Method and device of a LED matrix

• US 9,232,663 B2
• Filed: 08/29/2012
• Issued: 01/05/2016
• Est. Priority Date: 09/06/2011
• Status: Active Grant

• Current Assignee: Signify Holding B.V. (Signify N.V.)
• Original Assignee: Koninklijke Philips N.V.
• Inventors: Dingemans, Antonius Petrus Marinus, Weekamp, Johannes Wilhelmus, Libon, Sbastien Paul Ren, Kums, Gerard, Cennini, Giovanni
• Primary Examiner(s): Niesz, Jamie C
• Application Number:
  US14/241,187
• Publication Number:
  US 20140209942A1
• Time in Patent Office: 1,224 Days
• Field of Search: 257/88, 438/34
• US Class Current: 1/1
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21V 21/002 making direct electrical contact, e.g. by piercing F21V21/35 takes precedence
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/153 in a repetitive configuration, e.g. LED bars
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 1/0283 Stretchable printed circuits
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/05 Insulated conductive substrates, e.g. insulated metal substrate
• CPC Class Codes: H05K 13/046 Surface mounting surface mounted components H05K3/341
• CPC Class Codes: H05K 2201/09263 Meander
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2203/04 Soldering or other types of metallurgic bonding using molten metal H05K2203/128
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 2203/175 Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/0097 Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards H05K3/0052 takes precedence
• CPC Class Codes: H05K 3/202 : using self-supporting metal foil pattern
• CPC Class Codes: H05K 3/303 : Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: Y10T 29/49144 : by metal fusion

Abstract

There is provided a method for manufacturing a light emitting diode, LED, matrix (100) comprising the steps of providing with a maintained integrity a conductor sheet (150) with a plurality of component areas (111) interconnected with meandering connection tracks (116), mounting a plurality of LEDs (120) to a respective component area thereby forming a subassembly (100′), trimming and stretching the subassembly thereby straightening the connection tracks such that an m×n LED conductor matrix is formed during the step of stretching.

Claims

1. A method for manufacturing an LED matrix comprising:

providing a first conductor structure comprising a plurality of component areas interconnected with meandering connection tracks by providing a conductor sheet with a first predetermined pattern,

wherein the first predetermined pattern includes at least one integrity governing bridge that inhibits straightening of at least one connection track among the meandering connection tracks;

mounting a plurality of LEDs, each to a respective component area of said first conductor structure thereby forming a subassembly;

trimming said subassembly to provide a second conductor structure,

wherein trimming said subassembly releases the at least one integrity governing bridge to permit straightening of the at least one connection track; and

stretching said subassembly thereby straightening said connection tracks;

wherein said second conductor structure is arranged such that an m×

n LED conductor matrix is formed during said step of stretching.

2. A method according to claim 1, further comprising:

arranging said stretched subassembly onto a substrate.

3. A method according to claim 1, wherein said first predetermined pattern is selected for providing at least one thermal pad area in said first or second conductor structure.

4. A method according to claim 3, wherein said at least one thermal pad area is arranged at a component area, or at a connection track.

5. A method according to claim 4, further comprising providing at least one recess in said component area for receiving LEDs or LED packages of a size less than 1×

1×

1 mm.

6. A method according to claim 5, wherein said step of mounting comprises:

defining solder areas on said first conductor structure;

applying solder onto said solder areas;

placing said LEDs on a respective component area, and performing soldering.

7. A method according to claim 6, wherein said first or second conductor structure is arranged with alignment features and/or stretch alignment features.

8. A method according to claim 7, further comprising providing mechanical deformation of said subassembly by means of one of splitting, trimming of the subassembly to a predetermined contour.

9. A method according to claim 8, further comprising deforming at least one portion of said subassembly to provide a predetermined lighting direction of at least one LED.

10. A method according to claim 9, further comprising providing deformation of said subassembly for providing one of:

optical properties, mechanical fixation of a component interconnect board, mechanical fixation of additional components, thermal properties, and connector functionality.

11. A method according to claim 10, wherein at least one of providing said first predetermined pattern and said second conductor structure is done by means of etching, cutting, punching, slitting or laser cutting.