EMI filtered co-connected hermetic feedthrough, feedthrough capacitor and leadwire assembly for an active implantable medical device
First Claim
1. A filter feedthrough assembly, comprising:
- a) a hermetic feedthrough, comprising;
i) an insulator of electrically non-conductive material defined by an insulator sidewall having an outer insulator surface extending from a first insulator end to a second insulator end, wherein the insulator has at least one insulator via defined by an insulator bore extending there through to the first and second insulator ends;
ii) a ferrule of an electrically conductive material comprising a ferrule opening defined by a surrounding ferrule sidewall having an inner ferrule surface, wherein the insulator is hermetically supported in the ferrule opening; and
iii) a conductive fill disposed within the insulator via, wherein the conductive fill forms both a hermetic seal with the insulator bore and an electrically conductive path extending from first and second fill ends located adjacent to the respective first and second insulator ends;
b) a feedthrough capacitor, comprising;
i) a dielectric body defined by a dielectric sidewall having an outer dielectric surface extending from a first dielectric end to a second dielectric end;
ii) at least one active electrode plate and at least one ground electrode plate supported in the dielectric body in spaced relation with each other;
iii) at least one dielectric via defined by the dielectric bore extending through the dielectric body to the first and second dielectric ends;
iv) an inner metallization disposed on the dielectric bore in electrical contact with the at least one active electrode plate; and
v) an outer metallization disposed on an outer surface of the dielectric body in electrical contact with the at least one ground electrode plate;
c) a conductive leadwire having a length extending from a first leadwire portion having a first leadwire end to second leadwire end, wherein the first leadwire portion is disposed within the dielectric via with the first leadwire end located in contact with or adjacent to the second conductive fill end;
d) an active electrically conductive material at least partially filled in the dielectric via to physically and electrically connect;
i) the first leadwire portion to the inner metallization electrically connected to the at least one active electrode plate; and
ii) the first leadwire end to the second conductive fill end; and
(e) a ground electrically conductive material electrically connecting the outer metallization in electrical contact with the at least one ground plate to the ferrule.
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Accused Products
Abstract
A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.
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Citations
43 Claims
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1. A filter feedthrough assembly, comprising:
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a) a hermetic feedthrough, comprising; i) an insulator of electrically non-conductive material defined by an insulator sidewall having an outer insulator surface extending from a first insulator end to a second insulator end, wherein the insulator has at least one insulator via defined by an insulator bore extending there through to the first and second insulator ends; ii) a ferrule of an electrically conductive material comprising a ferrule opening defined by a surrounding ferrule sidewall having an inner ferrule surface, wherein the insulator is hermetically supported in the ferrule opening; and iii) a conductive fill disposed within the insulator via, wherein the conductive fill forms both a hermetic seal with the insulator bore and an electrically conductive path extending from first and second fill ends located adjacent to the respective first and second insulator ends; b) a feedthrough capacitor, comprising; i) a dielectric body defined by a dielectric sidewall having an outer dielectric surface extending from a first dielectric end to a second dielectric end; ii) at least one active electrode plate and at least one ground electrode plate supported in the dielectric body in spaced relation with each other; iii) at least one dielectric via defined by the dielectric bore extending through the dielectric body to the first and second dielectric ends; iv) an inner metallization disposed on the dielectric bore in electrical contact with the at least one active electrode plate; and v) an outer metallization disposed on an outer surface of the dielectric body in electrical contact with the at least one ground electrode plate; c) a conductive leadwire having a length extending from a first leadwire portion having a first leadwire end to second leadwire end, wherein the first leadwire portion is disposed within the dielectric via with the first leadwire end located in contact with or adjacent to the second conductive fill end; d) an active electrically conductive material at least partially filled in the dielectric via to physically and electrically connect; i) the first leadwire portion to the inner metallization electrically connected to the at least one active electrode plate; and ii) the first leadwire end to the second conductive fill end; and (e) a ground electrically conductive material electrically connecting the outer metallization in electrical contact with the at least one ground plate to the ferrule. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A filter feedthrough assembly, comprising:
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a) a hermetic feedthrough, comprising; i) an insulator of electrically non-conductive material defined by an insulator sidewall having an outer insulator surface extending from a first insulator end to a second insulator end; ii) at least one active insulator via defined by an active insulator bore extending there through to the first and second insulator ends; iii) at least one ground electrode plate supported by the insulator; iv) at least one ground insulator via defined by a ground insulator bore extending there through to the first and second insulator ends; v) a ferrule of an electrically conductive material comprising a ferrule opening defined by a surrounding ferrule sidewall having an inner ferrule surface, wherein the insulator is hermetically supported in the ferrule opening; vi) an active conductive fill, disposed within the active insulator via, wherein the active conductive fill forms both a hermetic seal with the active insulator bore and an electrically conductive path extending from first and second active fill ends located adjacent to the respective first and second insulator ends; and viii) a ground conductive fill disposed within the ground insulator via, wherein the ground conductive fill forms both a hermetic seal with the ground insulator bore and an electrically conductive path extending from first and second ground fill ends located adjacent to the respective first and second insulator ends, wherein the ground insulator electrode plate electrically couples from the outer insulator surface in electrical contact with the outer metallization to the ground conductive fill, but in a non-conductive relation with the active conductive fill; b) a feedthrough capacitor, comprising; i) a