Method of forming 3D integrated microelectronic assembly with stress reducing interconnects
First Claim
1. A method of forming a microelectronic assembly, comprising:
- providing a first microelectronic element that comprises;
a substrate with first and second opposing surfaces,a semiconductor device integrally formed on or in the first surface of the substrate, andconductive pads at the first surface which are electrically coupled to the semiconductor device;
providing a second microelectronic element comprising;
a handler with first and second opposing surfaces, and a cavity formed into the first surface that extends toward but does not reach the second surface,an IC chip disposed in the cavity and having a bottom surface with conductive pads facing away from the second surface;
forming conductive elements each extending from one of the conductive pads and through the substrate to the second surface, of the first microelectronic element;
forming conductive elements each extending between the first and second surfaces of the handler;
integrating the first and second microelectronic elements to each other such that the second surfaces face each other and such that each of the conductive elements of the first microelectronics element is electrically coupled to at least one of the conductive elements of the second microelectronics element;
forming electrical interconnects over the first surface of the handler with each electrically coupled to at least one of the conductive elements of the second microelectronics element; and
forming electrical interconnects over the bottom surface of the IC chip with each electrically coupled to at least one of the conductive pads of the IC chip.
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Accused Products
Abstract
A microelectronic assembly and method of making, which includes a first microelectronic element (including a substrate with first and second opposing surfaces, a semiconductor device, and conductive pads at the first surface which are electrically coupled to the semiconductor device) and a second microelectronic element (including a handler with first and second opposing surfaces, a second semiconductor device, and conductive pads at the handler first surface which are electrically coupled to the second semiconductor device). The first and second microelectronic elements are integrated such that the second surfaces face each other. The first microelectronic element includes conductive elements each extending from one of its conductive pads, through the substrate to the second surface. The second microelectronic element includes conductive elements each extending between the handler first and second surfaces. The conductive elements of the first microelectronics element are electrically coupled to the conductive elements of the second microelectronics element.
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Citations
12 Claims
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1. A method of forming a microelectronic assembly, comprising:
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providing a first microelectronic element that comprises; a substrate with first and second opposing surfaces, a semiconductor device integrally formed on or in the first surface of the substrate, and conductive pads at the first surface which are electrically coupled to the semiconductor device; providing a second microelectronic element comprising; a handler with first and second opposing surfaces, and a cavity formed into the first surface that extends toward but does not reach the second surface, an IC chip disposed in the cavity and having a bottom surface with conductive pads facing away from the second surface; forming conductive elements each extending from one of the conductive pads and through the substrate to the second surface, of the first microelectronic element; forming conductive elements each extending between the first and second surfaces of the handler; integrating the first and second microelectronic elements to each other such that the second surfaces face each other and such that each of the conductive elements of the first microelectronics element is electrically coupled to at least one of the conductive elements of the second microelectronics element; forming electrical interconnects over the first surface of the handler with each electrically coupled to at least one of the conductive elements of the second microelectronics element; and forming electrical interconnects over the bottom surface of the IC chip with each electrically coupled to at least one of the conductive pads of the IC chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification