Strain isolation structures for stretchable electronics
First Claim
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1. An apparatus comprising:
- a device component;
a conductive stretchable interconnect electrically coupled with the device component at a junction region, the conductive stretchable interconnect being positioned in a first layer of the apparatus;
a buffer structure positioned in a second layer of the apparatus that is spaced from the first layer of the apparatus, the buffer structure being formed from a non-conductive material; and
an encapsulant encapsulating the device component and the junction region.
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Abstract
Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young'"'"'s modulus than an encapsulant of the conformable electronic system.
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Citations
34 Claims
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1. An apparatus comprising:
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a device component; a conductive stretchable interconnect electrically coupled with the device component at a junction region, the conductive stretchable interconnect being positioned in a first layer of the apparatus; a buffer structure positioned in a second layer of the apparatus that is spaced from the first layer of the apparatus, the buffer structure being formed from a non-conductive material; and an encapsulant encapsulating the device component and the junction region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. An apparatus comprising:
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a device component; a conductive stretchable interconnect electrically coupled with the device component at a junction region, the conductive stretchable interconnect being positioned in a first layer of the apparatus; a first buffer structure positioned in a second layer of the apparatus that is spaced from the first layer of the apparatus, the first buffer structure being formed from a non-conductive material; a second buffer structure positioned in a third layer of the apparatus that is spaced from the first and second layers of the apparatus, the second buffer structure being formed from a non-conductive material; and an encapsulant encapsulating the device component and the junction region. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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Specification