Insert molding around glass members for portable electronic devices

• US 9,235,240 B2
• Filed: 11/11/2010
• Issued: 01/12/2016
• Est. Priority Date: 11/11/2010
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Pakula, David, Lynch, Stephen Brian, Dinh, Richard Hung Minh, Tan, Tang Yew, Tan, Lee Hua
• Primary Examiner(s): Ngo, Hung V
• Application Number:
  US12/944,671
• Publication Number:
  US 20120118628A1
• Time in Patent Office: 1,888 Days
• Field of Search: 174/520, 455/575.1, 455/575.8
• US Class Current: 1/1
• CPC Class Codes: A45C 11/00 Receptacles for purposes not provided for in groups A45C1/00-A45C9/00 specially adapted for toiletry or cosmetic equipment A45D29/20, A45D44/18; travelling sewing kits A45F3/48
• CPC Class Codes: A45F 5/00 Holders or carriers for hand articles; Holders or carriers for use while travelling or camping
• CPC Class Codes: G06F 1/1626 with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: G06F 1/1656 Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: H02G 11/02 using take-up reel or drum
• CPC Class Codes: H04M 1/0249 Details of the mechanical connection between the housing parts or relating to the method of assembly
• CPC Class Codes: H04M 1/0266 for a display module assembly
• CPC Class Codes: H05K 5/0017 with operator interface units
• CPC Class Codes: H05K 5/03 Covers

Abstract

An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.

Claims

1. An electronic device enclosure, comprising:

a glass cover for a top surface for the electronic device enclosure;

an adhesive deposited around a bottom surface periphery of the glass cover;

a first peripheral structure for providing a support surface for the glass cover and for providing side protective surfaces for the glass cover, the first peripheral structure having an extended portion including a first surface parallel a second surface, the first surface configured to receive the adhesive such that the first peripheral structure is at least partially secured to the glass cover by the adhesive; and

an enclosure support structure having an upper surface coupled to the second surface of the first peripheral structure, the enclosure support structure further comprises a lower surface, the lower surface opposite the upper surface, the lower surface coupled to a second peripheral structure,

wherein the first peripheral structure is molded about the periphery of the glass cover, molded adjacent the adhesive, and molded adjacent to the enclosure support structure.

2. An electronic device enclosure as recited in claim 1, wherein the enclosure support structure comprises an outer periphery member for the electronic device enclosure.

3. An electronic device enclosure as recited in claim 1, wherein the adhesive is thermally activated, and

wherein the adhesive is thermally activated while the first peripheral structure is molded about the glass cover.

4. An electronic device enclosure as recited in claim 3, wherein the molding of the first peripheral structure about the glass cover provides a gap-free interface between edges of the glass cover and the first peripheral structure provided about the periphery of the glass cover.

5. An electronic device enclosure as recited in claim 1, wherein the molding of the first peripheral structure about the glass cover provides a gap-free interface between edges of the glass cover and the first peripheral structure provided about the periphery of the glass cover.

6. An electronic device enclosure as recited in claim 1,

wherein the adhesive is deposited on the bottom surface of the glass cover, and

wherein the first peripheral structure is molded about the periphery of the glass cover and molded adjacent the adhesive.

7. An electronic device enclosure as recited in claim 6, wherein the adhesive is thermally activated.

8. An electronic device enclosure as recited in claim 6, wherein the first peripheral structure comprises a polymer, and wherein the polymer includes additives such that the CTE of the first peripheral structure is made closer to the CTE of the glass cover.

9. An electronic device enclosure as recited in claim 8, wherein the additives comprise particles or fibers made of glass or ceramic.

10. An electronic device enclosure as recited in claim 1,

wherein the adhesive is thermally activated, and

wherein the adhesive is applied as a film or a layer.

11. An electronic device enclosure as recited in claim 1, wherein the first peripheral structure comprises a polymer.

12. An electronic device enclosure as recited in claim 1, wherein the first peripheral structure comprises a polymer strengthened by containing glass fibers.

13. An electronic device enclosure as recited in claim 1,

wherein the first peripheral structure is molded about the periphery of the glass cover and molded adjacent the adhesive, and

wherein the adhesive includes a feature to which the first peripheral structure is formed.

14. An electronic device enclosure as recited in claim 1, wherein the enclosure support structure comprises a metal support structure.

15. An electronic device enclosure as recited in claim 14,

wherein the metal support structure has at least one feature that provides a mechanical interlock with the first peripheral structure after the first peripheral structure has been molded.

16. An electronic device enclosure as recited in claim 1, wherein the thickness of the glass cover window is about 0.3-1.0 mm.

