Displays with vias
First Claim
1. A method of forming an electronic device display, the method comprising:
- depositing a conductive layer on a display substrate;
in a single step, removing a portion of the display substrate and a portion of the conductive layer to form a via through the display substrate and the conductive layer;
selectively removing an additional portion of the conductive layer to expose a region of the display substrate; and
forming light-emitting diode structures in the exposed region of the display substrate to form an active region of the electronic device display.
1 Assignment
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Accused Products
Abstract
An electronic device may include a display. The display may be an organic light-emitting diode display. The organic light-emitting diode display may have a substrate layer, a layer of organic light-emitting diode structures, and a layer of sealant. Vias may be formed in the substrate layer. The vias may be formed before completion of the display or after completion of the display. The vias may be filled with metal using electroplating or other metal deposition techniques. The vias may be connected to contacts on the rear surface of the display. The vias may be located in active regions of the display or inactive regions of the display. The display may include a top surface emission portion and a bottom surface emission portion.
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Citations
22 Claims
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1. A method of forming an electronic device display, the method comprising:
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depositing a conductive layer on a display substrate; in a single step, removing a portion of the display substrate and a portion of the conductive layer to form a via through the display substrate and the conductive layer; selectively removing an additional portion of the conductive layer to expose a region of the display substrate; and forming light-emitting diode structures in the exposed region of the display substrate to form an active region of the electronic device display. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of forming an electronic device display, the method comprising:
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forming a light-emitting diode layer on a display substrate; depositing a sealant layer over the light-emitting diode layer; and forming a via that extends through the display substrate and the light-emitting diode layer without extending through the sealant layer. - View Dependent Claims (9, 10, 11)
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12. A method of forming an electronic device display, the method comprising:
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forming a light-emitting diode layer on a display substrate having first and second opposing surfaces, wherein forming the light-emitting diode layer comprises forming a first layer of organic emissive material on the first surface of the display substrate; forming a second layer of organic emissive material on the second surface of the display substrate; and forming a via through the display substrate. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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19. A method of forming an electronic device display, the method comprising:
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with heating equipment, at least partially melting a display substrate; and inserting a conductive rod through the partially melted display substrate to form a via that is completely filled by the conductive rod. - View Dependent Claims (20, 21, 22)
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Specification