Operating and manufacturing a DC-DC converter

• US 9,236,347 B2
• Filed: 10/09/2013
• Issued: 01/12/2016
• Est. Priority Date: 10/09/2013
• Status: Active Grant

• Current Assignee: Lenovo International Limited (Lenovo Group Ltd.)
• Original Assignee: Lenovo Enterprise Solutions (Singapore) Pte., Ltd. (Lenovo Group Ltd.)
• Inventors: Barnette, Jamaica L.
• Primary Examiner(s): Berhane, Adolf
• Assistant Examiner(s): Demisse, Afework
• Application Number:
  US14/050,007
• Publication Number:
  US 20150097615A1
• Time in Patent Office: 825 Days
• Field of Search: 323/271, 323/282, 323/272, 323/284, 323/222, 323/285, 323/225, 323/283, 323/288, 323/311, 323/331, 257/531, 257/533, 257/686, 257/691, 257/724
• US Class Current: 1/1
• CPC Class Codes: H01L 23/538 the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates H05K takes precedence; manufacture or treatment H01L21/4846 ; mountings per se H01L23/12; materials H01L23/49866
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02M 3/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H02M 3/1552 Boost converters exploiting the leakage inductance of a transformer or of an alternator as boost inductor
• CPC Class Codes: H02M 3/1584 with a plurality of power processing stages connected in parallel

Abstract

Manufacturing a DC-DC converter on a chip includes: providing a die having a p-type top side and an n-type bottom side; removing an interior portion, creating a hole; flipping the interior portion; inserting the interior portion into the hole; fabricating high-side switch cells in the interior portion'"'"'s top side and low-side switch cells in the exterior portion'"'"'s top side; sputtering a magnetic material on the entire top side; burrowing tunnels into the magnetic material; and applying conductive material on the magnetic material and within the tunnels, electrically coupling pairs of high-side and low-side switches, with each pair forming a micro-power-switching phase, where the conductive material forms an output node of the phase, and the conductive material in the burrowed tunnels forms, in each phase, a torodial inductor with a single loop coil and, for the plurality of phases, a directly coupled inductor.

Claims

1. An apparatus for operating a DC (‘

Direct Current’

)-DC converter on a chip, the chip comprising;

a semiconductor die comprising a first portion and second portion, the first portion surrounding the second portion, the first portion comprising a p-type top side and an n-type bottom side, the second portion comprising an n-type top side and a p-type bottom side;

a plurality of micro-power-switching phases comprising magnetic material, with each phase comprising;

a high-side switch with a control input for activating the high-side switch, the high-side switch implemented in a cell of the n-type top side of the second portion of the semiconductor die;

a low-side switch with a control input for activating the low-side switch, the low-side switch implemented in a cell of the p-type top side of the first portion of the semiconductor die; and

an output node, the high-side switch and low-side switch electrically coupled to the output node through the magnetic material, wherein;

the output node of each phase extrudes through the magnetic material to form, in each phase, a torodial inductor with a single loop coil, and to form, for the plurality of phases, a directly coupled inductor;

the output node of each micro-power-switching phase is coupled to a filter and a load;

each high-side switch is configured, when activated, to couple a voltage source to the phase'"'"'s single loop coil; and

the low-side switch of each phase is configured, when activated, to couple the phase'"'"'s single loop coil to a ground voltage; and

the apparatus further comprising a controller configured for alternatively activating each switch, wherein no two switches of any phase are activated at the same time.

2. The apparatus of claim 1 wherein alternatively activating each switch further comprises:

activating the high-side switch of a first micro-power-switching phase, including coupling the voltage source to the phase'"'"'s single loop coil, energizing the magnetic material around the single loop coil, and providing, via the single loop coil, output current to the filter and load;

activating the low-side switch of the first micro-power-switching phase, including coupling the phase'"'"'s single loop coil to the ground voltage and providing, via a second micro-power-switching phase'"'"'s single loop coil and the energized magnetic material, output current to the filter and load;

activating the high-side switch of the second micro-power-switching phase, including coupling the voltage source to the second micro-power-switching phase'"'"'s single loop coil, re-energizing the magnetic material around the first micro-power-switching phase'"'"'s single coil element, and providing, via the second micro-power-switching phase'"'"'s single coil element, output current to the filter and load; and

activating the low-side switch of the second micro-power-switching phase, including coupling the second micro-power-switching phase'"'"'s single loop coil to the ground voltage and providing, via the first micro-power-switching phase'"'"'s single loop coil and the energized magnetic material, output current to the filter and load.

3. The apparatus of claim 1 wherein alternatively activating each switch further comprises:

activating each high side switch for a period of time according to;

4. The apparatus of claim 1 wherein the number of micro-power-switching phases is inversely proportional to the duty cycle of activating the switches and thereby inversely proportional to the inductance of the directly coupled inductor.

5. The apparatus of claim 1 wherein current ripple experienced by the filter and the load comprises:

6. The apparatus of claim 1 wherein each high-side switch and each low-side switch comprises a Field Effect Transistor implemented in silicon.

7. The apparatus of claim 1 wherein the chip further comprises a plurality of DC-DC converters, each DC-DC converter comprising a subset of the chip'"'"'s plurality of micro-power-switching phases and each subset is electrically and magnetically decoupled from other subsets.

8. The apparatus of claim 1 wherein the apparatus further comprises a power supply for a computer.