Neurostimulator interconnection apparatus, system, and method

• US 9,227,052 B2
• Filed: 07/01/2014
• Issued: 01/05/2016
• Est. Priority Date: 07/02/2013
• Status: Expired due to Fees

• Current Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Original Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Inventors: Robnett, Ronald H.
• Primary Examiner(s): MANUEL, GEORGE C
• Application Number:
  US14/320,676
• Publication Number:
  US 20150018912A1
• Time in Patent Office: 553 Days
• US Class Current: 1/1
• CPC Class Codes: A61B 5/064 using markers A61B5/062 takes precedence
• CPC Class Codes: A61B 8/0841 for locating instruments
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0551 Spinal or peripheral nerve electrodes
• CPC Class Codes: A61N 1/0553 Paddle shaped electrodes, e.g. for laminotomy
• CPC Class Codes: A61N 1/36017 with leads or electrodes penetrating the skin
• CPC Class Codes: A61N 1/36021 for treatment of pain
• CPC Class Codes: A61N 1/36071 Pain
• CPC Class Codes: A61N 1/36125 Details of circuitry or electric components
• CPC Class Codes: A61N 1/36139 with automatic adjustment
• CPC Class Codes: A61N 1/36146 specified by the stimulation parameters
• CPC Class Codes: A61N 1/36153 Voltage A61N1/3616 takes precedence
• CPC Class Codes: A61N 1/37223 Circuits for electromagnetic coupling
• CPC Class Codes: A61N 1/37235 Aspects of the external programmer
• CPC Class Codes: A61N 1/37252 Details of algorithms or data aspects of communication system, e.g. handshaking, transmitting specific data or segmenting data
• CPC Class Codes: A61N 1/3752 Details of casing-lead connections
• CPC Class Codes: A61N 1/3787 from an external energy source

Abstract

In various examples, a neurostimulation interconnection apparatus apparatus includes a substrate disposed within a header of a neurostimulation device. A spring contact is mounted to the substrate. The spring contact is oriented to accept and apply a clamping force to a proximal contact of a lead body to electrically couple the proximal contact of the lead body with the spring contact with insertion of the proximal contact within the spring contact. A trace is disposed on the substrate from the spring contact to a pin of a feedthrough of the neurostimulation device. The trace electrically couples the spring contact with the pin of the feedthrough.

Claims

1. A neurostimulation interconnection apparatus comprising:

a substrate disposed within a header of a neurostimulation device;

a spring contact mounted directly to the substrate, the spring contact being oriented on the substrate to accept and apply a clamping force to a proximal contact of a lead body to electrically couple the proximal contact of the lead body with the spring contact upon insertion of the proximal contact within the spring contact; and

a trace disposed on the substrate from the spring contact to a pin of a feedthrough of the neurostimulation device, the trace electrically coupling the spring contact with the pin of the feedthrough.

2. The neurostimulation interconnection apparatus of claim 1, wherein the substrate includes a printed circuit board.

3. The neurostimulation interconnection apparatus of claim 1, wherein the spring contact includes a single-piece spring contact.

4. The neurostimulation interconnection apparatus of claim 1, wherein the spring contact includes a multiple-piece spring contact.

5. The neurostimulation interconnection apparatus of claim 1, wherein the spring contact includes a leaf spring contact.

6. The neurostimulation interconnection apparatus of claim 5, wherein the leaf spring contact includes a stamped leaf spring contact.

7. The neurostimulation interconnection apparatus of claim 1, wherein the spring contact includes a coiled spring contact.

8. The neurostimulation interconnection apparatus of claim 1, wherein the substrate includes two or more spring contacts mounted to the substrate.

9. The neurostimulation interconnection apparatus of claim 8, wherein the two or more spring contacts are oriented on the substrate in line with one another and are spaced to accommodate a corresponding two or more proximal contacts of the lead body to electrically couple the two or more proximal contacts of the lead body with the two or more spring contacts with insertion of the two or more proximal contacts within the two or more spring contacts.

10. The neurostimulation interconnection apparatus of claim 1, wherein the substrate includes a plurality of spring contacts mounted to the substrate in line with one another, the plurality of spring contacts being spaced to accommodate and electrically couple to a corresponding plurality of proximal contacts of the lead body.

11. A neurostimulation interconnection apparatus comprising:

a printed circuit board disposed within a header of a neurostimulation device, the printed circuit board including a plurality of contact mounts;

a plurality of traces disposed on the printed circuit board, each of the traces extending from one of the contact mounts to a pin of a feedthrough of the neurostimulation device; and

a plurality of spring contacts, each of the spring contacts directly mounted to one of the contact mounts of the printed circuit board, the spring contacts being oriented on the substrate to accept and apply a clamping force to a corresponding number of proximal contacts of a lead body to electrically couple the proximal contacts of the lead body with the spring contacts upon insertion of the proximal contacts within the spring contacts, and, in turn electrically couple each of the spring contacts with one of the pins of the feedthrough.

12. The neurostimulation interconnection apparatus of claim 11, wherein each of the spring contacts includes a single-piece spring contact.

13. The neurostimulation interconnection apparatus of claim 11, wherein each of the spring contacts includes a multiple-piece spring contact.

14. The neurostimulation interconnection apparatus of claim 11, wherein each of the spring contacts includes a leaf spring contact.

15. The neurostimulation interconnection apparatus of claim 14, wherein each of the leaf spring contacts includes a stamped leaf spring contact.

16. The neurostimulation interconnection apparatus of claim 11, wherein each of the spring contacts includes a coiled spring contact.

17. The neurostimulation interconnection apparatus of claim 11, wherein the spring contacts are mounted on the printed circuit board substantially in-line with one another, the plurality of spring contacts being spaced, such that, with insertion of the proximal contacts within the spring contacts, each of the plurality of spring contacts is aligned with a corresponding one of the plurality of proximal contacts.

18. A neurostimulation interconnection apparatus comprising:

a substrate disposed within a header of a neurostimulation device, the substrate including a plurality of contact mounts;

a plurality of traces, each of the traces extending along the substrate from one of the contact mounts to a pin of a feedthrough of the neurostimulation device; and

a plurality of spring contacts, each of the spring contacts mounted directly to one of the contact mounts of the substrate, the spring contacts being oriented on the substrate to accept and apply a clamping force to a corresponding number of proximal contacts of a lead body to electrically couple the proximal contacts of the lead body with the spring contacts upon insertion of the proximal contacts within the spring contacts, and, in turn electrically couple each of the spring contacts with one of the pins of the feedthrough.

19. The neurostimulation interconnection apparatus of claim 18, wherein each of the spring contacts includes a leaf spring contact.

20. The neurostimulation interconnection apparatus of claim 18, wherein each of the spring contacts includes a coiled spring contact.