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Millimeter wave wafer level chip scale packaging (WLCSP) device

  • US 9,236,361 B2
  • Filed: 10/21/2014
  • Issued: 01/12/2016
  • Est. Priority Date: 02/21/2013
  • Status: Active Grant
First Claim
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1. A wafer level chip scale package (WLCSP) structure comprising:

  • a printed circuit board (PCB) trace connection including at least one ground connection connected with a PCB ground plane;

    a set of ground pillars each contacting the printed circuit board trace connection;

    a set of chip pads contacting each of the ground pillars in the set of ground pillars;

    a chip ground plane connecting the set of chip pads; and

    a signal interconnect interposed between two of the set of ground pillars, the signal interconnect including;

    a signal trace connection electrically isolated from the PCB ground plane,wherein the signal trace connection electrically isolated from the PCB ground plane includes a conductive strip which forms a microstrip line with the PCB ground plane for carrying a signal;

    a signal pillar contacting the signal trace connection,wherein a size of the signal pillar controls an amount of signal loss in the WLSCP structure;

    a chip pad contacting the signal pillar; and

    a signal trace connection on a chip contacting the chip pad.

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