Endoscope apparatus and method for releasing heat generated by imaging element of the endoscope apparatus

• US 9,232,197 B2
• Filed: 09/28/2011
• Issued: 01/05/2016
• Est. Priority Date: 09/29/2010
• Status: Active Grant

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Inventors: Nakamura, Kazuhiko
• Primary Examiner(s): Patel, Jay
• Assistant Examiner(s): SUH, JOSEPH JINWOO
• Application Number:
  US13/247,141
• Publication Number:
  US 20120075446A1
• Time in Patent Office: 1,560 Days
• Field of Search: 348/65
• US Class Current: 1/1
• CPC Class Codes: H04N 23/52 Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 7/183 for receiving images from a single remote source

Abstract

An endoscope apparatus includes an imaging element, a flexible substrate, and a flexible heat release sheet. The imaging element is built in an endoscope front end portion so as to receive incident light from a subject. The imaging element and components of a circuit for driving the imaging element are mounted on the flexible substrate and the flexible substrate is built in the endoscope front end portion. The flexible heat release sheet includes a first region attached to a given region of the imaging element other than a light receiving surface of the imaging element and a second region thermally contacted to a heat release member disposed in the endoscope front end portion.

Claims

1. An endoscope apparatus comprising:

an imaging element that is built in an endoscope front end portion;

an optical member that guides incident light from a subject to the imaging element;

a flexible substrate on which the imaging element and components of a circuit for driving the imaging element are mounted and which is built in the endoscope front end portion, wherein the flexible substrate includes two bending axes and the flexible substrate is folded back to form a U-shaped portion in one of the two bending axes and is bent in the other of the two bending axes so as to extend and contact with the optical member, wherein a region of the flexible substrate contacting with the optical member is different from a region of the flexible substrate on which the imaging element is mounted; and

a flexible heat release sheet that includes a first region attached to a given region of the imaging element other than a light receiving surface of the imaging element and a second region thermally contacted to a heat release member disposed in the endoscope front end portion,

wherein the flexible heat release sheet further includes a bend portion connecting the first region and the second region opposed to the first region and covers a top surface, a bottom surface and a side surface of the flexible substrate,

wherein the imaging element is connected to a signal cable through the U-shaped portion of the flexible substrate, and

wherein the first region of the flexible heat release sheet is separated from the flexible substrate at a position proximate to the U-shaped portion of the flexible substrate, and the flexible heat release sheet is folded back at the bend portion to at least partially surround a cable connection portion which is configured to connect the signal cable to the flexible heat release sheet.

2. The endoscope apparatus according to claim 1, wherein one region of the flexible substrate is pasted to the heat release member and the second region of the flexible heat release sheet is pasted to the one region of the flexible substrate to obtain the thermal contact between the heat release member and the flexible heat release sheet.

3. The endoscope apparatus according to claim 1, wherein the flexible heat release sheet is another flexible substrate than the flexible substrate.

4. The endoscope apparatus according to claim 1, wherein the heat release member is a signal cable which includes a bundle of wires connected to the imaging element and the components of the circuit for driving the imaging element.

5. The endoscope apparatus according to claim 1, wherein the first region is pasted directly to the given region.

6. The method according to claim 1, wherein the first bending axis is located proximate to the single cable.

7. The method according to claim 1, wherein the first bending axis is lower than the second bending axis.

8. The method according to claim 1, wherein the region of the flexible substrate contacting with the optical member and the region of the flexible substrate on which the imaging element is mounted are on a same plane of the flexible substrate.

9. A method for releasing heat generated by an imaging element of an endoscope apparatus, the endoscope apparatus including the imaging element that is built in the endoscope front end portion, an optical member that guides incident light from a subject to the imaging element and a flexible substrate on which the imaging element and components of a circuit for driving the imaging element are mounted and which is built in the endoscope front end portion, wherein the flexible substrate includes two bending axes and the flexible substrate is folded back to form a U-shaped portion in one of the two bending axes and is bent in the other of the two bending axes so as to extend and contact with the optical member, wherein a region of the flexible substrate contacting with the optical member is different from a region of the flexible substrate on which the imaging element is mounted, the method comprising:

attaching a first region of a flexible heat release sheet to a given region of the imaging element other than a light receiving surface of the imaging element;

thermally contacting a second of the flexible heat release sheet region to a heat release member disposed in the endoscope front end portion;

transmitting heat generated by the imaging element to the heat release member through the flexible heat release sheet; and

bending the flexible heat release sheet at a bend portion that connects the first region and the second region opposed to the first region, so as to cover a top surface, a bottom surface and a side surface of the flexible substrate,

wherein the imaging element is connected to a signal cable through the U-shaped portion of the flexible substrate, and

wherein the first region of the flexible heat release sheet is separated from the flexible substrate at a position proximate to the U-shaped portion of the flexible substrate, and the flexible heat release sheet is folded back at the bend portion to at least partially surround a cable connection portion which is configured to connect the signal cable to the flexible heat release sheet.

10. The method according to claim 9, wherein one region of the flexible substrate is pasted to the heat release member and the second region of the flexible heat release sheet is pasted to the one region of the flexible substrate to obtain the thermal contact between the heat release member and the flexible heat release sheet.

11. The method according to claim 9, wherein the flexible heat release sheet is another flexible substrate than the flexible substrate.

12. The method according to claim 9, wherein the flexible heat release member is a signal cable which includes a bundle of wires connected to the imaging element and the components of the circuit for driving the imaging element.

13. The method according to claim 9, wherein the first region is pasted directly to the given region.