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Power semiconductor module

  • US 9,226,430 B2
  • Filed: 03/07/2013
  • Issued: 12/29/2015
  • Est. Priority Date: 12/27/2012
  • Status: Expired due to Fees
First Claim
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1. A power semiconductor module comprising:

  • a common connection terminal that is a collector terminal;

    external connection terminals, including a gate connection terminal and an emitter connection terminal;

    a heat dissipation substrate electrically connected to the common connection terminal; and

    a plurality of electronic elements disposed on the heat dissipation substrate, the electronic elements having varying spaces therebetween and being disposed such that spaces therebetween are increased in width in a direction closer to the common connection terminal.

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