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Vibration isolation interposer die

  • US 9,227,835 B2
  • Filed: 11/18/2011
  • Issued: 01/05/2016
  • Est. Priority Date: 11/23/2010
  • Status: Active Grant
First Claim
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1. An interposer chip comprising:

  • a die including;

    a base portion;

    a chip mounting portion;

    one or more flexures connecting the base portion to the chip mounting portion;

    a first plurality of projections extending from the base portion towards the chip mounting portion; and

    a second plurality of projections extending from the chip mounting portion towards the base portion and extending into interstices formed by first plurality of projections.

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