17. An electronic device enclosure as recited in claim 1,

wherein the first peripheral structure includes an inner peripheral member and an outer peripheral member,

wherein the inner peripheral member is attached to the glass cover via the adhesive, and

wherein at least the outer peripheral member is molded about at least a portion of the periphery of the glass cover and about at least a portion of the inner peripheral member.

18. An electronic device enclosure as recited in claim 17, wherein the molding of the outer peripheral member about at least the portion of the periphery of the glass cover provides a gap-free interface between edges of the glass cover and the outer peripheral member provided about at least a portion of the periphery of the glass cover.

19. An electronic device enclosure, comprising:

a glass cover for a top surface for the electronic device enclosure;

an adhesive deposited at a periphery of the glass cover;

a first peripheral structure for providing a support surface for the glass cover and for providing side protective surfaces for the glass cover, the first peripheral structure having an extended portion including a first surface parallel to a second surface, the first surface configured to receive the adhesive such that the first peripheral structure is at least partially secured to the glass cover by the adhesive; and

a support structure having a top side, the top side including at least one interlock feature for coupling to the first peripheral structure, wherein the support structure further comprises a bottom side, the bottom side opposite the top side, the bottom side coupled to a second peripheral structure,

wherein the first peripheral structure is molded about the periphery of the glass cover, molded adjacent the adhesive, and molded adjacent to the support structure and against the at least one interlock feature.

20. An electronic device enclosure as recited in claim 19, wherein the first peripheral structure comprises a polymer strengthened by containing glass fibers.

21. An electronic device enclosure as recited in claim 19,

wherein the adhesive is deposited on the bottom surface of the glass cover, and

wherein the first peripheral structure is molded about the periphery of the glass cover and molded adjacent the adhesive.

22. An electronic device enclosure as recited in claim 21, wherein the adhesive is thermally activated.

23. An electronic device enclosure as recited in claim 19, further comprising a second glass cover coupled to the second peripheral structure.

24. An electronic device enclosure as recited in claim 19, wherein the first peripheral structure comprises a polymer, and wherein the polymer includes additives such that the CTE of the first peripheral structure is made closer to the CTE of the glass cover.

25. An electronic device enclosure as recited in claim 24, wherein the additives comprise particles or fibers made of glass or ceramic.

26. An electronic device enclosure as recited in claim 19, wherein the support structure comprises a metal support structure.

27. An electronic device enclosure as recited in claim 19, wherein the thickness of the glass cover window is about 0.3-1.0 mm.

28. An electronic device enclosure as recited in claim 19, wherein the support structure comprises an outer periphery member for the electronic device enclosure.

29. An electronic device enclosure, comprising:

a glass cover for a top surface for the electronic device enclosure;

an adhesive deposited around a periphery of the glass cover;

a first peripheral structure for providing a support surface for the glass cover and for providing side protective surfaces for the glass cover, the first peripheral structure having an extended portion including a first surface parallel to a second surface, the first surface configured to receive the adhesive such that the first peripheral structure is at least partially secured to the glass cover by the adhesive;

a support structure having an upper surface, the upper surface including at least one interlock feature for coupling to the first peripheral structure, wherein the support structure further comprises a bottom surface, the bottom surface opposite the upper surface, the bottom surface coupled to a second peripheral structure; and

at least one interlock feature on the upper surface of the support structure, the support structure coupled to the second surface of the first peripheral structure via the at least one interlock feature,

wherein the first peripheral structure is molded about the periphery of the glass cover, molded adjacent the adhesive, and molded adjacent to the support structure and against the at least one interlock feature.

30. An electronic device enclosure as recited in claim 29, wherein the first peripheral structure comprises a polymer strengthened by containing glass fibers.

31. An electronic device enclosure as recited in claim 29,

wherein the adhesive is deposited on the bottom surface of the glass cover, and

wherein the first peripheral structure is molded about the periphery of the glass cover and molded adjacent the adhesive.

32. An electronic device enclosure as recited in claim 31, wherein the adhesive is thermally activated.

33. An electronic device enclosure as recited in claim 32, wherein the thickness of the glass cover window is about 0.3-1.0 mm.

34. An electronic device enclosure as recited in claim 33, further comprising a second glass cover coupled to the second peripheral structure.

35. An electronic device enclosure as recited in claim 33, wherein the first peripheral structure comprises a polymer, and wherein the polymer includes additives such that the CTE of the first peripheral structure is made closer to the CTE of the glass cover.

36. An electronic device enclosure as recited in claim 35, wherein the additives comprise particles or fibers made of glass or ceramic.

37. An electronic device enclosure as recited in claim 32, wherein the support structure comprises an outer periphery member for the electronic device enclosure.