Screen printing method of LED module with phosphor
First Claim
1. A screen printing method of LED module with phosphor, wherein the method comprising:
- board preparation;
providing an LED module board, the LED module board comprises a substrate and a plurality of LED sources fixed on the substrate;
the LED sources are flip chip structural, the metal electrodes thereof are fixed to the bonding pads of the substrate;
screen setting;
providing a screen board, the meshes thereof are corresponding to the shiny sides of the LED sources of the substrate one by one, a projection of each mesh to the shiny side of the corresponding LED source has similar shape with the shiny side of the LED source, the projection size of each mesh is 1.03 to 1.2 of the size scale of the shiny side of the corresponding LED source;
the distance between the bottom of the screen board and the LED sources is 0.2-1 mm;
printing;
printing the top of the screen board with allocated colloidal phosphor until each mesh is coated fully, before removing the screen board; and
forming;
baking the printed substrates in a baker to solidify the phosphor.
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Accused Products
Abstract
A screen printing method of LED module with phosphor includes: board preparation providing an LED module board with a substrate and a plurality of LED sources fixed on the substrate. The LED sources are flip chip structural and the metal electrodes thereof are fixed to the bonding pads of the substrate. A screen board is provided with meshes corresponding to the shiny sides of the LED sources of the substrate one by one. A projection of each mesh to the shiny side of the corresponding LED source has similar shape with the shiny side of the LED source. The top of the screen board is printed with allocated colloidal phosphor until each mesh is coated fully. The printed substrates are baked to solidify the phosphor. The periphery of the shiny side is fully coated.
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Citations
9 Claims
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1. A screen printing method of LED module with phosphor, wherein the method comprising:
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board preparation;
providing an LED module board, the LED module board comprises a substrate and a plurality of LED sources fixed on the substrate;
the LED sources are flip chip structural, the metal electrodes thereof are fixed to the bonding pads of the substrate;screen setting;
providing a screen board, the meshes thereof are corresponding to the shiny sides of the LED sources of the substrate one by one, a projection of each mesh to the shiny side of the corresponding LED source has similar shape with the shiny side of the LED source, the projection size of each mesh is 1.03 to 1.2 of the size scale of the shiny side of the corresponding LED source;
the distance between the bottom of the screen board and the LED sources is 0.2-1 mm;printing;
printing the top of the screen board with allocated colloidal phosphor until each mesh is coated fully, before removing the screen board; andforming;
baking the printed substrates in a baker to solidify the phosphor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification