Semiconductor light emitting device and method of manufacturing the same

• US 9,236,304 B2
• Filed: 01/08/2014
• Issued: 01/12/2016
• Est. Priority Date: 01/15/2013
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Tae Hun, Kim, Sung Joon, Lee, Su Yeol, Lee, Seung Hwan, Jang, Tae Sung
• Primary Examiner(s): Wilczewski, Mary
• Assistant Examiner(s): Peterson, Erik T
• Application Number:
  US14/150,713
• Publication Number:
  US 20140199796A1
• Time in Patent Office: 734 Days
• Field of Search: 438/22, 438 26- 29, 257/88, 257/98, 257/E33.061, 257/E33.059, 257/E33.072
• US Class Current: 1/1
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 24/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A method of manufacturing a semiconductor light emitting device includes forming a plurality of semiconductor light emitting devices on a substrate, the semiconductor light emitting devices having at least one electrode pad formed on upper surfaces thereof; forming a conductive bump by forming a bump core on the electrode pad of each of the semiconductor light emitting devices and forming a reflective bump layer enclosing the bump core; forming a resin encapsulating part containing a phosphor on the plurality of semiconductor light emitting devices to encompass the conductive bump; polishing the resin encapsulating part to expose the bump core of the conductive bump to an upper surface of the resin encapsulating part; and forming individual semiconductor light emitting devices by cutting the resin encapsulating part between the semiconductor light emitting devices.

Claims

1. A method of manufacturing a semiconductor light emitting device, the method comprising:

forming a plurality of semiconductor light emitting devices on a substrate, the semiconductor light emitting devices having at least one electrode pad formed on upper surfaces thereof;

forming a conductive bump by forming a bump core on the electrode pad of each of the semiconductor light emitting devices and forming a reflective bump layer enclosing the bump core;

forming a resin encapsulating part containing a phosphor on the plurality of semiconductor light emitting devices to encompass the conductive bump;

polishing the resin encapsulating part to expose the bump core of the conductive bump to an upper surface of the resin encapsulating part; and

forming individual semiconductor light emitting devices by cutting the resin encapsulating part between the semiconductor light emitting devices,

wherein the reflective bump layer is formed by dotting a light reflective material on the bump core in an inkjet scheme and firing the light reflective material dotted on the bump core.

2. The method of claim 1, wherein the light reflective material includes silver (Ag) or aluminum (Al).

3. The method of claim 1, wherein the bump core has a height of 50 μ

m to 120 μ

m.

4. The method of claim 1, wherein the forming of the resin encapsulating part is performed by dispensing, screen printing, spin coating, spray coating or transfer molding.

5. The method of claim 1, wherein the plurality of semiconductor light emitting devices include a semiconductor epitaxial layer composed of a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer sequentially stacked on the substrate, and the electrode pad electrically connected to the second conductivity type semiconductor layer.

6. The method of claim 1, wherein the bump core is formed by using metal wire balls, bonding metal balls, evaporation coating, electroplating, or screen printing.

7. The method of claim 1, wherein the conductive bump is disposed parallel to a side surface of at least one of the light emitting devices.

8. A method of manufacturing a semiconductor light emitting device, the method comprising:

forming a plurality of semiconductor light emitting devices on a substrate, the semiconductor light emitting devices having at least one electrode pad formed on upper surfaces thereof;

forming a conductive bump by forming a bump core on the electrode pad of each of the semiconductor light emitting devices and forming a reflective bump layer enclosing the bump core;

forming a resin encapsulating part containing a phosphor on the plurality of semiconductor light emitting devices to encompass the conductive bump;

polishing the resin encapsulating part to expose the bump core of the conductive bump to an upper surface of the resin encapsulating part; and

forming individual semiconductor light emitting devices by cutting the resin encapsulating part between the semiconductor light emitting devices,

wherein the bump core is formed by dotting a conductive material on the electrode pad in an inkjet scheme and firing the conductive material dotted on the electrode pad.

9. The method of claim 8, wherein the conductive material is selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), platinum (Pt) and gold (Au).

10. A method of manufacturing a semiconductor light emitting device, the method comprising:

forming a plurality of semiconductor light emitting devices on a substrate, the semiconductor light emitting devices having at least one electrode pad formed on upper surfaces thereof;

forming a conductive bump by forming a bump core on the electrode pad of each of the semiconductor light emitting devices, firing the bump core formed on the electrode pad of each of the semiconductor light emitting devices prior to forming a reflective bump layer enclosing the bump core, and forming the reflective bump layer of a different material than the bump core and enclosing the bump core so as to cover all exposed surfaces of the bump core;

forming a resin encapsulating part containing a phosphor on the plurality of semiconductor light emitting devices to encompass the conductive bump;

polishing the resin encapsulating part to expose the bump core of the conductive bump to an upper surface of the resin encapsulating part;

forming individual semiconductor light emitting devices by cutting the resin encapsulating part between the semiconductor light emitting devices.

11. The method of claim 10, wherein the reflective bump layer is formed of silver (Ag) or aluminum (Al).