Electric power semiconductor device and method for producing same

• US 9,236,324 B2
• Filed: 12/05/2012
• Issued: 01/12/2016
• Est. Priority Date: 12/26/2011
• Status: Active Grant

• Current Assignee: Mitsubishi Electric Corporation
• Original Assignee: Mitsubishi Electric Corporation
• Inventors: Besshi, Noriyuki, Nakajima, Dai
• Primary Examiner(s): Haughton, Anthony
• Assistant Examiner(s): Gafur, Razmeen
• Application Number:
  US14/358,140
• Publication Number:
  US 20140293548A1
• Time in Patent Office: 1,133 Days
• Field of Search: 361676-678, 36167946-67954, 361688-723, 361699-704, 361709-710, 361719-721, 165699-704, 165709-710, 165719-721, 174 151- 153, 174 161- 163, 174/547, 174/548, 257712-722, 257/E23.088, 454/184, 312/236, 244/53, 24458-459, 348/787, 348/789, 348/794, 349 56- 60
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/04026 Bonding areas specifically adapted for layer connectors
• CPC Class Codes: H01L 2224/06181 On opposite sides of the body
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/33181 On opposite sides of the body
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/3736 Metallic materials H01L23/3732, H01L23/3733, H01L23/3735, H01L23/3737, H01L23/3738 take precedence
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 24/06 of a plurality of bonding areas
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/33 of a plurality of layer connectors
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/351 Thermal stress

Abstract

An electric power semiconductor device includes a power module and a heat dissipating member connected to the power module through a heat-conductive insulating resin sheet in which a mold resin part included in the power module has a protruding part in its peripheral part to prevent the heat-conductive insulating resin sheet from expanding in a planar direction. The heat-conductive insulating resin sheet is slightly thicker than the protruding part and has a resin exuding part exuded from a small gap between the protruding part and the heat dissipating member while the power module and the heat dissipating member are heated and pressurized to be bonded.

Claims

1. An electric power semiconductor device comprising a power module and a heat dissipating member connected to the power module, wherein, the power module has a metal wiring member mounting a power semiconductor element on a mounting face, and a molded resin part sealing the power semiconductor element and the metal wiring member in a state that an opposed face opposite to the mounting face is exposed in the metal wiring member;

and the heat dissipating member is arranged on the opposed face with a heat-conductive insulating resin sheet provided therebetween, in which,

one of the molded resin part and the heat dissipating member has a protruding part configured to have a height slightly smaller than a thickness of the heat-conductive insulating resin sheet in a thickness direction of the electric power semiconductor device, the protruding part in the molded resin part is formed in a peripheral part of the molded resin part, and the protruding part in the heat dissipating member is formed to be opposed to the peripheral part of the molded resin part;

the heat-conductive insulating resin sheet has a resin exuding part configured to extend beyond the peripheral part of the molded resin part to an outside of the molded resin part in a direction perpendicular to the thickness direction; and

the electric power semiconductor device further comprising a resin covering member configured to cover the resin exuding part and have a smooth outer face with no inflection point.

2. The electric power semiconductor device according to claim 1, wherein the protruding part has a rounded corner part.

3. An electric power semiconductor device comprising a power module and a heat dissipating member connected to the power module, wherein, the power module has a metal wiring member mounting a power semiconductor element on a mounting face, and a molded resin part sealing the power semiconductor element and the metal wiring member in a state that an opposed face opposite to the mounting face is exposed in the metal wiring member;

and the heat dissipating member is arranged on the opposed face with a heat-conductive insulating resin sheet provided therebetween, in which,

the molded resin part has a protruding part, in a peripheral part of the molded resin part, configured to have a height slightly smaller than a thickness of the heat-conductive insulating resin sheet sandwiched between the metal wiring member and the heat dissipating member in a thickness direction of the electric power semiconductor device, and a resin-part-side concave portion configured to extend from the protruding part to an end face of the metal wiring member in a direction perpendicular to the thickness direction, the resin-part-side concave portion has a depth larger than the thickness of the heat-conductive insulating resin sheet sandwiched between the metal wiring member and the heat dissipating member;

the metal wiring member has a metal-wiring-member-side concave portion positioned in a corner part of the metal wiring member abutting on the resin-part-side concave portion, and the metal-wiring-member-side concave portion has a depth larger than the thickness of the heat-conductive insulating resin sheet sandwiched between the metal wiring member and the heat dissipating member and is integrally formed with the resin-part-side concave portion; and

the heat-conductive insulating resin sheet has a resin exuding part configured to extend beyond the peripheral part of the molded resin part to an outside of the molded resin part in the direction perpendicular to the thickness direction.

4. The electric power semiconductor device according to claim 3, wherein the protruding part has a rounded corner part.

5. A method for manufacturing an electric power semiconductor device, wherein,

the electric power semiconductor device includes a power module and a heat dissipating member connected to the power module, the power module has a metal wiring member mounting a power semiconductor element on a mounting face, and a molded resin part sealing the power semiconductor element and the metal wiring member in a state that an opposed face opposite to the mounting face is exposed in the metal wiring member;

the heat dissipating member is arranged on the opposed face with a heat-conductive insulating resin sheet provided therebetween; and

the molded resin part has a protruding part, in a peripheral part of the molded resin part, having a height slightly smaller than a thickness of the heat-conductive insulating resin sheet in a thickness direction of the electric power semiconductor device,

the method for manufacturing the electric power semiconductor device comprising;

arranging the heat-conductive insulating resin sheet between the opposed face and the heat dissipating member;

heating the heat-conductive insulating resin sheet in a reduced-pressure environment, and applying a pressure to the heat-conductive insulating resin in the thickness direction when the heat-conductive insulating resin sheet is softened from a half-cured state;

forming a resin exuding part by extending the heat-conductive insulating resin sheet beyond the peripheral part of the molded resin part to an outside of the molded resin part, with the pressure, in a direction perpendicular to the thickness direction; and

curing the heat-conductive insulating resin sheet by additional heating to connect the power module and the heat dissipating member.