Imaging device and method for high-sensitivity optical scanning and integrated circuit therefor

• US 9,232,114 B2
• Filed: 08/14/2013
• Issued: 01/05/2016
• Est. Priority Date: 06/22/2001
• Status: Expired due to Fees

• Current Assignee: Orbotech Limited (KLA Corporation)
• Original Assignee: Orbotech Limited (KLA Corporation)
• Inventors: Katzir, Yigal, Gur-Arie, Itay, Malinovich, Yacov
• Primary Examiner(s): Legasse, Jr., Francis M
• Application Number:
  US13/966,672
• Publication Number:
  US 20130329103A1
• Time in Patent Office: 874 Days
• Field of Search: 348/281, 348/294, 348/282, 348/283, 348/302, 257/431, 250/214.1, 250/214.R, 250/208.1, 250/214.DC
• US Class Current: 1/1
• CPC Class Codes: G01N 21/8851 Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges G01N21/8806 and G01N21/93 - G01N21/95692 take precedence; optical measurement of dimensions G01B11/00; optical scanning G02B26/10; image transformation G06T3/00; computerised image enhancement G06T5/00; image processing per se for flaw detection G06T7/0002
• CPC Class Codes: G01N 21/8901 Optical details; Scanning details per se G02B
• CPC Class Codes: G01N 21/956 Inspecting patterns on the surface of objects contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: H01L 27/14645 Colour imagers
• CPC Class Codes: H04N 25/46 by combining or binning pixels
• CPC Class Codes: H04N 25/768 for time delay and integration [TDI]
• CPC Class Codes: H04N 25/772 comprising A/D, V/T, V/F, I/T or I/F converters
• CPC Class Codes: H04N 3/155 Control of the image-sensor operation, e.g. image processing within the image-sensor

Abstract

An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Claims

1. An imaging system comprising:

an integrated circuit comprising a two-dimensional array of photosensors, wherein the photosensors are configured to obtain a plurality of pixelated images, each of the plurality of images at least partially overlapping another of the plurality of images, and each of the plurality of images mutually offset from each other of the plurality of images by at least one pixel; and

a composite image generator configured to generate a composite image by digitally adding together corresponding pixels of said plurality of images, thereby providing a composite image.

2. The imaging system according to claim 1, further comprising:

a plurality of A/D converters which receive outputs from the two-dimensional array of photosensors and which output digital image data corresponding to each of the plurality of images; and

a memory;

wherein the composite image generator is configured to digitally add digital image data output by the plurality of A/D converters to digital image data previously stored in the memory.

3. The imaging system according to claim 2, further comprising a plurality of digital registers configured to temporarily store the digital image data output from the plurality of A/D converters.

4. A camera comprising:

an integrated circuit comprising a two-dimensional array of photosensors, wherein the photosensors are configured to obtain a plurality of pixelated images, each of the plurality of images at least partially overlapping another of the plurality of images, and each of the plurality of images mutually offset from each other of the plurality of images by at least one pixel; and

a composite image generator which is configured to generate a composite image by digitally adding together corresponding pixels of said plurality of images, thereby providing a composite image.

5. The camera according to claim 4, further comprising:

a plurality of A/D converters which receive outputs from the two-dimensional array of photosensors and which are configured to output digital image data corresponding to each of the plurality of images; and

a memory;

wherein the composite image generator is configured to digitally add digital image data output by the plurality of A/D converters to digital image data previously stored in the memory.

6. The camera according to claim 5, further comprising a plurality of digital registers which are configured to temporarily store the digital image data output from the plurality of A/D converters.

7. A method for creating enhanced images, the method comprising:

acquiring a plurality of substantially overlapping pixelated images, each of the plurality of images at least partially overlapping another of the plurality of images, and each of the plurality of images mutually offset from each other of the plurality of images by at least one pixel; and

creating an enhanced image by digitally adding together corresponding pixels of said plurality of images.

8. The method according to claim 7, wherein the digitally adding comprises adding signal values corresponding to first pixels of a first one of the plurality of images to signal values corresponding to second pixels of a second one of the plurality of images, wherein the first pixels and the second pixels correspond to an overlapping portion of the first image and the second image.