Thermal isolation in printed circuit board assemblies
First Claim
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1. A printed circuit board assembly comprising:
- a printed circuit board, the printed circuit board comprising;
a plurality of conductive layers where each conductive layer in the plurality of conductive layers includes a first portion and a second portion separated by a gap, where first portions of the conductive layers form a first functional area and second portions of the conductive layers form a second functional area, and where at least one conductive layer is a ground plane;
a plurality of dielectric layers, each dielectric layer of the plurality of dielectric layers disposed between a pair of conductive layers in the plurality of conductive layers; and
a plurality of RF capacitors connected to the ground plane allowing signals at RF frequencies to pass through the plurality of RF capacitors maintaining continuity of the ground plane, the plurality of RF capacitors extending from the first functional area to the second functional area across the gap,wherein gaps in alternating conductive layers are misaligned.
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Abstract
A printed circuit board assembly for reducing the impact of heat generated from circuitry within a handheld or non-handheld device is provided. The printed circuit board assembly may include a printed circuit board comprising a plurality of conductive layers and a plurality of dielectric layers where each dielectric layer is disposed between a pair of conductive layers. Each conductive layer may include a first portion and a second portion separated by a gap where the gaps in the alternating conductive layers are misaligned. The first portion of each conductive layer may be substantially thermally isolated from the second portion of each conductive layer.
12 Citations
31 Claims
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1. A printed circuit board assembly comprising:
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a printed circuit board, the printed circuit board comprising; a plurality of conductive layers where each conductive layer in the plurality of conductive layers includes a first portion and a second portion separated by a gap, where first portions of the conductive layers form a first functional area and second portions of the conductive layers form a second functional area, and where at least one conductive layer is a ground plane; a plurality of dielectric layers, each dielectric layer of the plurality of dielectric layers disposed between a pair of conductive layers in the plurality of conductive layers; and a plurality of RF capacitors connected to the ground plane allowing signals at RF frequencies to pass through the plurality of RF capacitors maintaining continuity of the ground plane, the plurality of RF capacitors extending from the first functional area to the second functional area across the gap, wherein gaps in alternating conductive layers are misaligned. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of manufacturing a printed circuit board assembly, comprising:
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providing a printed circuit board; providing a plurality of conductive layers on the printed circuit board, each conductive layer having a first portion and a second portion separated by a gap where gaps in alternating conductive layers are misaligned, where first portions of the conductive layers form a first functional area and second portions of the conductive layers form a second functional area, and where at least one conductive layer is a ground plane; providing a plurality of dielectric layers on the printed circuit board, each dielectric layer of the plurality of dielectric layers disposed between a pair of conductive layers in the plurality of conductive layers; and providing a plurality of RF capacitors connected to the ground plane allowing signals at RF frequencies to pass through the plurality of RF capacitors maintaining continuity of the ground plane, where the plurality of RF capacitors extend from the first functional area to the second functional area across the gap. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A printed circuit board assembly comprising:
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a printed circuit board, the printed circuit board comprising; a plurality of conductive means where each conductive means in the plurality of conductive means includes a first portion and a second portion separated by a gap, where first portions of the conductive means form a first functional area and second portions of the conductive means form a second functional area, and where at least one conductive layer is a ground plane; a plurality of dielectric means, each dielectric means of the plurality of dielectric means disposed between a pair of conductive means in the plurality of conductive means; and a plurality of RF capacitors connected to the ground plane allowing signals at RF frequencies to pass through the plurality of RF capacitors maintaining continuity of the ground plane, the plurality of RF capacitors extending from the first functional area to the second functional area across the gap, wherein gaps in alternating conductive layers are misaligned. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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Specification
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Current AssigneeQualcomm, Inc.
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Original AssigneeQualcomm, Inc.
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InventorsZhang, Yang, Steenstra, Jack B.
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Primary Examiner(s)Dinh, Tuan T
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Assistant Examiner(s)PATEL, MUKUNDBHAI G
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Application NumberUS13/792,092Publication NumberTime in Patent Office1,031 DaysField of Search361/704, 361/707, 361/729, 361/736, 361/746, 361/748, 174/252, 174/255, 174259-264, 298/29, 298/32US Class Current1/1CPC Class CodesH05K 1/0201 Thermal arrangements, e.g. ...H05K 1/0298 Multilayer circuitsH05K 2201/09663 Divided layout, i.e. conduc...H05K 2201/09709 Staggered pads, lands or te...H05K 2201/09972 Partitioned, e.g. portions ...H05K 2201/10098 Components for radio transm...H05K 2201/10151 SensorH05K 7/02 Arrangements of circuit com...Y10T 29/49124 On flat or curved insulated...Y10T 29/4913 Assembling to base an elect...
