Method for making short run radio frequency identification tags and labels

• US 9,231,290 B2
• Filed: 06/14/2011
• Issued: 01/05/2016
• Est. Priority Date: 06/14/2010
• Status: Active Grant

• Current Assignee: Avery Dennison Retail Information Services LLC (Avery Dennison Corporation)
• Original Assignee: Avery Dennison Corporation
• Inventors: Forster, Ian J., Oelsner, Christian K., Revels, Robert, Kingston, Benjamin, Cockerell, Peter, Howard, Norman
• Primary Examiner(s): TRINH, MINH N
• Application Number:
  US13/160,318
• Publication Number:
  US 20120060359A1
• Time in Patent Office: 1,666 Days
• Field of Search: 296/00, 29831-834, 29846-847, 3405711-5717, 343/700.MS, 235487-492
• US Class Current: 1/1
• CPC Class Codes: B23K 26/364 for making a groove or trench, e.g. for scribing a break initiation groove
• CPC Class Codes: B32B 2305/10 Fibres of continuous length
• CPC Class Codes: B32B 2307/302 Conductive
• CPC Class Codes: B32B 2317/12 Paper, e.g. cardboard
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: B32B 37/12 characterised by using adhesives
• CPC Class Codes: B32B 38/10 Removing layers, or parts of layers, mechanically or chemically
• CPC Class Codes: B32B 38/145 Printing
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01P 11/003 Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
• CPC Class Codes: Y10T 156/1052 with cutting, punching, tearing or severing
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49156 with selective destruction of conductive paths
• CPC Class Codes: Y10T 29/5317 : Laminated device
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 428/24802 : Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/24917 : including metal layer
• CPC Class Codes: Y10T 428/2809 : including irradiated or wave energy treated component
• CPC Class Codes: Y10T 428/2817 : Heat sealable

Abstract

The present invention is a method for producing ready to use RFID devices in a convenient and economical manner. The method in one embodiment includes a substrate having a first a second face and applying a pattern of adhesive to the first face of the substrate. A conductive foil is then laminated to the pattern of adhesive, and the conductive foil is cut to form a plurality of antenna patterns. A chip is applied to each of the antenna patterns. Printing is applied on the second face of the substrate to create distinct printed areas. Each of the printed areas is then read and the information is matched with each of the distinct printed areas to information encoded in each of the chips. Finally, each distinct printed area is separated from the substrate.

Claims

1. A method for producing a ready to use RFID device for consumer goods, comprising;

providing a substrate, the substrate having first and second faces;

applying a pattern of adhesive to the first face of the substrate;

laminating a conductive foil to the pattern of adhesive;

cutting the conductive foil to form to form a plurality of antenna patterns;

applying a chip of plurality chips to each of the antenna patterns;

printing on the second face of the substrate to create distinct printed areas;

encoding each of the chips and placing each of the chips on each of the antenna patterns;

reading information of each of the distinct printed areas;

matching information of each of the distinct printed areas to information encoded in each of the chips; and

separating each of the distinct printed areas from the substrate.

2. The method of claim 1, including a further step of punching out distinct printed areas where the information of each of the printed areas does not match the encoded information after the step of matching.

3. The method of claim 1, wherein the step of printing includes machine and human readable indicia.

4. The method of claim 1, wherein the step of cutting is conducted by one of laser cutting or cold foil processing.

5. The method of claim 1, including a further step of creating a plurality of second antenna patterns after the step of cutting the conductive layer.

6. The method of claim 1, wherein the step of printing is accomplished by one of ink jet printing, laser, non-impact printing or a combination thereof.

7. The method of claim 1, including a further step of printing a conductive pattern on the substrate after the step of cutting.

8. The method of claim 1, including a further step of collecting each of the distinct printed areas for an order after the step of separating.

9. The method of claim 1, wherein the distinct printed areas are selected from a group including tags, labels, hang tags, badges, shelf talkers, flyers, brochures, marketing collateral;

tickets, cards and combinations thereof.