Light emitting diode package structure

• US 9,231,168 B2
• Filed: 05/02/2014
• Issued: 01/05/2016
• Est. Priority Date: 05/02/2013
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Wen, Shih-Yi, Hsu, Chen-Peng, Hu, Hung-Lieh, Yu, Yu-Chen, Hsieh, Chia-Fen, Lin, Re-Ching
• Primary Examiner(s): Mandala, Victor A
• Application Number:
  US14/267,919
• Publication Number:
  US 20140327025A1
• Time in Patent Office: 613 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder

Abstract

A light-emitting diode package structure including a chip carrier portion, a light-emitting diode chip, and a package material is provided. The light-emitting diode chip is disposed on the chip carrier portion of the package. The package material is filled in the chip carrier portion and covers the light-emitting diode chip. The package material includes a matrix material, a plurality of first powder particles, and a plurality of second powder particles. The first powder particles and the second powder particles are distributed in the matrix material. Each first powder particle is a wavelength conversion material. Each second powder particle has a shell-like structure.

Claims

1. A light-emitting diode package structure, comprising:

a package having a chip carrier portion;

a light-emitting diode chip disposed on the chip carrier portion of the package; and

a package material disposed on the chip carrier portion and covering the light-emitting diode chip, wherein the package material comprises;

a matrix material;

a plurality of first powder particles distributed in the matrix material, wherein each first powder particle is a wavelength conversion material; and

a plurality of second powder particles distributed in the matrix material, wherein each second powder particle comprises a shell, and at least one of the first powder particles is bonded to at least one of the second powder particles to form a composite particle.

2. The light-emitting diode package structure of claim 1, wherein the matrix material has a first density when uncured, the composite particle has a second density, and the second density is not greater than the first density.

3. The light-emitting diode package structure of claim 2, wherein a number of the composite particle is a plural, and the composite particles are uniformly distributed in the matrix material such that a difference in distribution density of the composite particles distributed in two different regions of the matrix material is not greater than 15%.

4. The light-emitting diode package structure of claim 2, wherein the package material has a powder concentrated portion and a powder sparse portion, and a distribution density of each of the first powder particles and the second powder particles in the powder concentrated portion is greater than a distribution density of each thereof in the powder sparse portion.

5. The light-emitting diode package structure of claim 1, wherein at least one of the first powder particles is bonded to at least one of the second powder particles through a binding agent.

6. The light-emitting diode package structure of claim 5, wherein a light transmittance of the binding agent is greater than 70%.

7. The light-emitting diode package structure of claim 5, wherein the binding agent covers at least one of the first powder particles and at least one of the second powder particles.

8. The light-emitting diode package structure of claim 5, wherein the composite particle and the matrix material have the same polarity.

9. The light-emitting diode package structure of claim 5, wherein the binding agent comprises silicon oxide, silicate, titanium oxide, zinc oxide, tantalum oxide, aluminum oxide, or a combination thereof.

10. The light-emitting diode package structure of claim 1, wherein a light transmittance of the second powder particles is greater than 70%.

11. The light-emitting diode package structure of claim 1, wherein each second powder particle further comprises a core material filled in the shell.

12. The light-emitting diode package structure of claim 11, wherein the core material is magnetic.

13. The light-emitting diode package structure of claim 1, wherein the shell comprises silicon oxide, aluminum oxide, titanium oxide, chromium oxide, or a combination thereof.

14. The light-emitting diode package structure of claim 1, wherein a particle size of each second powder particle ranges from 0.01 μ

m to 100 μ

m.

15. The light-emitting diode package structure of claim 1, wherein the matrix material is a colloid material.

16. The light-emitting diode package structure of claim 1, wherein the second powder particles account for 0.5% to 10% of a total weight of the first powder particles and the second powder particles.

17. The light-emitting diode package structure of claim 1, wherein a density of the second powder particles is not greater than a density of the matrix material when uncured.

18. The light-emitting diode package structure of claim 1, wherein the package material has a powder concentrated portion and a powder sparse portion, the powder sparse portion is located between the light-emitting diode chip and the powder concentrated portion, and a distribution density of each of the first powder particles and the second powder particles in the powder concentrated portion is greater than a distribution density of each thereof in the powder sparse portion.