Semiconductor package with grounding and shielding layers

• US 9,236,356 B2
• Filed: 07/30/2014
• Issued: 01/12/2016
• Est. Priority Date: 07/31/2013
• Status: Active Grant

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Yang, Jun-Young, Lim, Sung-Mook
• Primary Examiner(s): HA, NATHAN W
• Application Number:
  US14/447,512
• Publication Number:
  US 20150035127A1
• Time in Patent Office: 531 Days
• Field of Search: 257/660
• US Class Current: 1/1
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/06135 Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/60 Protection against electrostatic charges or discharges, e.g. Faraday shields
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15159 : Side view
• CPC Class Codes: H01L 2924/15184 : in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

A semiconductor package includes a substrate, a grounding layer, a chip, a package body, and a shielding layer. The substrate includes a lateral surface and a bottom surface. The grounding layer is buried in the substrate and extends horizontally in the substrate. The chip is arranged on the substrate. The package body envelops the chip and includes a lateral surface. The shielding layer covers the lateral surface of the package body and the lateral surface of the substrate, and is electrically connected to the grounding layer, where a bottom surface of the shielding layer is separated from a bottom surface of the substrate.

Claims

1. A semiconductor package, comprising:

a substrate including a lateral surface and a bottom surface;

a grounding layer buried in the substrate and extending horizontally in the substrate, wherein the grounding layer is separated from the lateral surface of the substrate;

a grounding trace extending to the lateral surface of the substrate, wherein the grounding trace and the grounding layer are disposed on different layers of the substrate;

a via formed between the grounding trace and the grounding layer to electrically connect the grounding trace and the grounding layer;

a chip arranged on the substrate;

a package body enveloping the chip and including a lateral surface; and

a shielding layer covering the lateral surface of the package body and the lateral surface of the substrate, and electrically connected to the grounding layer, wherein a bottom surface of the shielding layer is separated from the bottom surface of the substrate.

2. The semiconductor package according to claim 1, wherein the grounding trace extends from the grounding layer to the lateral surface of the substrate.

3. The semiconductor package according to claim 1, further comprising:

a plurality of grounding layers buried in the substrate.

4. The semiconductor package according to claim 1, wherein a horizontal area of the grounding layer is 5% to 50% of a horizontal area of the substrate.

5. The semiconductor package according to claim 1, wherein a vertical thickness of the grounding layer is between 5 micrometers and 50 micrometers.

6. A semiconductor package, comprising:

a substrate including a lateral surface;

a grounding layer included in the substrate, the grounding layer extending horizontally and being separated from the lateral surface of the substrate;

a grounding trace included in the substrate, and extending from the grounding layer to the lateral surface of the substrate to be exposed on the lateral surface of the substrate, wherein a width of the grounding trace is smaller than a width of the grounding layer;

a chip arranged on the substrate;

a package body enveloping the chip and including a lateral surface; and

a shielding layer covering the lateral surface of the package body, the lateral surface of the substrate, and the exposed grounding trace.

7. The semiconductor package according to claim 6, wherein the substrate has a bottom surface, and the grounding layer is formed on the bottom surface of the substrate.

8. The semiconductor package according to claim 6, wherein the grounding layer is buried in the substrate.

9. The semiconductor package according to claim 6, wherein the grounding trace includes a lateral surface exposed on the lateral surface of the substrate, and the lateral surface of the package body, the lateral surface of the substrate, and the lateral surface of the grounding trace are aligned.

10. The semiconductor package according to claim 6, further comprising:

a plurality of grounding layers included in the substrate; and

a plurality of grounding traces included in the substrate, each grounding trace extends from a corresponding grounding layer to the lateral surface of the substrate.

11. The semiconductor package according to claim 6, wherein a sum of horizontal areas of the grounding layer and the grounding trace is 5% to 50% of a horizontal area of the substrate.

12. The semiconductor package according to claim 6, wherein a vertical thickness of each of the grounding layer and the grounding trace is between 5 micrometers and 50 micrometers.

13. The semiconductor package according to claim 6, wherein the grounding layer includes a lateral surface exposed on the lateral surface of the substrate, and the lateral surface of the package body, the lateral surface of the substrate, and the lateral surface of the grounding layer are aligned.

14. A semiconductor package, comprising:

a substrate;

a plurality of grounding layers in the substrate;

a chip positioned on the substrate and electrically connected to the substrate;

a package body encapsulating the chip and the substrate, the package body having a top surface and a plurality of side surfaces; and

a shielding layer covering the top surface of the package body and extending down each side surface of the package body;

wherein the shielding layer physically contacts a first one of the plurality of grounding layers and electrically connects to a second one of the plurality of grounding layers; and

wherein a third one of the plurality of grounding layers is formed on an upper surface of the substrate.

15. The semiconductor package according to claim 14, wherein the third one of the plurality of grounding layers physically contacts the shielding layer at a side surface of the package body.

16. The semiconductor package according to claim 14, further comprising at least one trace physically connected between the third one of the plurality of grounding layers and the shielding layer.

17. The semiconductor package according to claim 14, further comprising a plurality of electrical contact pads formed on the bottom surface of the substrate, wherein the semiconductor package is a land grid array package, and the second one of the plurality of grounding layers is formed on a bottom surface of the substrate.