Resilient conductive electrical interconnect

• US 9,231,328 B2
• Filed: 05/27/2010
• Issued: 01/05/2016
• Est. Priority Date: 06/02/2009
• Status: Active Grant

• Current Assignee: HSIO Technologies LLC
• Original Assignee: HSIO Technologies LLC
• Inventors: Rathburn, James
• Primary Examiner(s): Nguyen, Chau N
• Assistant Examiner(s): VARGHESE, ROSHN K
• Application Number:
  US13/318,382
• Publication Number:
  US 20120043130A1
• Time in Patent Office: 2,049 Days
• Field of Search: 174/263, 174/266, 174/267, 439/66, 439/91, 228/180.21
• US Class Current: 1/1
• CPC Class Codes: H01R 13/2414 conductive elastomers
• CPC Class Codes: H01R 13/2485 for contacting a ball
• CPC Class Codes: Y10T 29/49139 by inserting component lead or terminal into base aperture

Abstract

An interconnect assembly including a resilient material with a plurality of through holes extending from a first surface to a second surface. A plurality of discrete, free-flowing conductive particles is located in the through holes. The conductive particles are preferably substantially free of non-conductive materials. A plurality of first contact tips are located in the through holes adjacent the first surface and a plurality of second contact tips are located in the through holes adjacent the second surface. The resilient material provides the required resilience, while the conductive particles provide a conductive path substantially free of non-conductive materials.

Claims

1. An interconnect assembly comprising:

a resilient material printed to include a plurality of through holes extending from a first surface to a second surface and a plurality of recesses located along at least one of the first and second surfaces corresponding to desired circuit traces;

a plurality of discrete, free-flowing conductive particles located in the through holes, the conductive particles being free of binders or non-conductive materials;

a plurality of first contact tips located in the through holes adjacent the first surface;

a plurality of second contact tips located in the through holes adjacent the second surface; and

a conductive material printed in at least a portion of the recesses comprising conductive traces electrically coupled to one or more of the contact tips, wherein the contact tips are solid and non-spherical and move in at least the pitch and roll directions relative to the interconnect assembly.

2. The interconnect assembly of claim 1 wherein one or more of the contact tips comprise a protrusion engaged with the conductive particles.

3. The interconnect assembly of claim 1 wherein the through holes comprise non-moldable features.

4. The interconnect assembly of claim 1 wherein the through holes comprise one of a uniform or a non-uniform cross-sectional shape, along axis extending between the contact tips.

5. The interconnect assembly of claim 1 comprising a plurality of electrical devices printed onto the interconnect assembly and electrically coupled to at least one of the contact tips.

6. An electrical assembly comprising:

the interconnect assembly of claim 1;

a first circuit member comprising contact pads compressively engaged with distal ends of a plurality of first contact tips; and

a second circuit member comprising contact pads compressively engaged with distal ends of a plurality of the second contact tips.

7. The interconnect assembly of claim 6 wherein the first and second circuit members are selected from one of a dielectric layer, a printed circuit board, a flexible circuit, a bare die device, an integrated circuit device, organic or inorganic substrates, or a rigid circuit.

8. The interconnect assembly of claim 1 comprises one or more circuitry planes printed on the interconnect assembly.

9. The interconnect assembly of claim 8 wherein conductive traces in the circuitry planes comprise substantially rectangular cross-sectional shapes.

10. The interconnect assembly of claim 1 comprising at least one covering layer printed to retain the contact tips to the resilient material.

11. The interconnect assembly of claim 1 wherein a resilient material is printed on the integrated circuit device with at least one through hole generally aligned with contact pads on the integrated circuit device.

12. A method of forming an interconnect assembly comprising:

locating a plurality of first contact tips on a carrier;

printing a resilient material on the carrier with a plurality of through holes generally aligned with the first contact tips;

forming a plurality of recesses along at least one of the first and second surfaces corresponding to desired circuit traces;

depositing a plurality of discrete, free-flowing conductive particles in the through holes, the conductive particles being free of binders or non-conductive materials;

printing conductive material in at least a portion of the recesses comprising conductive traces electrically coupled to one or more of the contact tips;

locating a plurality of second contact tips in the through holes adjacent a second surface; and

separating the carrier from the first contact tips and the resilient material, wherein the first contact tips are solid and non-spherical and move in at least the pitch and roll directions relative to the interconnect assembly.

13. The method of claim 12 comprising the step of locating at least a portion of one or more of the contact tips in the through holes.

14. The method of claim 12 comprising printing the resilient material with one or more non-moldable features.

15. The method of claim 12 comprising displacing the contact tips in at least the pitch and roll directions relative to the interconnect assembly.

16. The method of claim 12 comprising:

printing a plurality of electrical devices on the interconnect assembly; and

electrically coupling at least one of the electrical devices to at least one of the plurality of contact tips.

17. The method of claim 12 comprising:

compressively engaging contact pads on a first circuit member with distal ends of a plurality of first contact tips; and

compressively engaging contact pads on a second circuit member with distal ends of a plurality of second contact tips.

18. The method of claim 17 wherein the first and second circuit members are selected from one of a dielectric layer, a printed circuit board, a flexible circuit, a bare die device, an integrated circuit device, organic or inorganic substrates, or a rigid circuit.

19. The method of claim 12 comprising printing one or more circuitry planes on the interconnect assembly.

20. The method of claim 12 comprising printing at least one covering layer to retain the contact tips to the resilient material.