Ostomy appliance with multiple release liners
First Claim
1. An ostomy appliance for attachment to a stoma body comprising a soft adhesive wafer and a collecting pouch attachable to the adhesive wafer at an attachment zone thereof, wherein the wafer includes a backing layer and a skin-facing adhesive layer with an adhesive surface, the adhesive surface of the wafer having a three split release liner system, with two folded side liners not covering the middle section of the wafer and with a third middle liner having folded edge portions and covering the middle portion of the adhesive surface having the same width as the attachment zone for the pouch or narrower, the release liners each covering at least a part of the adhesive surface and together these liners covering the entire adhesive surface, said wafer having a tensile strength at 20% strain of less than 0.75N/4 mm.
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Accused Products
Abstract
An ostomy appliance for attachment to the stoma body comprising a soft adhesive wafer (1) having a tensile strength at 20% strain of less than 0.75N/4 mm and a collecting pouch attachable to an adhesive wafer, the wafer comprises a backing layer and a skin-facing adhesive layer, wherein the adhesive skin-facing surface of the wafer is provided with at least two release liners (3, 4) each covering at least a part of the adhesive surface and together covering the entire adhesive surface.
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Citations
14 Claims
- 1. An ostomy appliance for attachment to a stoma body comprising a soft adhesive wafer and a collecting pouch attachable to the adhesive wafer at an attachment zone thereof, wherein the wafer includes a backing layer and a skin-facing adhesive layer with an adhesive surface, the adhesive surface of the wafer having a three split release liner system, with two folded side liners not covering the middle section of the wafer and with a third middle liner having folded edge portions and covering the middle portion of the adhesive surface having the same width as the attachment zone for the pouch or narrower, the release liners each covering at least a part of the adhesive surface and together these liners covering the entire adhesive surface, said wafer having a tensile strength at 20% strain of less than 0.75N/4 mm.
Specification