Light emitting diode package structure
First Claim
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1. A light-emitting diode package structure, comprising:
- a package having a chip carrier portion;
a light-emitting diode chip disposed on the chip carrier portion of the package; and
a package material disposed on the chip carrier portion and covering the light-emitting diode chip, wherein the package material comprises;
a matrix material;
a plurality of first powder particles distributed in the matrix material, wherein each first powder particle is a wavelength conversion material; and
a plurality of second powder particles distributed in the matrix material, wherein each second powder particle comprises a shell, and at least one of the first powder particles is bonded to at least one of the second powder particles to form a composite particle.
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Abstract
A light-emitting diode package structure including a chip carrier portion, a light-emitting diode chip, and a package material is provided. The light-emitting diode chip is disposed on the chip carrier portion of the package. The package material is filled in the chip carrier portion and covers the light-emitting diode chip. The package material includes a matrix material, a plurality of first powder particles, and a plurality of second powder particles. The first powder particles and the second powder particles are distributed in the matrix material. Each first powder particle is a wavelength conversion material. Each second powder particle has a shell-like structure.
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Citations
18 Claims
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1. A light-emitting diode package structure, comprising:
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a package having a chip carrier portion; a light-emitting diode chip disposed on the chip carrier portion of the package; and a package material disposed on the chip carrier portion and covering the light-emitting diode chip, wherein the package material comprises; a matrix material; a plurality of first powder particles distributed in the matrix material, wherein each first powder particle is a wavelength conversion material; and a plurality of second powder particles distributed in the matrix material, wherein each second powder particle comprises a shell, and at least one of the first powder particles is bonded to at least one of the second powder particles to form a composite particle. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification