Vibration isolation interposer die
First Claim
Patent Images
1. An interposer chip comprising:
- a die including;
a base portion;
a chip mounting portion;
one or more flexures connecting the base portion to the chip mounting portion;
a first plurality of projections extending from the base portion towards the chip mounting portion; and
a second plurality of projections extending from the chip mounting portion towards the base portion and extending into interstices formed by first plurality of projections.
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Abstract
In an example, an interposer chip is provided. The interposer chip includes a base portion and a chip mounting portion. The interposer chip also includes one or more flexures connecting the base portion to the chip mounting portion. Additionally, a first plurality of projections extends from the base portion towards the chip mounting portion, and a second plurality of projections extends from the chip mounting portion towards the base portion and extending into interstices formed by first plurality of projections.
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Citations
20 Claims
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1. An interposer chip comprising:
a die including; a base portion; a chip mounting portion; one or more flexures connecting the base portion to the chip mounting portion; a first plurality of projections extending from the base portion towards the chip mounting portion; and a second plurality of projections extending from the chip mounting portion towards the base portion and extending into interstices formed by first plurality of projections. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. An inertial measurement unit (IMU) comprising:
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an interposer die including; a base portion configured to mount to a circuit board; a chip mounting portion configured to have a chip mounted thereon; one or more spring members connecting the base portion to the chip mounting portion; wherein the base portion includes a first plurality of generally planar projections extending towards the chip mounting portion; and wherein the chip mounting portion includes a second plurality of generally planar projections extending towards the base portion and into interstices formed by the first plurality of generally planar projections such that one or more apertures are defined that weave around the first and second plurality of generally planar projections; and a sensor chip mounted to the chip mounting portion of the interposer die, the sensor chip including; at least three micro-electro-mechanical system (MEMS) gyroscopes; and at least three MEMS accelerometers. - View Dependent Claims (15, 16, 17, 18, 19)
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20. A system comprising:
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one or more processing devices; one or more memory devices coupled to the one or more processing devices, the one or more memory devices including instructions which, when executed by the one or more processing devices, cause the one or more processing devices to perform navigation procedures; an inertial measurement unit (IMU) mounted to a circuit board and coupled to the one or more processing devices, the IMU including; an interposer die including; a base portion mounted to the circuit board; a chip mounting portion configured to have a chip mounted thereon; one or more flexures connecting the base portion to the chip mounting portion; a first plurality of projections extending from the base portion towards the chip mounting portion; and a second plurality of projections extending from the chip mounting portion towards the base portion and extending into interstices formed by first plurality of projections; and a sensor chip mounted to the chip mounting portion of the interposer die, the sensor chip including; at least three micro-electro-mechanical system (MEMS) gyroscopes; and at least three MEMS accelerometers.
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Specification