Touch panel

• US 9,229,591 B2
• Filed: 01/18/2013
• Issued: 01/05/2016
• Est. Priority Date: 01/18/2012
• Status: Active Grant

• Current Assignee: LG Innotek Company Limited (LG Corporation)
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Kim, Byung Soo, Lee, Keun Sik, Jo, Ji Won, Hong, Hyuk Jin
• Primary Examiner(s): Mengistu, Amare
• Assistant Examiner(s): Nadkarni, Sarvesh J
• Application Number:
  US13/744,829
• Publication Number:
  US 20130181925A1
• Time in Patent Office: 1,082 Days
• Field of Search: 345173-175
• US Class Current: 1/1
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/04164 Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes

Abstract

Disclosed is a touch panel. The touch panel includes a sensing electrode pattern layer on a transparent substrate; a wire connected to the sensing electrode pattern layer; a bonding pad formed at an end of the wire and connected to a flexible printed circuit board (FPCB); and an adhesive insulating layer on one surface of the sensing electrode pattern layer and on a region except for the bonding pad, wherein the adhesive insulating layer comprises a first adhesive insulating layer and a second adhesive insulating layer, and an area of the first adhesive insulating layer is different from an area of the second adhesive insulating layer.

Claims

1. A touch panel comprising:

a first sensing electrode pattern layer on a top surface of a transparent substrate;

a first wire connected to the first sensing electrode pattern layer, wherein the first wire and the first sensing electrode pattern layer are aligned in a first plane parallel to the top surface of the transparent substrate;

a first bonding pad formed at an end of the first wire and connected to a flexible printed circuit board (FPCB), wherein the first bonding pad is aligned with the first wire and the first sensing electrode pattern in the first plane;

a first adhesive insulating layer on the first sensing electrode pattern layer;

a second sensing electrode pattern layer on the first adhesive insulating layer;

a second wire connected to the second sensing electrode pattern layer, wherein the second wire and the second sensing electrode pattern layer are aligned in a second plane parallel to the top surface of the transparent substrate;

a second bonding pad formed at an end of the second wire and connected to the FPCB, wherein the second bonding pad is aligned with the second wire and the second sensing electrode pattern in the second plane; and

a second adhesive insulating layer on the second sensing electrode pattern layer,

wherein the first adhesive insulating layer contacts at least a portion of the first sensing electrode pattern layer,

wherein the second adhesive insulating layer contacts at least a portion of the second sensing electrode pattern layer, and

wherein an area of the first adhesive insulating layer is different from an area of the second adhesive insulating layer.

2. The touch panel of claim 1, wherein the first adhesive insulating layer is formed on the first sensing electrode pattern layer and the first wire but not on the first bonding pad, and

wherein the second adhesive insulating layer is formed on the second sensing electrode pattern layer and the second wire but not on the second bonding pad.

3. The touch panel of claim 2, wherein the first adhesive insulating layer is formed at a region corresponding to the second sensing electrode pattern layer, the second wire, and the second bonding pad, and the second adhesive insulating layer is formed at a region corresponding to the first sensing electrode pattern layer.

4. The touch panel of claim 1, wherein the first adhesive insulating layer is formed at a region corresponding to the second sensing electrode pattern layer, the second wire, and the second bonding pad, and the second adhesive insulating layer is formed at a region corresponding to the first sensing electrode pattern layer and the first wire.

5. The touch panel of claim 1, wherein the first adhesive insulating layer is not formed on the first bonding pad and the second adhesive insulating layer is not formed on the second bonding pad.

6. The touch panel of claim 1, wherein the first adhesive insulating layer is formed on the first wire, and the second adhesive insulating layer is formed on the second wire.

7. The touch panel of claim 6, wherein the first adhesive insulating layer is formed at a region corresponding to the second sensing electrode pattern layer and the second wire, and the second adhesive insulating layer is formed corresponding to the first sensing electrode pattern layer and the first wire.