dielectric body defined by an dielectric sidewall having an outer dielectric surface extending from a first dielectric end to a second dielectric end; ii) at least one active electrode plate and at least one ground electrode plate supported in the dielectric body in spaced relation with each other; iii) at least one active dielectric via defined by an active dielectric bore extending through the dielectric body to the first and second dielectric ends; iv) at least one ground dielectric via defined by a ground dielectric bore extending through the dielectric body to the first and second dielectric ends; v) an active inner metallization disposed on the active dielectric bore in electrical, contact with the at least one active electrode plate; and vi) a ground inner metallization disposed on the ground dielectric bore via in electrical contact with the at least one ground electrode plate; c) an active conductive leadwire having a length extending from a first active leadwire portion having a first active leadwire end to a second active leadwire end, wherein the first active leadwire portion is disposed within the active dielectric via with the first active leadwire end located in contact with or adjacent to the second active conductive fill end; d) an active electrically conductive material at least partially filled in the active dielectric via to physically and electrically connect; i) the first active leadwire portion to the active inner metallization electrically connected to the at least one active electrode plate; and ii) the first active leadwire end to the second active conductive fill end; and e) a ground conductive leadwire having a length extending from a first ground leadwire portion having a first ground leadwire end to a second ground leadwire end, wherein the first ground leadwire portion is disposed within the ground dielectric via with the first ground leadwire end located in contact with or adjacent to the second ground conductive fill end; and f) a ground electrically conductive material at least partially filled in the ground dielectric via to physically and electrically connect; i) the first ground leadwire portion to the ground inner metallization electrically connected to the at least one ground electrode plate in the dielectric body; and ii) the first ground leadwire end to the second ground conductive fill end; and g) an outer ground electrically conductive material electrically and hermetically connecting the outer metallization in electrical contact with the at least one ground insulator electrode plate at the outer insulator surface to the ferrule. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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41. A filter feedthrough assembly, comprising:
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a) a hermetic feedthrough, comprising; i) an insulator of electrically non-conductive material defined by an insulator sidewall having an outer insulator surface extending from a first insulator end to a second insulator end; ii) at least one active insulator via defined by an active insulator bore extending there through to the first and second insulator ends; iii) at least one ground electrode plate supported by the insulator; iv) at least one ground insulator via defined by a ground insulator bore extending there through to the first and second insulator ends; v) an outer metallization disposed on the outer insulator surface in electrical contact with the at least one ground electrode plate supported by the insulator; vi) a ferrule of an electrically conductive material comprising a ferrule opening defined by a surrounding ferrule sidewall having an inner ferrule surface, wherein the insulator is supported in the ferrule opening; vii) an active conductive fill disposed within the active insulator via, wherein the active conductive fill forms both a hermetic seal with the active insulator bore and an electrically conductive path extending from the first and second active fill ends located adjacent to the respective first and second insulator ends; and viii) a ground conductive fill disposed within the ground insulator via, wherein the ground conductive fill forms both a hermetic seal with the ground insulator bore and an electrically conductive path extending from the first and second ground fill ends located adjacent to the respective first and second insulator ends, wherein the ground insulator electrode plate electrically couples from the outer insulator surface in electrical contact with the outer metallization to the ground conductive fill, but in a non-conductive relation with the active conductive fill; b) a feedthrough capacitor, comprising; i) a dielectric body defined by an dielectric sidewall having an outer dielectric surface extending from a first dielectric end to a second dielectric end; ii) at least one active electrode plate and at least one ground electrode plate supported in the dielectric body in spaced relation with each other; iii) at least one active dielectric via defined by an active dielectric bore extending through the dielectric body to the first and second dielectric ends; iv) at least one ground dielectric via defined by a ground dielectric bore extending through the dielectric body to the first and second dielectric ends; v) an active inner metallization disposed on the active dielectric bore in electrical contact with the at least one active electrode plate; and vi) a ground inner metallization disposed on the ground dielectric bore in electrical contact with the at least one ground electrode plate; c) an active conductive leadwire having a length extending from a first active leadwire portion having a first active leadwire end to a second active leadwire end, wherein the first active leadwire portion is disposed within the active dielectric via with the first active leadwire end located in contact with or adjacent to the second active conductive fill end; d) an active electrically conductive material at least partially filled in the active dielectric via to physically and electrically connect; i) the first active leadwire portion to the active inner metallization electrically connected to the at least one active electrode plate; and ii) the first active leadwire end to the second active conductive fill end; and e) a ground conductive leadwire having a length extending from a first ground leadwire portion having a first ground leadwire end to a second ground leadwire end, wherein the first ground leadwire portion is disposed within the ground dielectric via with the first ground leadwire end located in contact with or adjacent to the second ground conductive fill end; f) a ground electrically conductive material at least partially filled in the ground dielectric via to physically and electrically connect; i) the first ground leadwire portion to the ground inner metallization electrically connected to the at least one ground electrode plate; and ii) the first ground leadwire end to the second ground conductive fill end; and g) a gold braze electrically and hermetically connecting the outer metallization in electrical contact with the at least one ground insulator electrode plate to the ferrule. - View Dependent Claims (42, 43)
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Specification