surface and smaller than the upper contact surface;

a first contact end between the upper contact surface and the lower contact surface and facing the die pad, the first contact end comprising a plurality of distinct surfaces comprising;

an upper first contact end surface that extends to the upper contact surface, where the upper first contact end surface comprises a rounded convex profile; and

a lower first contact end surface that extends to the lower contact surface;

a second contact end opposite the first contact end;

a first contact side between the upper and lower contact surfaces and between the first and second contact ends; and

a second contact side opposite the first contact side;

an integrated circuit die coupled to the upper die pad surface;

a conductor electrically connecting the die to the contact; and

a package body comprising an encapsulant material, where the encapsulant material covers the die, covers the conductor, covers the upper and lower first contact end surfaces, and exposes the lower contact surface.

15. The package of claim 14, wherein the lower first contact end surface comprises a non-convex profile.

16. The package of claim 14, wherein the lower first contact end surface comprises a profile, least a portion of which has a slope that is orthogonal to the lower contact surface.

17. The package of claim 14, wherein the lower contact surface has a circular perimeter at the first contact end, and the lower contact surface has a rectilinear perimeter at the second contact end.

18. The package of claim 14, wherein at least a portion of each of the first and second contact sides comprises a plurality of distinct surfaces comprising:

an upper contact side surface that extends to the upper contact surface, where the upper contact side surface comprises a rounded convex profile; and

a lower contact side surface that extends to the lower contact surface.

19. The package of claim 14, wherein the package is a quad flat no-lead package.

20. The package of claim 14, wherein the conductor is a wire.